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公开(公告)号：US20140023430A1
公开(公告)日：2014-01-23
申请号：US13553728
申请日：2012-07-19
Applicant: Christopher D. Prest , Dale N. Memering , David A. Pakula , Fletcher Rothkopf , Matthew D. Hill , Stephen B. Lynch , Tang Yew Tan
Inventor： Christopher D. Prest , Dale N. Memering , David A. Pakula , Fletcher Rothkopf , Matthew D. Hill , Stephen B. Lynch , Tang Yew Tan
CPC classification number: B23K26/40 , B23K2103/50 , B29C48/002 , B29C48/0022 , B29C48/07 , B29K2995/0073 , B29L2031/3481 , Y10T156/10 , Y10T403/47
Abstract: Techniques for attachment of sapphire substrates with other materials and the resulting structures are provided. One embodiment may take the form of an attachment method including creating an aperture within a sapphire substrate and filling the aperture with an attachment material. The method also includes mechanically coupling a member to the sapphire substrate using the attachment material.
Abstract translation: 提供了将蓝宝石衬底与其他材料连接的技术以及所得到的结构。 一个实施例可以采取附接方法的形式，包括在蓝宝石衬底内创建孔并用附接材料填充孔。 该方法还包括使用附着材料将构件机械耦合到蓝宝石衬底。
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公开(公告)号：US20140009215A1
公开(公告)日：2014-01-09
申请号：US13541845
申请日：2012-07-05
Applicant: CHRISTOPHER D. PREST , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
Inventor： CHRISTOPHER D. PREST , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
CPC classification number: G06F3/044 , B32B2457/202 , C22C45/00 , H01B1/02 , H03K17/96
Abstract: Touch sensing systems comprising bulk-solidifying amorphous alloys and methods of making touch sensing arrays and electronic devices containing touch sensitive screens that include arrays containing bulk-solidifying amorphous alloys. The bulk-solidifying amorphous alloy substrates have select areas of crystalline and amorphous alloy providing for discrete areas of conductivity and resistivity.
Abstract translation: 触摸传感系统包括非晶合金的块状固化和制造触摸感测阵列的方法以及包含含有块状固化非晶态合金的阵列的触摸屏的电子装置。 本体固化的非晶合金基底具有晶体和非晶合金的选择区域，其提供了导电性和电阻率的离散区域。
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公开(公告)号：US20140008999A1
公开(公告)日：2014-01-09
申请号：US13541576
申请日：2012-07-03
Applicant: Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole , Theodore A. Waniuk
Inventor： Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole , Theodore A. Waniuk
CPC classification number: G01L1/22 , H01H2211/032 , H03K17/965 , H03K2217/96062 , H03K2217/9651 , Y10T307/786
Abstract: Pressure sensing systems comprising bulk-solidifying amorphous alloys and pressure-sensitive switches containing bulk-solidifying amorphous alloys. The bulk-solidifying amorphous alloys are capable of repeated deformation upon application of pressure, and change their electrical resistivity upon deformation, thereby enabling measurement of the change in resistivity and consequently, measuring the deformation and amount of pressure applied.
Abstract translation: 压力感测系统包括固体非晶态合金和包含块状固化非晶合金的压敏开关。 体积固化的非晶合金在施加压力时能够重复变形，并且在变形时改变其电阻率，从而能够测量电阻率的变化，并因此测量施加的压力的变形和量。
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公开(公告)号：US20140007983A1
公开(公告)日：2014-01-09
申请号：US13541550
申请日：2012-07-03
Applicant: CHRISTOPHER D. PREST , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
Inventor： CHRISTOPHER D. PREST , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
CPC classification number: C22C1/08 , B22D19/00 , B22D19/0081 , B22D19/16 , B22D21/005 , B22D25/005 , B22D29/002 , B32B5/18 , B32B15/01 , B32B2266/045 , C22C1/002 , C22C33/003 , C22C45/001 , C22C45/003 , C22C45/02 , C22C45/10 , Y10T428/12479
Abstract: Provided in one embodiment is a method of making use of foams as a processing aid or to improve the properties of bulk-solidifying amorphous alloy materials. Other embodiments include the bulk-solidifying amorphous alloy/foam composite materials made in accordance with the methods.
