公开(公告)号：US08084692B2

公开(公告)日：2011-12-27

申请号：US11924416

申请日：2007-10-25

Applicant: Moises Cases ,  Bradley D. Herrman ,  Kent B. Howieson ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham ,  Caleb J. Wesley

Inventor： Moises Cases ,  Bradley D. Herrman ,  Kent B. Howieson ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham ,  Caleb J. Wesley

IPC: H05K1/03

CPC classification number: H05K1/024 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T156/1013

Abstract: An apparatus having reduced noise coupling includes a core layer having an upper and lower surface, the upper and lower surface each including a copper sheet layer, a pre-preg layer having an upper surface and a lower surface, the upper surface of the pre-preg layer coupled to the lower surface of the core layer, a core insulating layer having an upper surface and a lower surface, the upper surface of the core insulating layer coupled to the lower surface of the pre-preg layer, a return current reference layer disposed on the lower surface of the core insulator layer and high-speed signal traces disposed on the upper surface of the core insulating layer, each of the high speed signal traces disposed on a pedestal defined by a section of the pre-preg layer and the core insulating layer, each pedestal being separated by an air gap disposed between adjacent pedestals.

Abstract translation: 具有降低的噪声耦合的装置包括具有上表面和下表面的芯层，所述上表面和下表面各自包括铜片层，具有上表面和下表面的预浸层， 耦合到芯层的下表面的芯层绝缘层，具有上表面和下表面的芯绝缘层，芯绝缘层的上表面耦合到预浸层的下表面，返回电流参考层 设置在芯绝缘体层的下表面和设置在芯绝缘层的上表面上的高速信号迹线，每个高速信号迹线设置在由预浸层的一部分限定的基座上， 芯绝缘层，每个基座由设置在相邻基座之间的气隙分隔开。

公开(公告)号：US07813447B2

公开(公告)日：2010-10-12

申请号：US11560257

申请日：2006-11-15

Applicant: Daniel N. De Araujo ,  Moises Cases ,  Bradley D. Herrman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham

Inventor： Daniel N. De Araujo ,  Moises Cases ,  Bradley D. Herrman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham

IPC: H04L25/03

CPC classification number: H04L25/0264 ,  H04L25/0286

Abstract: An apparatus, system, and method are disclosed for dynamic phase equalization in a communication channel. A transmitter history module stores a plurality of bits from a data stream that is transmitted through the communication channel. A transmitter detection module detects a pre-transition bit of a first value that is preceded in the data stream by at least one bit of the first value and followed by a transition bit with a second value. A driver module transmits the data stream by driving the communication channel. A transition module pre-drives the communication channel to the second voltage of the transition bit during a bit time interval of the pre-transition bit.

Abstract translation: 公开了用于通信信道中的动态相位均衡的装置，系统和方法。 发射机历史模块从通过通信信道发送的数据流存储多个比特。 发射机检测模块检测在数据流中前面的第一值的前转换比特的第一值的至少一个比特，然后跟随具有第二值的转换比特。 驾驶员模块通过驱动通信信道来发送数据流。 转换模块在预转换位的位时间间隔期间将通信通道预驱动到转换位的第二电压。

公开(公告)号：US07725783B2

公开(公告)日：2010-05-25

申请号：US11780505

申请日：2007-07-20

Applicant: Moises Cases ,  Daniel N. de Araujo ,  Bradley D. Herrman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin Patel ,  Nam H. Pham

Inventor： Moises Cases ,  Daniel N. de Araujo ,  Bradley D. Herrman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin Patel ,  Nam H. Pham

IPC: G11C29/00

CPC classification number: G01R31/2815 ,  G01R31/304 ,  G11C29/02 ,  G11C29/022 ,  G11C29/56 ,  G11C2029/5602

Abstract: The present invention assesses memory (DIMM) strength by calculating frequency content of a radiated field which is collected by an apparatus, such as a dipole antenna. Radiated field is created by accelerated charge, which is a function of the slew rate or DIMM strength. Radiated power is directly proportional to the frequency at which bits are driven. By separating the radiated field from the near field or stored field, the DIMM strength content is isolated from other functional DIMM issues, such as tRCD latency, refresh cycles, addressing mode, etc. By examining the radiated power, the disadvantages of the prior art, such as by probing the DIMM's contacts, are avoided.

