Optical connector and optical device having the same
    12.
    发明授权
    Optical connector and optical device having the same 有权
    光连接器和具有该光连接器的光学装置

    公开(公告)号:US09063302B2

    公开(公告)日:2015-06-23

    申请号:US13443843

    申请日:2012-04-10

    Abstract: Provided are an optical connector capable of improving optical alignment efficiency and an optical device having the same. The connector may include a body having a top surface and a bottom surface facing each other, through holes penetrating the body to connect the top and bottom surfaces, and alignment keys provided on at least side surface of the body to be parallel to the through holes.

    Abstract translation: 提供能够提高光取向效率的光连接器和具有该光连接器的光学装置。 连接器可以包括具有顶表面和底表面彼此面对的主体,穿过穿过主体以连接顶表面和底表面的孔以及设置在主体的至少侧表面上以与通孔平行的对准键 。

    Optical coupling devices and silicon photonics chips having the same
    13.
    发明授权
    Optical coupling devices and silicon photonics chips having the same 有权
    具有相同光耦合器件和硅光子芯片

    公开(公告)号:US09025920B2

    公开(公告)日:2015-05-05

    申请号:US13620560

    申请日:2012-09-14

    CPC classification number: G02B6/305 G02B6/1228 G02B2006/12061

    Abstract: Provided are optical coupling devices and silicon photonics chips having the same. the optical coupling device may include a lower layer having a first region and a second region, a first core layer disposed on the lower layer, the first core layer including first and second waveguides disposed on the first and second regions, respectively, a clad layer covering the first waveguide, and a second core layer interposed between the clad layer and the lower layer to cover the second waveguide. The second waveguide has a width decreasing with increasing distance from the first region and a vertical thickness greater than that of the first waveguide.

    Abstract translation: 提供了具有其的光耦合器件和硅光子芯片。 光耦合装置可以包括具有第一区域和第二区域的下层,设置在下层上的第一芯层,第一芯层分别包括设置在第一和第二区域上的第一和第二波导,包层 覆盖第一波导,以及插入在包层和下层之间以覆盖第二波导的第二芯层。 第二波导的宽度随着距离第一区域的距离增加而减小,并且垂直厚度大于第一波导的垂直厚度。

    Antenna device for a portable terminal
    14.
    发明授权
    Antenna device for a portable terminal 有权
    用于便携式终端的天线装置

    公开(公告)号:US08593353B2

    公开(公告)日:2013-11-26

    申请号:US12999802

    申请日:2009-06-12

    CPC classification number: H01Q9/42 H01Q1/243 H01Q1/48 H01Q5/378

    Abstract: An antenna device for a portable terminal includes: a ground pattern provided on one surface of a circuit board; a first antenna pattern configured to resonate at a first frequency band and provided on an opposite surface of the circuit board; and a second antenna pattern configured to resonate at a second frequency band different from the first frequency band and arranged along a periphery of the ground pattern. The second antenna pattern is a zeroth order mode resonator including a plurality of capacitors and a plurality of inductors. The antenna device easily secures the operation characteristics of different operation frequency bands and contributes to miniaturization of the portable terminal. Thus, a user can conveniently carry and use the portable terminal.

    Abstract translation: 一种用于便携式终端的天线装置包括:设置在电路板的一个表面上的接地图案; 第一天线图案,被配置为在第一频带处谐振并且设置在所述电路板的相对表面上; 以及第二天线图案,其被配置为在与所述第一频带不同的第二频带处谐振并且沿着所述接地图案的周边布置。 第二天线图案是包括多个电容器和多个电感器的零级模式谐振器。 天线装置容易地保护不同操作频带的操作特性,有助于便携式终端的小型化。 因此,用户可以方便地携带和使用便携式终端。

    GRATING COUPLER
    16.
    发明申请
    GRATING COUPLER 审中-公开
    镀金联轴器

    公开(公告)号:US20130136396A1

    公开(公告)日:2013-05-30

    申请号:US13620636

    申请日:2012-09-14

    CPC classification number: G02B6/34

    Abstract: Disclosed is a grating coupler which includes an optical waveguide transferring an optical signal; and a diffraction grating formed on the optical waveguide. The diffraction grating includes protrusions continuously formed and the protrusions have different heights.

    Abstract translation: 公开了一种光栅耦合器,其包括传输光信号的光波导; 以及形成在光波导上的衍射光栅。 衍射光栅包括连续形成的突起,突起具有不同的高度。

    SILICON PHOTONICS CHIP
    18.
    发明申请
    SILICON PHOTONICS CHIP 审中-公开
    硅胶片

    公开(公告)号:US20110135252A1

    公开(公告)日:2011-06-09

    申请号:US12816323

    申请日:2010-06-15

    CPC classification number: G02B6/43 G02B6/262 G02B6/4292

    Abstract: Provided is a silicon photonics chip that is thermally separated from a light emitting device. The silicon photonics chip includes photoelectric devices integrated on a silicon substrate. The photoelectric devices include an optical connection device optically guiding at least one signal light incident from a signal light generation device to transmit the signal light into the silicon substrate. The signal light generation device is thermally separated from the photoelectric devices, and is optically connected to the photoelectric devices.

    Abstract translation: 提供了与发光器件热分离的硅光子芯片。 硅光子芯片包括集成在硅衬底上的光电器件。 光电装置包括光学连接装置,其光引导从信号光产生装置入射的至少一个信号光,以将信号光传输到硅衬底。 信号光产生装置与光电装置热分离,并与光电装置光学连接。

    Optical interconnection system using optical waveguide-integrated optical printed circuit board
    20.
    发明申请
    Optical interconnection system using optical waveguide-integrated optical printed circuit board 失效
    光互连系统采用光波导集成光电印刷电路板

    公开(公告)号:US20100232741A1

    公开(公告)日:2010-09-16

    申请号:US12227995

    申请日:2008-09-22

    CPC classification number: G02B6/43 G02B6/4214 H05K1/0274

    Abstract: An optical interconnection system is provided. The optical interconnection system includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, an one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on an upper surface of the transmitter-unit optical interconnection block exposed to an upper surface of the optical PCB; a driver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on an upper surface of the receiver-unit optical interconnection block exposed to the upper surface of the optical PCB; and a receiver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light receiving element and the optical PCB. The upper surfaces of the respective optical interconnection blocks are substantially aligned with the upper surface of the PCB

    Abstract translation: 提供光互连系统。 光互连系统包括光学印刷电路板(PCB),其包括用于将光路弯曲预定角度的发射器单元和接收器单元光学互连块,包括插入每个光路中的光波导的单个单元光波导 以连接发射机单元和接收机单元光学互连块的光路,以及将其中集成有单一单元光波导的PCB连接在一起; 在与所述光学PCB的上表面露出的所述发射单元光互连块的上表面上与所述光波导成一行的发光元件; 驱动器集成电路,其形成在所述光学PCB的上表面上并电连接到所述发光元件和所述光学PCB; 光接收元件,其在与所述光学PCB的上表面接触的所述接收器单元光互连块的上表面上与所述光波导成一直线; 以及形成在光学PCB的上表面并电连接到光接收元件和光学PCB的接收器集成电路。 各个光互连块的上表面基本上与PCB的上表面对齐

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