Abstract translation: 在一个实施方案中提供了使用泡沫作为加工助剂或改善非晶合金材料块状固化性能的方法。 其他实施方案包括根据该方法制备的体固固化非晶合金/泡沫复合材料。
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公开(公告)号：US20130333165A1
公开(公告)日：2013-12-19
申请号：US13525553
申请日：2012-06-18
Applicant: Christopher D. PREST , Matthew S. SCOTT , Stephen P. ZADESKY , Richard W. HELEY , Dermot J. STRATTON , Joseph C. POOLE
Inventor： Christopher D. PREST , Matthew S. SCOTT , Stephen P. ZADESKY , Richard W. HELEY , Dermot J. STRATTON , Joseph C. POOLE
IPC: F16B35/00 , B22D25/00 , F16B19/04 , F16B37/00 , F16B13/06 , A44B19/00 , F16B37/12 , B23K31/00 , F16B15/00
CPC classification number: B22D25/06 , B21J1/006 , B21K1/46 , B21K1/56 , B22D21/00 , F16B35/044 , Y10T24/25
Abstract: Embodiments relates to a fastener having a head portion and an interlock portion comprising a bulk solidifying amorphous alloy comprising a metal alloy. The fastener could further have a screw portion. Other embodiments relate to methods of making and using the fasteners.
Abstract translation: 实施例涉及一种紧固件，其具有头部和互锁部分，其包括包含金属合金的块状固化非晶态合金。 紧固件还可以具有螺钉部分。 其他实施例涉及制造和使用紧固件的方法。
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Patent Agency Ranking
公开(公告)号：US20130306197A1
公开(公告)日：2013-11-21
申请号：US13472657
申请日：2012-05-16
Applicant: Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Quoc Tran Pham , Theodore Andrew Waniuk
Inventor： Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Quoc Tran Pham , Theodore Andrew Waniuk
CPC classification number: B22F9/002 , B22D17/007 , B22F3/006 , B22F2998/00 , C22C1/002 , C22C1/02 , C22C33/003 , C22C45/001 , C22C45/003 , C22C45/02 , C22C45/10 , B22F3/02 , B22F3/17 , B22F3/18 , B22F3/20 , B22F3/22
Abstract: Described herein is a method of combining discrete pieces of BMG in to a BMG feedstock that has at least one dimension greater than a critical dimension of the BMG, by methods such as thermoplastic forming, pressing, extruding, folding or forging. Other embodiments relate to a bulk metallic glass (BMG) component or feedstock having discrete pieces of a BMG, wherein the BMG component or feedstock has at least one dimension greater than a critical dimension of the BMG.
Abstract translation: 本文描述的是通过诸如热塑性成形，压制，挤压，折叠或锻造的方法将离散的BMG组合到具有大于BMG临界尺寸的至少一个尺寸的BMG原料中的方法。 其它实施方案涉及具有离散块BMG的块状金属玻璃（BMG）组分或原料，其中BMG组分或原料具有大于BMG临界尺寸的至少一个维度。
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公开(公告)号：US20130306196A1
公开(公告)日：2013-11-21
申请号：US13472056
申请日：2012-05-15
Applicant: Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Quoc Tran Pham , Theodore Andrew Waniuk
Inventor： Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Quoc Tran Pham , Theodore Andrew Waniuk
CPC classification number: C22C45/10 , B22D17/00 , B22D25/06 , B22D41/01 , C22C1/002 , C22C1/02 , C22C30/00 , C22C33/003 , C22C45/00 , C22C45/001 , C22C45/003 , C22C45/02
Abstract: Described herein is a feedstock comprising BMG. The feedstock has a surface with an average roughness of at least 200 microns. Also described herein is a feedstock comprising BMG. The feedstock, when supported on a support during a melting process of the feedstock, has a contact area between the feedstock and the support up to 50% of a total area of the support. These feedstocks can be made by molding ingots of BMG into a mole with surface patterns, enclosing one or more cores into a sheath with a roughened surface, chemical etching, laser ablating, machining, grinding, sandblasting, or shot peening. The feedstocks can be used as starting materials in an injection molding process.
