公开(公告)号：US20230079355A1

公开(公告)日：2023-03-16

申请号：US17987280

申请日：2022-11-15

申请人： STMicroelectronics SA ,  STMicroelectronics, Inc. ,  STMicroelectronics (Research & Development) Limited

发明人： Darin K. Winterton ,  Donald Baxter ,  Andrew Hodgson ,  Gordon Lunn ,  Olivier Pothier ,  Kalyan-Kumar Vadlamudi-Reddy

IPC分类号： H04N5/232

摘要： A method includes dividing a field of view into a plurality of zones and sampling the field of view to generate a photon count for each zone of the plurality of zones, identifying a focal sector of the field of view and analyzing each zone to select a final focal object from a first prospective focal object and a second prospective focal object.

公开(公告)号：US20230018529A1

公开(公告)日：2023-01-19

申请号：US17948961

申请日：2022-09-20

申请人： STMICROELECTRONICS, INC.

发明人： John H. ZHANG

IPC分类号： H01L29/51 ,  H01L21/02 ,  H01L21/28 ,  H01L29/45 ,  H01L29/49 ,  H01L21/8234 ,  H01L21/8238 ,  H01L21/285 ,  H01L21/768 ,  C23C14/04 ,  C23C14/22

摘要： Energy bands of a thin film containing molecular clusters are tuned by controlling the size and the charge of the clusters during thin film deposition. Using atomic layer deposition, an ionic cluster film is formed in the gate region of a nanometer-scale transistor to adjust the threshold voltage, and a neutral cluster film is formed in the source and drain regions to adjust contact resistance. A work function semiconductor material such as a silver bromide or a lanthanum oxide is deposited so as to include clusters of different sizes such as dimers, trimers, and tetramers, formed from isolated monomers. A type of Atomic Layer Deposition system is used to deposit on semiconductor wafers molecular clusters to form thin film junctions having selected energy gaps. A beam of ions contains different ionic clusters which are then selected for deposition by passing the beam through a filter in which different apertures select clusters based on size and orientation.

公开(公告)号：US11552007B2

公开(公告)日：2023-01-10

申请号：US17185742

申请日：2021-02-25

申请人： STMicroelectronics, Inc.

发明人： Rennier Rodriguez ,  Aiza Marie Agudon ,  Jefferson Talledo ,  Moonlord Manalo ,  Ela Mia Cadag ,  Rammil Seguido

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

摘要： The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of coupling a semiconductor die to the leadframe. The recess extends beneath an edge of the semiconductor die so that any tendency of the glue to adhere to the semiconductor die is counteracted by a tendency of the glue to adhere to a wall of the recess and at least partially fill the volume of the recess. In addition, the recess for collecting adhesive may also form a mold lock on an edge of the leadframe, the mold lock providing a more durable connection between the leadframe and an encapsulant during physical and temperature stresses.

公开(公告)号：US20220333912A1

公开(公告)日：2022-10-20

申请号：US17856586

申请日：2022-07-01

申请人： STMICROELECTRONICS, INC.

发明人： Arnaud DELEULE ,  John E. KVAM ,  Kalyan-Kumar VADLAMUDI-REDDY

IPC分类号： G01B11/02 ,  G01C3/02 ,  H04N5/232 ,  G06T7/521 ,  G01S17/00 ,  G01S17/89 ,  G06V40/16

摘要： The present disclosure is directed to a system and method of controlling a facial recognition process by validating preconditions with a ranging sensor. The ranging sensor transmits a ranging signal that is reflected off of a user's face and received back at the ranging sensor. The received ranging signal can be used to determine distance between the user's face and the mobile device or to determine the reflectivity of the user's face. Comparing the distance to a range of distances corresponding to normal operation of the device or normal reflectivities associated with human skin tones can reduce the number of false positive activations of the facial recognition process. Furthermore, a multiple zone ranging sensor can produce a face depth map that can be compared to a stored face depth map or can produce a reflectivity map that can be compared to a stored face reflectivity map to further increase power efficiency and device security.

公开(公告)号：US20220237259A1

公开(公告)日：2022-07-28

申请号：US17161291

申请日：2021-01-28

申请人： STMicroelectronics, Inc.

发明人： Andrea Lorenzo Vitali

IPC分类号： G06F17/14

摘要： A method of operating a microcontroller to perform a Fast Fourier Transform, the method including receiving, by the microcontroller, N samples from a signal; and performing, by the microcontroller, a first butterfly operation of the Fast Fourier Transform before all of the N samples have been received from the signal, based on the performing of the first butterfly operation, the microcontroller performs the Fast Fourier Transform at a higher performance to power efficiency than a Fast Fourier Transform operation that begins after all of the N samples are received.

