公开(公告)号：US07768620B2

公开(公告)日：2010-08-03

申请号：US11560616

申请日：2006-11-16

Applicant: Jeong-ho Hwang ,  Ho-min Kang ,  Hee-young Park ,  Byoung-hun Lee ,  Seung-jun Lee ,  Sung-teak Choi

Inventor： Jeong-ho Hwang ,  Ho-min Kang ,  Hee-young Park ,  Byoung-hun Lee ,  Seung-jun Lee ,  Sung-teak Choi

IPC: G02F1/13 ,  G02F1/1335

CPC classification number: G02F1/133351 ,  G02F2202/28

Abstract: A method of fabricating a light weight and small size LCD, and an LCD fabricated by the same. The method of fabricating an LCD includes providing assembled mother substrates, wherein at least one of the mother substrates includes a polarizer, a buffer layer, and a transparent film sequentially stacked on an out-side thereof, and fabricating the assembled mother substrates as individual units by cutting the assembled mother substrates into unit cells.

Abstract translation: 一种制造重量轻且尺寸小的LCD的方法，以及由其制造的LCD。 制造LCD的方法包括提供组装母基板，其中至少一个母基板包括顺序地层叠在其外侧的偏振器，缓冲层和透明膜，并且将组装的母板作为单独单元 通过将组装的母基板切割成单元电池。

公开(公告)号：US20090039441A1

公开(公告)日：2009-02-12

申请号：US11837161

申请日：2007-08-10

Applicant: Hongfa Luna ,  Kisik Choi ,  Prashant Majhi ,  Husam Alshareef ,  Huang-Chun Wen ,  Rusty Harris ,  Byoung Hun Lee

Inventor： Hongfa Luna ,  Kisik Choi ,  Prashant Majhi ,  Husam Alshareef ,  Huang-Chun Wen ,  Rusty Harris ,  Byoung Hun Lee

IPC: H01L27/08 ,  H01L21/8238

CPC classification number: H01L21/823842 ,  H01L27/0922 ,  H01L29/4966 ,  H01L29/517

Abstract: Devices comprising, and method for fabricating, a MOSFET with a metal gate electrode are disclosed. In one embodiment, the MOSFET includes a first doped region configured to receive current from a current source, a second doped region configured to drain current from the first doped region when an electric field is modified between the first doped region and the second doped region, and a gate electrode configured to modify the electric field. The gate electrode may include a high-k layer, a hafnium-based metal layer formed above the high-k layer, and a polysilicon layer formed above the hafnium-based metal layer. In a further embodiment, the gate electrode further comprises a titanium-based metal layer formed between the hafnium-based metal layer and the polysilicon layer.

Abstract translation: 公开了包括用于制造具有金属栅电极的MOSFET的器件及其制造方法。 在一个实施例中，MOSFET包括被配置为从电流源接收电流的第一掺杂区域，被配置为当在第一掺杂区域和第二掺杂区域之间修改电场时从第一掺杂区域漏极电流的第二掺杂区域， 以及构造成修改电场的栅电极。 栅电极可以包括形成在高k层上方的高k层，铪基金属层和形成在铪基金属层上方的多晶硅层。 在另一实施例中，栅电极还包括在铪基金属层和多晶硅层之间形成的钛基金属层。

公开(公告)号：US20080100283A1

公开(公告)日：2008-05-01

申请号：US11552779

申请日：2006-10-25

Applicant: Kin P. Cheung ,  Dawei Heh ,  Byoung Hun Lee ,  Rino Choi

Inventor： Kin P. Cheung ,  Dawei Heh ,  Byoung Hun Lee ,  Rino Choi

IPC: G01R31/28

CPC classification number: G01R27/2605 ,  G01R31/2831

Abstract: Methods for determining capacitance values of a metal on semiconductor (MOS) structure are provided. A time domain reflectometry circuit may be loaded with a MOS structure. The MOS structure may be biased with various voltages, and reflectometry waveforms from the applied voltage may be collected. The capacitance of the MOS structure may be determined from the reflectometry waveforms.

