-
公开(公告)号：US10074716B2
公开(公告)日：2018-09-11
申请号：US14875176
申请日：2015-10-05
IPC分类号： H01L21/70 , H01L29/06 , H01L21/265 , H01L21/761 , H01L21/762 , H01L21/763 , H01L21/8234 , H01L21/8238
CPC分类号： H01L29/0646 , H01L21/26513 , H01L21/761 , H01L21/76224 , H01L21/76237 , H01L21/76243 , H01L21/76267 , H01L21/763 , H01L21/823481 , H01L21/823878 , H01L21/823892 , H01L29/0649 , H01L2924/0002 , H01L2924/00
摘要： An isolation structure formed in a semiconductor substrate of a first conductivity type includes a region of a second conductivity type opposite to the first conductivity type. The region of the second conductivity type is saucer-shaped and has a floor portion substantially parallel to the top surface of the substrate and a sloped sidewall portion. The sloped sidewall portion extends downward from the top surface of the substrate at an oblique angle and merges with the floor portion. The floor portion and the sloped sidewall portion together form an isolated pocket of the substrate.
-
公开(公告)号：US09622310B2
公开(公告)日：2017-04-11
申请号：US15072642
申请日：2016-03-17
CPC分类号： H05B33/083 , H05B33/0815 , H05B33/0827 , H05B33/086 , H05B37/0254 , Y02B20/32
摘要： According to one aspect, an integrated circuit to control a power supply that supplies power to a plurality of light-emitting diode (LED) strings is provided. The integrated circuit includes an interface circuit to couple to a plurality of serial shift registers that are coupled in a daisy chain. The interface circuit may be configured to receive a plurality of digital values from the plurality of serial shift registers each corresponding to a voltage level at one end of an LED string of the plurality of LED strings and identify a lowest digital value from the plurality of digital values. The integrated circuit may further includes a converter coupled to the interface circuit that is configured to convert the lowest digital value into a control signal and provide the control signal to the power supply to adjust an output voltage of the power supply.
-
13.发明授权Controlling an LED string using a current sink with low side voltage regulation 有权使用低侧电压调节的电流吸收器控制LED串公开(公告)号：US09544954B2
公开(公告)日：2017-01-10
申请号：US14328936
申请日：2014-07-11
发明人： Kevin D'Angelo , Andrew Whyte , Gustavo Mehas
IPC分类号： H05B33/08
CPC分类号： H05B33/0815 , H05B33/0812 , H05B33/0848
摘要： A method of controlling an LED string having a first end coupled to a power source and a second end coupled to a first end of a current sink is provided. The method include generating a target voltage at a first end of an external inductor coupled to the second end of the current sink, comparing the target voltage to a measured voltage at the first end of the external inductor, charging the external inductor responsive to the measured voltage being greater than the target voltage, and discharging the external inductor responsive to the measured voltage being less than the target voltage.
摘要翻译： 提供了一种控制LED串的方法，其具有耦合到电源的第一端和耦合到电流汇的第一端的第二端。 该方法包括在耦合到电流吸收器的第二端的外部电感器的第一端产生目标电压，将目标电压与在外部电感器的第一端处的测量电压进行比较，对外部电感器进行充电，响应于所测量的 电压大于目标电压，并且响应于测量的电压小于目标电压，对外部电感器进行放电。
-
公开(公告)号：US09429965B2
公开(公告)日：2016-08-30
申请号：US12611853
申请日：2009-11-03
CPC分类号： H05B33/0815 , G05F1/461 , G05F1/565 , H02M3/04 , H05B33/0827 , H05B33/0845
摘要： A multiple chip voltage feedback technique allows multiple strings of LED's and current sinks to be efficiently powered by a DC-to-DC voltage converter within an appliance. A connected series of differential amplifiers or multiplexers are used to monitor the voltages between the connected LED's and the current sinks, progressively determine the lowest voltage, and then feed the lowest voltage back to the voltage converter. The DC-to-DC voltage converter monitors this lowest voltage and adjusts its output in order to ensure that the strings have adequate voltage with which to function, even as the LED's have different forward voltages and the strings are asynchronously enabled and disabled.
