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11.
公开(公告)号:US20120039053A1
公开(公告)日:2012-02-16
申请号:US13283655
申请日:2011-10-28
CPC分类号: H01R13/2442 , H01M2/1044 , H05K1/182 , H05K3/301 , H05K2201/10037 , H05K2201/10325 , H05K2201/10454 , H05K2201/10643 , Y10T29/49108 , Y10T29/4913 , Y10T29/49153 , Y10T29/49174 , Y10T29/49176 , Y10T29/49204
摘要: A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.
摘要翻译: 描述了一种用于在嵌入式系统内耦合电池的方法。 该方法包括创建延伸穿过印刷电路板(PCB)的孔,将电池的一部分插入到孔中,以及将电池电耦合到至少一个触点。
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公开(公告)号:US08047853B2
公开(公告)日:2011-11-01
申请号:US12399608
申请日:2009-03-06
申请人: David S. Slaton
发明人: David S. Slaton
IPC分类号: H01R12/00
CPC分类号: H05K1/0295 , H01R12/724 , H05K1/182 , H05K7/1461 , H05K2201/09954 , H05K2201/10189 , H05K2201/10446 , H05K2201/10522
摘要: A printed circuit board including a P1 connector, a P2 connector, and a first common connector configured to connect an application-specific connector to the printed circuit board.
摘要翻译: 一种印刷电路板,包括P1连接器,P2连接器和被配置为将专用连接器连接到印刷电路板的第一公共连接器。
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公开(公告)号:US20090165302A1
公开(公告)日:2009-07-02
申请号:US11967298
申请日:2007-12-31
申请人: David S. SLATON , David L. McDonald
发明人: David S. SLATON , David L. McDonald
CPC分类号: H05K7/20509 , F28F13/00 , G06F1/20 , H01L21/4882 , H01L23/367 , H01L23/373 , H01L2924/0002 , H01L2924/3011 , Y10T29/49393 , H01L2924/00
摘要: The present disclosure is related to methods for bonding TPG elements to at least a first metal material for forming a heatsink. The heatsinks have an improved thermal conductivity in the X-Y plane.
摘要翻译: 本公开涉及用于将TPG元件结合到用于形成散热器的至少第一金属材料的方法。 散热片在X-Y平面上具有改善的热导率。
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公开(公告)号:US20080137307A1
公开(公告)日:2008-06-12
申请号:US11608384
申请日:2006-12-08
申请人: Chris Erwin Orr , David S. Slaton
发明人: Chris Erwin Orr , David S. Slaton
IPC分类号: H05K7/20
CPC分类号: H05K1/0203 , B82Y10/00 , F28D15/00 , F28D15/0266 , F28D2015/0225 , F28F3/12 , H01L23/467 , H01L2224/16 , H05K1/0272 , H05K1/112 , H05K2201/026 , H05K2201/064
摘要: A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.
摘要翻译: 提供了一种从电子设备提取热量的系统。 该系统包括位于印刷电路板内的散热装置,以形成板内散热器结构和设置在散热装置中的流体传热介质。 介质通过散热装置循环,从电子设备携带热量。
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公开(公告)号:US20100225306A1
公开(公告)日:2010-09-09
申请号:US12399608
申请日:2009-03-06
申请人: David S. Slaton
发明人: David S. Slaton
CPC分类号: H05K1/0295 , H01R12/724 , H05K1/182 , H05K7/1461 , H05K2201/09954 , H05K2201/10189 , H05K2201/10446 , H05K2201/10522
摘要: A printed circuit board including a P1 connector, a P2 connector, and a first common connector configured to connect an application-specific connector to the printed circuit board.
摘要翻译: 一种印刷电路板,包括P1连接器,P2连接器和被配置为将专用连接器连接到印刷电路板的第一公共连接器。
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16.
公开(公告)号:US20090169410A1
公开(公告)日:2009-07-02
申请号:US11967307
申请日:2007-12-31
申请人: David S. Slaton , David L. McDonald
发明人: David S. Slaton , David L. McDonald
CPC分类号: H01L23/373 , B22D19/00 , H01L21/4871 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要: The present disclosure is related to creating blocks of aluminum and/or copper material having embedded TPG elements for forming heatsinks. The metal blocks have an improved thermal conductivity in the X-Y plane. Furthermore, the TPG-embedded heatsinks can be created using methods capable of being performed using various machines and equipment in many various facilities.
摘要翻译: 本公开涉及产生具有用于形成散热器的嵌入式TPG元件的铝和/或铜材料块。 金属块在X-Y平面上具有改善的导热性。 此外,可以使用能够在许多不同设施中使用各种机器和设备执行的方法来创建TPG嵌入式散热器。
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17.
公开(公告)号:US20090166021A1
公开(公告)日:2009-07-02
申请号:US11966201
申请日:2007-12-28
申请人: David S. Slaton , David L. McDonald
发明人: David S. Slaton , David L. McDonald
IPC分类号: F28F7/00
CPC分类号: F28F21/02 , F28F3/02 , F28F21/084 , F28F21/085 , H01L21/4882 , H01L23/367 , H01L23/373 , H01L23/4006 , H01L2023/4068 , H01L2023/4075 , H01L2924/0002 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要: The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.
摘要翻译: 本公开涉及散热器和形成散热器的方法。 在一个实施例中,形成散热器的方法包括形成至少一个热解石墨元件。 所述至少一个TPG元件包括具有楔形表面的第一侧和具有平坦表面的第二侧。 所述方法还包括在所述至少一个TPG元件上层叠金属材料,所述金属被配置为与所述至少一个TPG元件的第一侧互补,并且施加压力以将所述金属材料紧固到所述至少一个TPG元件。
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