Abstract translation: 本发明通过计算由诸如偶极天线的装置收集的辐射场的频率内容来评估存储器（DIMM）强度。 辐射场由加速电荷产生，这是压摆率或DIMM强度的函数。 辐射功率与驱动位的频率成正比。 通过将辐射场与近场或存储场分离，DIMM强度内容与其他功能性DIMM问题（例如tRCD延迟，刷新周期，寻址模式等）隔离。通过检查辐射功率，现有技术的缺点 ，例如通过探测DIMM的触点。

公开(公告)号：US07701222B2

公开(公告)日：2010-04-20

申请号：US11875001

申请日：2007-10-19

Applicant: Moises Cases ,  Bradley Donald Herrman ,  Kent Barclay Howieson ,  Erdem Matoglu ,  Bhyrav Murthy Mutnury ,  Pravin Patel ,  Nam Huu Pham ,  Caleb James Wesley

Inventor： Moises Cases ,  Bradley Donald Herrman ,  Kent Barclay Howieson ,  Erdem Matoglu ,  Bhyrav Murthy Mutnury ,  Pravin Patel ,  Nam Huu Pham ,  Caleb James Wesley

IPC: G01K3/00 ,  G01J5/00 ,  G01K17/00 ,  G01R27/32

CPC classification number: G01N25/72 ,  G01J5/0096 ,  G01R31/2818 ,  G01R31/2837 ,  G01R31/309

Abstract: A method for testing a printed circuit board to determining the dielectric loss associated with the circuit board material relative to a standard. Dielectric losses in the material generate heat when a high frequency electronic signal, such as a microwave frequency signal, is communicated through a microstrip that is embedded within the printed circuit board. The temperature or spectrum at the surface of printed circuit board is measured and compared against the temperature or spectrum of the standard to determine whether the material under test is acceptable. While various temperature measurement devices may be used, the temperature is preferably measured without contacting the surface, such as using an infrared radiation probe.

Abstract translation: 一种用于测试印刷电路板以确定与电路板材料相关的介电损耗相对于标准的方法。 当诸如微波频率信号的高频电子信号通过嵌入在印刷电路板内的微带传输时，材料中的介电损耗产生热量。 测量印刷电路板表面的温度或光谱，并与标准品的温度或光谱进行比较，以确定被测材料是否可接受。 尽管可以使用各种温度测量装置，但是优选地在不接触表面的情况下测量温度，例如使用红外辐射探针。

公开(公告)号：US20090079456A1

公开(公告)日：2009-03-26

申请号：US11859540

申请日：2007-09-21

Applicant: Moises Cases ,  Shiva R. Dasari ,  Erdem Matoglu ,  Bhyrav Murthy Mutnury ,  Nam Huu Pham

Inventor： Moises Cases ,  Shiva R. Dasari ,  Erdem Matoglu ,  Bhyrav Murthy Mutnury ,  Nam Huu Pham

IPC: G01R31/02

CPC classification number: G06F11/24 ,  G11C5/04 ,  G11C29/028 ,  G11C29/12005 ,  G11C29/50 ,  G11C2029/5004

Abstract: An apparatus, system, and method are disclosed for integrating component testing. A voltage module modifies a reference voltage integral to an electronic device to a plurality of reference voltage values. A test module tests a component of the electronic device at each of the plurality of reference voltage values. In addition, the test module determines a voltage range for the component, wherein the voltage range comprises voltage values between a high voltage failure and a low voltage failure. An optimization module sets the reference voltage value to within the voltage range.