Abstract translation: 本文描述的是包含BMG的原料。 原料具有平均粗糙度至少为200微米的表面。 本文还描述了包含BMG的原料。 原料在原料熔化过程中支持在载体上时，在原料和载体之间具有高达载体总面积的50％的接触面积。 这些原料可以通过将BMG的铸锭成型为具有表面图案的摩尔制成，将一个或多个芯部包裹在具有粗糙表面，化学蚀刻，激光烧蚀，机械加工，研磨，喷砂或喷丸硬化的护套中。 原料可以在注射成型工艺中用作原料。
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公开(公告)号：US20130248219A1
公开(公告)日：2013-09-26
申请号：US13430221
申请日：2012-03-26
Applicant: Lucy E. BROWNING , Joseph C. Poole , Christopher D. Prest , Stephen P. Zadesky
Inventor： Lucy E. BROWNING , Joseph C. Poole , Christopher D. Prest , Stephen P. Zadesky
CPC classification number: H05K5/04 , B23K26/0861 , B23K26/0884 , B23K26/32 , B23K26/34 , B23K2101/36 , B23K2103/02 , B23K2103/04 , B23K2103/05 , B23K2103/08 , B23K2103/10 , B23K2103/14 , B23K2103/15 , B23K2103/16 , B23K2103/18 , B23K2103/26 , B23K2103/50 , Y10T29/49982 , Y10T29/49984
Abstract: A metal enclosure has a surface region which is coated with cladding material using a laser cladding process. The metal enclosure can form at least a portion of an electronic device housing. All or part of one or more surfaces of the enclosure can be coated with cladding material. The coating of cladding material can be varied at selective regions of the enclosure to provide different structural properties at these regions. The coating of cladding material can be varied at selective regions to provide contrast in cosmetic appearance.
Abstract translation: 金属外壳具有使用激光熔覆工艺涂覆包层材料的表面区域。 金属外壳可以形成电子设备外壳的至少一部分。 外壳的一个或多个表面的全部或部分可以用包覆材料涂覆。 包层材料的涂层可以在外壳的选择性区域变化，以在这些区域提供不同的结构特性。 包层材料的涂层可以在选择性区域变化，以提供美观外观的对比度。
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19.发明申请公开(公告)号：US20130008796A1
公开(公告)日：2013-01-10
申请号：US13414542
申请日：2012-03-07
Applicant: Ken Silverman , Ronald Moller , Peter Russell-Clarke , Christopher D. Prest , Rimple Bhatia , Paul Choiniere , Lucy Elizabeth Browning , Masashige Tatebe
Inventor： Ken Silverman , Ronald Moller , Peter Russell-Clarke , Christopher D. Prest , Rimple Bhatia , Paul Choiniere , Lucy Elizabeth Browning , Masashige Tatebe
CPC classification number: C25D3/44 , C25D3/665 , C25D5/02 , C25D5/022 , C25D5/10 , C25D5/48 , C25D7/00 , C25D11/022 , C25D11/024 , C25D11/04 , C25D11/12 , C25D11/14 , C25D11/16 , C25D11/18 , C25D11/243 , C25D11/246 , H04M1/0283 , H05K5/04 , Y10T428/12611 , Y10T428/12764
Abstract: Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodizing the electroplated aluminum. This produces cosmetic structures that may possess desired structural and cosmetic properties and that may be suitable for use as housing or support members of electronic devices.
Abstract translation: 公开了阳极化电镀铝结构及其制造方法。 根据本发明实施例的化妆品结构通过用铝电镀非化妆品结构，然后对电镀铝进行阳极氧化来提供。 这产生了可以具有期望的结构和化妆品性质并且可以适合用作电子设备的外壳或支撑构件的化妆品结构。
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公开(公告)号：US08330655B2
公开(公告)日：2012-12-11
申请号：US12543457
申请日：2009-08-18
Applicant: Stephen P. Zadesky , Christopher D. Prest
Inventor： Stephen P. Zadesky , Christopher D. Prest
IPC: H01Q1/24
CPC classification number: H01R13/665 , H01Q1/22 , H01Q13/10 , H01R2201/02
Abstract: Connectors for electronic devices are provided with embedded antennas. The connectors may be 30-pin connectors. A 30-pin connector may have a conductive shell structure that defines a cavity and a planar dielectric member that extends into the cavity and that has contact pins. An antenna may be formed from an antenna resonating element on the planar dielectric member and an antenna ground formed from the conductive shell structure. An antenna may be formed from a slot in the conductive shell. The antenna and the pins may be electrically coupled to an electronic device using a cable.
Abstract translation: 电子设备连接器配有嵌入式天线。 连接器可以是30针连接器。 30针连接器可以具有限定空腔的导电壳结构和延伸到空腔中并具有接触针的平面电介质构件。 天线可以由平面电介质构件上的天线谐振元件和由导电壳结构形成的天线接地形成。 天线可以由导电壳体中的槽形成。 天线和引脚可以使用电缆电耦合到电子设备。
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