Abstract:
Provided are an optical connector capable of improving optical alignment efficiency and an optical device having the same. The connector may include a body having a top surface and a bottom surface facing each other, through holes penetrating the body to connect the top and bottom surfaces, and alignment keys provided on at least side surface of the body to be parallel to the through holes.
Abstract:
Provided are optical coupling devices and silicon photonics chips having the same. the optical coupling device may include a lower layer having a first region and a second region, a first core layer disposed on the lower layer, the first core layer including first and second waveguides disposed on the first and second regions, respectively, a clad layer covering the first waveguide, and a second core layer interposed between the clad layer and the lower layer to cover the second waveguide. The second waveguide has a width decreasing with increasing distance from the first region and a vertical thickness greater than that of the first waveguide.
Abstract:
An antenna device for a portable terminal includes: a ground pattern provided on one surface of a circuit board; a first antenna pattern configured to resonate at a first frequency band and provided on an opposite surface of the circuit board; and a second antenna pattern configured to resonate at a second frequency band different from the first frequency band and arranged along a periphery of the ground pattern. The second antenna pattern is a zeroth order mode resonator including a plurality of capacitors and a plurality of inductors. The antenna device easily secures the operation characteristics of different operation frequency bands and contributes to miniaturization of the portable terminal. Thus, a user can conveniently carry and use the portable terminal.
Abstract:
A polarizing plate for use with an organic light emitting display includes an adhesive layer, a retardation film, a polarizer, and a protective film sequentially stacked in this order, the polarizing plate further including a positive C plate.
Abstract:
Disclosed is a grating coupler which includes an optical waveguide transferring an optical signal; and a diffraction grating formed on the optical waveguide. The diffraction grating includes protrusions continuously formed and the protrusions have different heights.
Abstract:
Exemplary embodiments of the present invention provide a metal wiring etchant. A metal wiring etchant according to an exemplary embodiment of the present invention includes ammonium persulfate, an organic acid, an ammonium salt, a fluorine-containing compound, a glycol-based compound, and an azole-based compound.
Abstract:
Provided is a silicon photonics chip that is thermally separated from a light emitting device. The silicon photonics chip includes photoelectric devices integrated on a silicon substrate. The photoelectric devices include an optical connection device optically guiding at least one signal light incident from a signal light generation device to transmit the signal light into the silicon substrate. The signal light generation device is thermally separated from the photoelectric devices, and is optically connected to the photoelectric devices.
Abstract:
Provided is an electro-optic modulating device. The electro-optic modulating device includes an optical waveguide with a vertical structure and sidewalls of the vertical structure are used to configure a junction.
Abstract:
An optical interconnection system is provided. The optical interconnection system includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, an one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on an upper surface of the transmitter-unit optical interconnection block exposed to an upper surface of the optical PCB; a driver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on an upper surface of the receiver-unit optical interconnection block exposed to the upper surface of the optical PCB; and a receiver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light receiving element and the optical PCB. The upper surfaces of the respective optical interconnection blocks are substantially aligned with the upper surface of the PCB