Abstract translation: 公开了用于集成部件测试的装置，系统和方法。 电压模块将对电子设备积分的参考电压修改为多个参考电压值。 测试模块在多个参考电压值中的每一个测试电子设备的组件。 此外，测试模块确定组件的电压范围，其中电压范围包括高电压故障和低电压故障之间的电压值。 优化模块将参考电压值设置在电压范围内。

公开(公告)号：US20080261451A1

公开(公告)日：2008-10-23

申请号：US11737196

申请日：2007-04-19

Applicant: Justin P. Bandholz ,  Moises Cases ,  Robert J. Christopher ,  Daniel N. de Araujo ,  Bradley D. Herrman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham

Inventor： Justin P. Bandholz ,  Moises Cases ,  Robert J. Christopher ,  Daniel N. de Araujo ,  Bradley D. Herrman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham

IPC: H01R13/648

CPC classification number: H05K1/0237 ,  H04L25/028 ,  H04L25/0288 ,  H04L25/03343 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/044 ,  H05K2201/1006

Abstract: Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.

Abstract translation: 本发明的实施例解决了PCB设计中的通孔结构利用方面的技术缺陷，并且提供了一种用于PCB中经由短线和连接器的阻抗不连续修复的新颖且非显而易见的方法，系统和计算机程序产品。 在一个实施例中，可以提供PCB中阻抗不连续修复的方法。 该方法可以包括配置预失真滤波器以消除由具有通孔短路或连接器之一的传输线引起的电信号中的阻抗不连续性。 该方法还可以包括在通过传输线路传输电信号之前对电信号进行预失真滤波。 最后，该方法可以包括通过传输线传输预失真滤波的电信号。

公开(公告)号：US07394281B1

公开(公告)日：2008-07-01

申请号：US12023659

申请日：2008-01-31

Applicant: Justin P. Bandholz ,  Moises Cases ,  Bradley D. Herman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Thomas D. Pahel ,  Pravin S. Patel ,  Nam H. Pham ,  Christopher C. West

Inventor： Justin P. Bandholz ,  Moises Cases ,  Bradley D. Herman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Thomas D. Pahel ,  Pravin S. Patel ,  Nam H. Pham ,  Christopher C. West

IPC: H03K17/16

CPC classification number: G06F13/4072

Abstract: A bi-directional universal serial bus (“USB”) circuit for boosting a signal on a USB bus disclosed. The circuit includes a first stage inverting buffer coupled to a second stage inverting buffer to form a non-inverting buffer circuit. A high pass filter is coupled in series with the non-inverting buffer circuit to provide AC coupling to the USB bus and to allow fast signal edges through the circuit. The booster circuit is arranged to improve signal quality over a USB bus to allow additional USB devices and longer USB busses to be utilized.

Abstract translation: 一种用于升高USB总线上的信号的双向通用串行总线（“USB”）电路。 电路包括耦合到第二级反相缓冲器以形成非反相缓冲电路的第一级反相缓冲器。 高通滤波器与非反相缓冲电路串联耦合以提供与USB总线的AC耦合并允许通过电路的快速信号边缘。 升压电路被设置为通过USB总线提高信号质量，以允许使用附加的USB设备和更长的USB总线。

公开(公告)号：US08390393B2

公开(公告)日：2013-03-05

申请号：US13603386

申请日：2012-09-04

Applicant: Justin P. Bandholz ,  Moises Cases ,  Robert J. Christopher ,  Daniel de Araujo ,  Bradley D. Herrman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham

Inventor： Justin P. Bandholz ,  Moises Cases ,  Robert J. Christopher ,  Daniel de Araujo ,  Bradley D. Herrman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham

IPC: H03H7/38

CPC classification number: H05K1/0237 ,  H04L25/028 ,  H04L25/0288 ,  H04L25/03343 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/044 ,  H05K2201/1006

Abstract: Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.