公开(公告)号：US11355423B2

公开(公告)日：2022-06-07

申请号：US16584405

申请日：2019-09-26

申请人： STMICROELECTRONICS, INC.

发明人： Aaron Cadag ,  Frederick Arellano ,  Ernesto Antilano, Jr.

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  B81B7/00 ,  B81C1/00

摘要： A MEMS pressure sensor packaged with a molding compound. The MEMS pressure sensor features a lead frame, a MEMS semiconductor die, a second semiconductor die, multiple pluralities of bonding wires, and a molding compound. The MEMS semiconductor die has an internal chamber, a sensing component, and apertures. The MEMS semiconductor die and the apertures are exposed to an ambient atmosphere. A method is desired to form a MEMS pressure sensor package that reduces defects caused by mold flashing and die cracking. Fabrication of the MEMS pressure sensor package comprises placing a lead frame on a lead frame tape; placing a MEMS semiconductor die adjacent to the lead frame and on the lead frame tape with the apertures facing the tape and being sealed thereby; attaching a second semiconductor die to the MEMS semiconductor die; attaching pluralities of bonding wires to form electrical connections between the MEMS semiconductor die, the second semiconductor die, and the lead frame; and forming a molding compound.

公开(公告)号：US20220140110A1

公开(公告)日：2022-05-05

申请号：US17574329

申请日：2022-01-12

申请人： STMICROELECTRONICS, INC.

发明人： John H. ZHANG

IPC分类号： H01L29/66 ,  H01L29/775 ,  H01L21/66 ,  H01L29/45 ,  H01L29/778 ,  H01L29/41 ,  H01L21/265 ,  H01L21/8238

摘要： Incorporation of metallic quantum dots (e.g., silver bromide (AgBr) films) into the source and drain regions of a MOSFET can assist in controlling the transistor performance by tuning the threshold voltage. If the silver bromide film is rich in bromine atoms, anion quantum dots are deposited, and the AgBr energy gap is altered so as to increase Vt. If the silver bromide film is rich in silver atoms, cation quantum dots are deposited, and the AgBr energy gap is altered so as to decrease Vt. Atomic layer deposition (ALD) of neutral quantum dots of different sizes also varies Vt. Use of a mass spectrometer during film deposition can assist in varying the composition of the quantum dot film. The metallic quantum dots can be incorporated into ion-doped source and drain regions. Alternatively, the metallic quantum dots can be incorporated into epitaxially doped source and drain regions.

公开(公告)号：US11320452B2

公开(公告)日：2022-05-03

申请号：US16452904

申请日：2019-06-26

申请人： STMicroelectronics, Inc. ,  STMicroelectronics S.r.l.

发明人： Yamu Hu ,  David McClure ,  Alessandro Tocchio ,  Naren K. Sahoo ,  Anthony Junior Casillan

IPC分类号： G01P21/00 ,  G01P15/08

摘要： A microelectromechanical system (MEMS) accelerometer sensor has a mobile mass and a sensing capacitor. To self-test the sensor, a test signal is applied to the sensing capacitor during a reset phase of a sensing circuit coupled to the sensing capacitor. The test signal is configured to cause an electrostatic force which produces a physical displacement of the mobile mass corresponding to a desired acceleration value. Then, during a read phase of the sensing circuit, a variation in capacitance of sensing capacitor due to the physical displacement of the mobile mass is sensed. This sensed variation in capacitance is converted to a sensed acceleration value. A comparison of the sensed acceleration value to the desired acceleration value provides an indication of an error in operation of the MEMS accelerometer sensor if the sensed acceleration value and desired acceleration value are not substantially equal.

公开(公告)号：US11308979B2

公开(公告)日：2022-04-19

申请号：US17158817

申请日：2021-01-26

申请人： STMicroelectronics, Inc. ,  STMicroelectronics International N.V.

发明人： Mahesh Chowdhary ,  Arun Kumar ,  Ghanapriya Singh ,  Rajendar Bahl

IPC分类号： H04R3/00 ,  G10L25/51 ,  G10L25/21 ,  G10L25/24 ,  H04R1/40

摘要： A method and apparatus for classifying a spatial environment as open or enclosed are provided. In the method and apparatus, one or more microphones detect ambient sound in a spatial environment and output an audio signal representative of the ambient sound. A processor determines a spatial environment impulse response (SEIR) for the audio signal and extracts one or more features of the SEIR. The processor classifies the spatial environment as open or enclosed based on the one or more features of the SEIR.

公开(公告)号：US20220102166A1

公开(公告)日：2022-03-31

申请号：US17546960

申请日：2021-12-09

申请人： STMicroelectronics, Inc.

发明人： Jefferson Talledo ,  Frederick Ray Gomez

IPC分类号： H01L21/48 ,  H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H01L23/495 ,  H01L21/54 ,  H01L21/78

摘要： Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.