Abstract translation: 提供了确定半导体（MOS）结构上的金属的电容值的方法。 时域反射测量电路可以装载MOS结构。 MOS结构可能被各种电压偏置，并且可以收集来自施加的电压的反射波形。 可以根据反射波形来确定MOS结构的电容。

公开(公告)号：US20070031997A1

公开(公告)日：2007-02-08

申请号：US11499370

申请日：2006-08-04

Applicant: Byoung-hun Lee ,  Ho-min Kang ,  Hoon-kee Min ,  Jeong-ho Hwang ,  Sung-min Kim

Inventor： Byoung-hun Lee ,  Ho-min Kang ,  Hoon-kee Min ,  Jeong-ho Hwang ,  Sung-min Kim

IPC: H01L21/00

CPC classification number: H01L21/67363

Abstract: Provided is a jig which can be used in a process of adhering a adhering object to a to-be adhered object in a vacuum atmosphere, and vacuum equipment for use in the adhering process. The jig includes a first frame and a second frame which together define a chamber for receiving the first and second objects. The first frame includes a seating portion having a plurality of seating pockets, and an actuator disposed below each of the seating pockets, the actuator being movable with respect to the seating pockets. A first elastic member is disposed in the jig below the actuator. The first elastic member being positioned such that it can contact and move the actuator in response to a change of pressure in the jig chamber. The second frame includes a second elastic member which is positioned adjacent to each of the seating pockets. The second elastic member being movable to the change of pressure in the jig chamber.

Abstract translation: 提供了一种夹具，其可用于在真空气氛中将粘附物粘附到待粘合物体的过程中，以及用于粘合过程的真空设备。 夹具包括第一框架和第二框架，第一框架和第二框架共同限定用于接收第一和第二物体的室。 第一框架包括具有多个座舱的座位部分和设置在每个座舱下方的致动器，所述致动器可相对于所述座舱口移动。 第一弹性构件设置在致动器下方的夹具中。 第一弹性构件被定位成使得其可以响应于夹具室中的压力变化而接触和移动致动器。 第二框架包括第二弹性构件，该第二弹性构件邻近每个座舱口定位。 第二弹性构件可移动到夹具室中的压力变化。

公开(公告)号：US20060197900A1

公开(公告)日：2006-09-07

申请号：US11367259

申请日：2006-03-03

Applicant: Mi-Sook Yim ,  Ho-Min Kang ,  Won-Gu Cho ,  Seung-Jun Lee ,  Hoon-Kee Min ,  Jeong-Ho Hwang ,  Byoung-Hun Lee

Inventor： Mi-Sook Yim ,  Ho-Min Kang ,  Won-Gu Cho ,  Seung-Jun Lee ,  Hoon-Kee Min ,  Jeong-Ho Hwang ,  Byoung-Hun Lee

IPC: G02F1/1345

CPC classification number: G02F1/13452

Abstract: A display device includes a display panel, a driving chip, and a non-conductive adhesive film. The display panel includes a pad member having a plurality of conductive pads. The driving chip includes a body and a plurality of bumps. The body has a driving circuit. The bumps are protruded from the body to make contact with the pads, respectively. The non-conductive adhesive film fixes the driving chip to the pad member. Therefore, a manufacturing cost is decreased, and a yield is increased.

Abstract translation: 显示装置包括显示面板，驱动芯片和非导电粘合膜。 显示面板包括具有多个导电焊盘的焊盘构件。 驱动芯片包括主体和多个凸块。 身体有一个驱动电路。 凸块从主体突出以分别与焊盘接触。 非导电粘合剂膜将驱动芯片固定到衬垫构件。 因此，制造成本降低，成品率提高。

公开(公告)号：US5863375A

公开(公告)日：1999-01-26

申请号：US067821

申请日：1998-04-28

Applicant: Gi-ho Cha ,  Byoung-hun Lee

Inventor： Gi-ho Cha ,  Byoung-hun Lee

IPC: H01L27/12 ,  B26D3/28 ,  B26F3/00 ,  B32B43/00 ,  H01L21/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/30 ,  H01L21/304 ,  H01L21/58 ,  B32B35/00

CPC classification number: B32B43/006 ,  B26D3/28 ,  B26F3/004 ,  H01L21/67092 ,  H01L24/98 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/32 ,  H01L24/83 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10S134/902 ,  Y10S156/941 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T156/19 ,  Y10T29/49819 ,  Y10T29/49822 ,  Y10T29/53683