摘要翻译： 多芯片电压反馈技术允许多个LED串和电流吸收器由设备内的DC-DC电压转换器有效地供电。 使用连接的差分放大器或多路复用器系列来监视连接的LED和电流吸收器之间的电压，逐渐确定最低电压，然后将最低电压馈送到电压转换器。 DC-DC电压转换器监控这个最低电压并调整其输出，以确保串具有足够的电压，即使LED具有不同的正向电压，并且串是异步启用和禁用的。
-
公开(公告)号：US09295123B2
公开(公告)日：2016-03-22
申请号：US13347668
申请日：2012-01-10
CPC分类号： H05B33/083 , H05B33/0815 , H05B33/0827 , H05B33/086 , H05B37/0254 , Y02B20/32
摘要： A system for controlling multiple strings of LEDs includes a group of LED driver IC's, each of which includes a current sense feedback (CSFB) sample latch for storing a digital representation of the forward-voltage drop across a controlled LED string. Each CSFB latch is coupled to a register within a serial lighting interface (SLI) bus that both originates and terminates at an interface IC. As the data on the SLI bus is shifted into the interface IC, the interface IC selects the CSFB word that represents the highest forward-voltage drop of any of the controlled LED strings, which is then used by the interface IC to generate a CSFB signal for setting the appropriate supply voltage for the controlled LED strings.
摘要翻译： 用于控制多串LED的系统包括一组LED驱动器IC，每组LED驱动器IC包括用于存储跨受控LED串的正向压降的数字表示的电流检测反馈（CSFB）采样锁存器。 每个CSFB锁存器耦合到串行照明接口（SLI）总线中的寄存器，两者都在接口IC处发起并终止。 随着SLI总线上的数据被转移到接口IC中，接口IC选择表示任何受控LED串的最高正向压降的CSFB字，然后由接口IC用于产生一个CSFB信号 用于设置受控LED串的适当电源电压。
-
公开(公告)号：US09257504B2
公开(公告)日：2016-02-09
申请号：US14281075
申请日：2014-05-19
IPC分类号： H01L21/70 , H01L29/06 , H01L21/265 , H01L21/761 , H01L21/762 , H01L21/763 , H01L21/8234 , H01L21/8238
CPC分类号： H01L29/0646 , H01L21/26513 , H01L21/761 , H01L21/76224 , H01L21/76237 , H01L21/76243 , H01L21/76267 , H01L21/763 , H01L21/823481 , H01L21/823878 , H01L21/823892 , H01L29/0649 , H01L2924/0002 , H01L2924/00
摘要： Isolation structures for isolating semiconductor devices from a substrate include floor isolation regions buried within the substrate and one or more trenches extending from a surface of the substrate to the buried floor isolation region.
摘要翻译： 用于从衬底隔离半导体器件的隔离结构包括掩埋在衬底内的底部隔离区域和从衬底的表面延伸到掩埋地板隔离区域的一个或多个沟槽。
-
公开(公告)号：US20140333272A1
公开(公告)日：2014-11-13
申请号：US14340292
申请日：2014-07-24
发明人： Kevin D'Angelo , Robert Wrathall
IPC分类号： H02M3/156
CPC分类号： H02M3/156 , H02M1/08 , H02M3/1588 , Y02B70/1466
摘要： A switching regulator that includes a high-side MOSFET, a low-side MOSFET, a high-side driver circuit, a low-side driver circuit, and a capacitive coupling circuit. An output of the high-side driver circuit is coupled to a gate of the high-side MOSFET to control the high-side MOSFET to be substantially depleted during a first operational phase and to be substantially enhanced during a second operational phase. An output of the low-side driver circuit is coupled to a gate of the low-side MOSFET to control the low-side MOSFET to be substantially enhanced during the first operational phase and to provide a regulated drain-to-source current during the second operational phase. The capacitive coupling circuit is coupled to an input of the high-side driver circuit and the gate of the low-side MOSFET and decreases the regulated drain-to-source current during a transition from the first operational phase to the second operational phase.