Abstract translation: 本发明的实施例解决了PCB设计中的通孔结构利用方面的技术缺陷，并且提供了一种用于PCB中经由短线和连接器的阻抗不连续修复的新颖且非显而易见的方法，系统和计算机程序产品。 在一个实施例中，可以提供PCB中阻抗不连续修复的方法。 该方法可以包括配置预失真滤波器以消除由具有通孔短路或连接器之一的传输线引起的电信号中的阻抗不连续性。 该方法还可以包括在通过传输线路传输电信号之前对电信号进行预失真滤波。 最后，该方法可以包括通过传输线传输预失真滤波的电信号。

公开(公告)号：US20120327622A1

公开(公告)日：2012-12-27

申请号：US13603386

申请日：2012-09-04

Applicant: Justin P. Bandholz ,  Moises Cases ,  Robert J. Christopher ,  Daniel N. de Araujo ,  Bradley D. Herrman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham

Inventor： Justin P. Bandholz ,  Moises Cases ,  Robert J. Christopher ,  Daniel N. de Araujo ,  Bradley D. Herrman ,  Erdem Matoglu ,  Bhyrav M. Mutnury ,  Pravin S. Patel ,  Nam H. Pham

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0237 ,  H04L25/028 ,  H04L25/0288 ,  H04L25/03343 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/044 ,  H05K2201/1006

Abstract: Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.

Abstract translation: 本发明的实施例解决了PCB设计中的通孔结构利用方面的技术缺陷，并且提供了一种用于PCB中经由短线和连接器的阻抗不连续修复的新颖且非显而易见的方法，系统和计算机程序产品。 在一个实施例中，可以提供PCB中阻抗不连续修复的方法。 该方法可以包括配置预失真滤波器以消除由具有通孔短路或连接器之一的传输线引起的电信号中的阻抗不连续性。 该方法还可以包括在通过传输线路传输电信号之前对电信号进行预失真滤波。 最后，该方法可以包括通过传输线传输预失真滤波的电信号。

公开(公告)号：US20090102487A1

公开(公告)日：2009-04-23

申请号：US11875001

申请日：2007-10-19

Applicant: Moises Cases ,  Bradley Donald Herrman ,  Kent Barclay Howieson ,  Erdem Matoglu ,  Bhyrav Murthy Mutnury ,  Pravin Patel ,  Nam Huu Pham ,  Celeb James Wesley

Inventor： Moises Cases ,  Bradley Donald Herrman ,  Kent Barclay Howieson ,  Erdem Matoglu ,  Bhyrav Murthy Mutnury ,  Pravin Patel ,  Nam Huu Pham ,  Celeb James Wesley

IPC: G01R31/02 ,  G01K3/00 ,  G01N25/72

CPC classification number: G01N25/72 ,  G01J5/0096 ,  G01R31/2818 ,  G01R31/2837 ,  G01R31/309

Abstract: A method for testing a printed circuit board to determining the dielectric loss associated with the circuit board material relative to a standard. Dielectric losses in the material generate heat when a high frequency electronic signal, such as a microwave frequency signal, is communicated through a microstrip that is embedded within the printed circuit board. The temperature or spectrum at the surface of printed circuit board is measured and compared against the temperature or spectrum of the standard to determine whether the material under test is acceptable. While various temperature measurement devices may be used, the temperature is preferably measured without contacting the surface, such as using an infrared radiation probe.

Abstract translation: 一种用于测试印刷电路板以确定与电路板材料相关的介电损耗相对于标准的方法。 当诸如微波频率信号的高频电子信号通过嵌入在印刷电路板内的微带传输时，材料中的介电损耗产生热量。 测量印刷电路板表面的温度或光谱，并与标准品的温度或光谱进行比较，以确定被测材料是否可接受。 尽管可以使用各种温度测量装置，但是优选地在不接触表面的情况下测量温度，例如使用红外辐射探针。