Abstract: Wafer debonding of a bonded bulk wafer and a device wafer using a liquid jet to avoid scratching of the wafers is provided. The wafer debonder includes a wafer loader having a first stand with a flat upper surface and a second stand located above the first stand having a lower surface slanted with respect to the upper surface of the first stand at a predetermined angle. A first holder is connected to the first stand and a second holder is located on an imaginary surface extended from the lower surface of the second stand for holding the wafers. A liquid jetting nozzle is positioned adjacent the wafer loader to direct a jet of liquid at the interface between the wafers to separate the wafers.

Abstract translation: 提供了使用液体射流的粘合体晶片和器件晶片的晶片剥离以避免晶片的划伤。 晶片剥离器包括具有平坦的上表面的第一支架和位于第一支架上方的第二支架的晶片装载器，其具有相对于第一支架的上表面以预定角度倾斜的下表面。 第一保持器连接到第一支架，并且第二保持器位于从第二支架的下表面延伸的假想表面上，用于保持晶片。 液体喷射喷嘴位于晶片装载器附近，以在晶片之间的界面处引导液体射流以分离晶片。

公开(公告)号：US5783022A

公开(公告)日：1998-07-21

申请号：US742938

申请日：1996-10-31

Applicant: Gi-ho Cha ,  Byoung-hun Lee

Inventor： Gi-ho Cha ,  Byoung-hun Lee

IPC: H01L27/12 ,  B26D3/28 ,  B26F3/00 ,  B32B43/00 ,  H01L21/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/30 ,  H01L21/304 ,  H01L21/58 ,  B32B35/00

CPC classification number: B32B43/006 ,  B26D3/28 ,  B26F3/004 ,  H01L21/67092 ,  H01L24/98 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/32 ,  H01L24/83 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10S134/902 ,  Y10S156/941 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T156/19 ,  Y10T29/49819 ,  Y10T29/49822 ,  Y10T29/53683

Abstract: Wafer debonding of a bonded bulk wafer and a device wafer using a liquid jet to avoid scratching of the wafers is provided. The wafer debonder includes a wafer loader having a first stand with a flat upper surface and a second stand located above the first stand having a lower surface slanted with respect to the upper surface of the first stand at a predetermined angle. A first holder is connected to the first stand and a second holder is located on an imaginary surface extended from the lower surface of the second stand for holding the wafers. A liquid jetting nozzle is positioned adjacent the wafer loader to direct a jet of liquid at the interface between the wafers to separate the wafers.

公开(公告)号：US20060101633A1

公开(公告)日：2006-05-18

申请号：US11256564

申请日：2005-10-21

Applicant: Byoung-Hun Lee

Inventor： Byoung-Hun Lee

IPC: B25B27/14 ,  B23Q3/00

CPC classification number: G02F1/133308 ,  G02F1/1303 ,  Y10T29/49895 ,  Y10T29/53961

Abstract: A jig for manufacturing a display device is provided. In one embodiment, the jig includes a first hinge part for rotating a working plate to which a backlight assembly is fixed, and a second hinge part for rotating a cover to fix the backlight assembly to the working plate. A method of manufacturing a display device using the jig includes loading the backlight assembly on the working plate of the jig, installing a main panel on a main part of the backlight assembly, rotating the cover to fix the backlight assembly to the working plate, rotating the working plate, and installing a sub panel on a sub part of the backlight assembly. In various embodiments, use of the jig can provide improvements in assembly efficiency, reduced numbers of product defects, and improved production in the manufacture of display devices.

Abstract translation: 提供一种用于制造显示装置的夹具。 在一个实施例中，夹具包括用于旋转固定有背光组件的工作板的第一铰链部分和用于旋转盖以将背光组件固定到工作板的第二铰链部分。 使用夹具制造显示装置的方法包括将背光组件装载在夹具的工作板上，将主面板安装在背光组件的主要部分上，旋转盖子将背光组件固定到工作板上，旋转 工作板，以及将子面板安装在背光组件的子部分上。 在各种实施例中，夹具的使用可以提供组装效率的改进，减少产品缺陷的数量，以及在显示装置的制造中改进生产。