摘要翻译： 一种开关稳压器，包括高边MOSFET，低端MOSFET，高侧驱动电路，低侧驱动电路和电容耦合电路。 高侧驱动电路的输出耦合到高侧MOSFET的栅极，以控制高边MOSFET在第一操作阶段期间基本上耗尽，并且在第二操作阶段期间将显着增强。 低侧驱动电路的输出耦合到低侧MOSFET的栅极，以在第一操作阶段期间基本上增强低边MOSFET的控制，并且在第二操作阶段期间提供稳定的漏极 - 源极电流 操作阶段 电容耦合电路耦合到高侧驱动电路的输入端和低侧MOSFET的栅极，并且在从第一操作阶段到第二操作阶段的转变期间减小了调节的漏极 - 源极电流。
-
公开(公告)号：US08659116B2
公开(公告)日：2014-02-25
申请号：US12658020
申请日：2010-02-01
IPC分类号： H01L21/70
CPC分类号： H01L29/0638 , H01L21/26586 , H01L29/0615 , H01L29/0626 , H01L29/063 , H01L29/0653 , H01L29/0661 , H01L29/086 , H01L29/1045 , H01L29/105 , H01L29/1083 , H01L29/1087 , H01L29/41766 , H01L29/7809 , H01L29/7811 , H01L29/7835 , H01L29/808 , H01L29/8613 , H01L29/866 , H01L2924/0002 , H01L2924/00
摘要： A transistor is formed inside an isolation structure which includes a floor isolation region and a trench extending from the surface of the substrate to the floor isolation region. The trench may be filled with a dielectric material or may have a conductive material in a central portion with a dielectric layer lining the walls of the trench.
-
19.发明申请Process For Fabricating Multi-Die Semiconductor Package With One Or More Embedded Die Pads 有权用于制造具有一个或多个嵌入式模块的多芯片半导体封装的工艺公开(公告)号：US20130252377A1
公开(公告)日：2013-09-26
申请号：US13897423
申请日：2013-05-19
申请人： Richard K. Williams , Keng Hung Lin
发明人： Richard K. Williams , Keng Hung Lin
IPC分类号： H01L25/00
CPC分类号： H01L25/50 , H01L23/49503 , H01L23/49551 , H01L23/49568 , H01L23/49575 , H01L24/48 , H01L24/85 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12033 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： To avoid shorts between adjacent die pads in mounting, a multi-die semiconductor package to a printed circuit board (PCB), one of the die pads is embedded in the polymer capsule, while the other die pad is exposed at the bottom of the package to provide a thermal escape path to the PCB. This arrangement is particularly useful when one of the dice in a multi-die package generates more heat than another die in the package. A process for fabricating the package includes a partial etch that defines the bottom surface of the embedded die pad and may include a through-etch that leaves one or more of the contacts or leads integrally connected to the embedded die pad.
摘要翻译： 为了避免安装中的相邻裸片焊盘之间的短路，将多芯片半导体封装到印刷电路板（PCB）中，其中一个裸片焊盘嵌入聚合物胶囊中，而另一个芯片焊盘暴露在封装的底部 以提供到PCB的热逸散路径。 当多芯片封装中的一个芯片产生比封装中的另一个裸片更多的热量时，这种布置是特别有用的。 用于制造封装的工艺包括限定嵌入式裸片焊盘的底表面的部分蚀刻，并且可以包括使整个连接到嵌入式裸片焊盘的触点或引线中的一个或多个的贯穿蚀刻。
-
20.发明授权公开(公告)号：US08531164B2
公开(公告)日：2013-09-10
申请号：US13079734
申请日：2011-04-04
申请人： Kevin D'Angelo
发明人： Kevin D'Angelo
CPC分类号： G05F1/46 , H02M3/156 , H05B33/0815 , H05B33/0827 , H05B33/0848
摘要： An operational transconductance amplifier used in conjunction with a multiple chip voltage feedback technique allows multiple strings of LEDs and current sinks to be efficiently powered by a simple feedback oriented voltage regulator within an appliance. A connected series of differential amplifiers or multiplexors are used to monitor the voltages between the connected LEDs and the current sinks, in order to progressively determine the lowest voltage. The operational transconductance amplifier compares this voltage to a reference voltage and injects or removes current from the feedback node of a voltage regulator, thereby altering the voltage present at the feedback node. This causes the voltage regulator to adjust its output, ensuring that the current sinks of the LED strings have adequate voltage with which to function, even as the LEDs have different forward voltages and the strings are asynchronously enabled and disabled.
-
-
-
-
-
-
-
-
-
搜索结果
56 条记录 (耗时 0.042 秒)
