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199 条记录 (耗时 0.019 秒)

    Backlight module
    2.
    发明申请
    Backlight module 有权
    背光模组

    公开(公告)号：US20060215387A1

    公开(公告)日：2006-09-28

    申请号：US11088791

    申请日：2005-03-25

    申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

    发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

    IPC分类号： G01D11/28

    CPC分类号： G02B6/0018 ,  G02B6/005 ,  G02B6/0083 ,  G02F1/133615

    摘要： A backlight module arranged under a flat display includes a printed circuit board being parallel to the flat display and including a plurality of LEDs, a reflection portion being a reflection wall bent from a fringe of the LEDs to extend over the LEDs, and a guide light plate being parallel to the printed circuit board. The reflection portion includes an orientation wall parallel to the reflection wall and an outlet with a direction parallel to the printed circuit board. The guide light plate has an end connecting inside the outlet of the reflection portion, a light delivering surface adjacent to the flat display, and a reflection surface arranged at a bottom thereof.

    摘要翻译： 布置在平坦显示器下方的背光模块包括平行于平面显示器并包括多个LED的印刷电路板，反射部分是从LED的边缘弯曲以在LED上延伸的反射壁，以及引导光 板平行于印刷电路板。 反射部分包括平行于反射壁的定向壁和具有平行于印刷电路板的方向的出口。 引导光板具有连接在反射部分的出口内部的端部，与平面显示器相邻的光输送表面和布置在其底部的反射表面。

    White light emitting diode light source and method for manufacturing the same
    3.
    发明申请
    White light emitting diode light source and method for manufacturing the same 审中-公开
    白光发光二极管光源及其制造方法

    公开(公告)号：US20050264173A1

    公开(公告)日：2005-12-01

    申请号：US10855419

    申请日：2004-05-28

    申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

    发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

    IPC分类号： C09K11/77 ,  H01L33/50 ,  H05B33/00 ,  H05B33/14

    CPC分类号： C09K11/7731 ,  C09K11/7721 ,  C09K11/7734 ,  H01L25/0753 ,  H01L33/502 ,  H01L2924/0002 ,  H05B33/14 ,  Y02B20/181 ,  H01L2924/00

    摘要： A while light emitting diode light source and method for manufacturing the same are proposed. The while light emitting diode light source has a printed circuit board, and a plurality of LED units on one face of the PCB, each of the LED units comprising a substrate, a blue LED on the substrate and a red-green-yellow phosphor mixture enclosing the blue LED. The red-green-yellow phosphor mixture is a mixture of a red phosphor, a green phosphor and a yellow phosphor. The red phosphor is CaS:Eu or SrS:Eu. The green phosphor is SrGa2S4:Eu or Ca8EuMnMg(SiO4)4C12. The yellow phosphor is YAG:Ce or ThAG:Ce. The light emitted from the phosphors are mixed with blue light into white light with a satisfactory color rendering property.

    摘要翻译： 提出一种发光二极管光源及其制造方法。 同时发光二极管光源具有印刷电路板和PCB的一个面上的多个LED单元，每个LED单元包括基板，基板上的蓝色LED和红 - 绿 - 黄色荧光体混合物 封闭蓝色LED。 红绿色荧光体混合物是红色荧光体，绿色荧光体和黄色荧光体的混合物。 红色荧光体为CaS：Eu或SrS：Eu。 绿色荧光体是SrGa 2 S 4：Eu或Ca 8 O 5 MnMg（SiO 4）4 12 。 黄色荧光体是YAG：Ce或ThAG：Ce。 从荧光体发射的光与蓝色光混合，成为具有令人满意的显色性的白光。

    White light-emitting device
    5.
    发明申请
    White light-emitting device 审中-公开
    白色发光装置

    公开(公告)号：US20050236958A1

    公开(公告)日：2005-10-27

    申请号：US10830009

    申请日：2004-04-23

    申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Yu

    发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Chih Yu

    IPC分类号： C09K11/77 ,  H01L33/50 ,  H05B33/00

    CPC分类号： C09K11/7734 ,  C09K11/7731 ,  H01L33/502 ,  H01L33/504 ,  Y02B20/181

    摘要： A white light source has a substrate with a blue light-emitting diode placed thereon and a phosphor mixture coated on the blue light-emitting diode and made of a red phosphor, a green phosphor and a yellow phosphor. The red phosphor can be CaS:Eu or SrS:Eu; the green phosphor can be SrGa2S4:Eu or Ca8EuMnMg(SiO4)4C12; and the yellow phosphor can be YAG:Ce or ThAG:Ce. The red phosphor, the green phosphor and the yellow phosphor emit, respectively, red light, green light and yellow light after receiving blue light from the blue light-emitting diode to mix a white light with a good color-rendering property.

    摘要翻译： 白色光源具有放置在其上的蓝色发光二极管的基板和涂布在蓝色发光二极管上并由红色荧光体，绿色荧光体和黄色荧光体构成的荧光体混合物。 红色荧光体可以是CaS：Eu或SrS：Eu; 绿色荧光体可以是SrGa 2 S 4：Eu或Ca 8 O 5 MnMg（SiO 4） 4 12 黄色荧光体可以是YAG：Ce或ThAG：Ce。 在从蓝色发光二极管接收蓝光后，红色荧光体，绿色荧光体和黄色荧光体分别发出红色光，绿色光和黄色光，以混合具有良好显色性能的白色光。

    LED packaging structure
    9.
    发明授权
    LED packaging structure 有权
    LED封装结构

    公开(公告)号：US07049639B2

    公开(公告)日：2006-05-23

    申请号：US10855417

    申请日：2004-05-28

    申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

    发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

    摘要： An LED packaging structure has a substrate having two holes formed thereon. One of two conductive elements extends through the two holes to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the holes to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

    摘要翻译： LED封装结构具有形成有两个孔的基板。 两个导电元件中的一个延伸穿过两个孔，以电连接到衬底的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过孔连接到导电条和 上，下表面上的第二电极焊盘。 发光芯片电连接到导电焊盘和导电条。 发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。

    LED packaging structure
    10.
    发明申请
    LED packaging structure 有权
    LED封装结构

    公开(公告)号：US20050274957A1

    公开(公告)日：2005-12-15

    申请号：US10855417

    申请日：2004-05-28

    申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

    发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin ,  Heng-Yen Lee

    IPC分类号： H01L27/15 ,  H01L33/48 ,  H01L33/62 ,  H05K3/34

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

    摘要： An LED packaging structure has a substrate having two drills formed thereon. One of two conductive elements extends through the two drills to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the drills to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

    摘要翻译： LED封装结构具有形成有两个钻头的基板。 两个导电元件中的一个延伸穿过两个钻头，以电连接到基板的上表面和下表面上的导电焊盘和第一电极焊盘，并且两个导电元件中的另一个延伸穿过钻头以连接到导电条和 上，下表面上的第二电极焊盘。 发光芯片电连接到导电焊盘和导电条。 发光芯片由衬底上的保护胶体封装，从而使LED封装结构容易制造，并避免相邻LED封装结构之间的导体材料之间的接触导致短路。