摘要:
A detection system for detecting appearances of many electronic elements includes a rotary module, a feeding module and a detection module. The rotary module has a base structure and a hollow transparent rotary structure disposed on the base structure. The feeding module is disposed beside one side of the hollow transparent rotary structure in order to sequentially guide the electronic elements to the top surface of the hollow transparent rotary structure. The detection module has a plurality of detection units sequentially disposed around the hollow transparent rotary structure. Each detection unit is composed of an image-sensing element for sensing the electronic elements, an image-capturing element for capturing surface images of the electronic elements and a classifying element for classifying the electronic elements.
摘要:
A modulation system includes an encoder for transferring data words to tentative code words. A DSV control bit generator determines the value of a DSV control bit according to the data words or the tentative code words to optimize the cumulative DSVs corresponding tentative code words, wherein the DSV control bit generator determines the value of a current DSV control bit when at least a subsequent DSV control bit is detected. A final code word generator generates final code words according to the determined DSV control bit and the tentative code words.
摘要:
A method and device for error analysis particularly adoptable for a recording medium such as an optical disc are disclosed. The present invention executes an encoding-like operation such as an interleaving operation to error flags during reproducing data from the optical disc, so as to obtain number and distribution of the errors on the disc.
摘要:
An infrared photodetector structure with voltage-tunable and -switchable photoresponses constructed of superlattices and blocking barriers. The photoresponses of the double-superlattice structure are also insensitive to the operating temperature changes. By using GaAs/AlxGa1-xAs system, the feasibility of this idea is verified. In the embodiment, the photoresponses can be switched between 6˜8.5 and 7.5˜12 m by the bias polarity and are also tunable by the bias magnitude in each detection wavelength range. In addition, the photoresponses are insensitive to operating temperatures ranging from 20 to 80 K. For the SLIP with few periods, the responsivity may be higher than the one with many periods and the operational temperature is higher. These results show the invention can be useful in the design of multicolor imaging systems. This invention is not only applicable for wavelengths comparable with the embodiment, but can also be applied to the detection of radiation in the range from visible to extreme far infrared.
摘要:
An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.
摘要:
An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.
摘要:
A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.
摘要:
A wafer testing method for wafer testing system comprises the steps: loading a wafer and then positioning the wafer relatively to a map file image stored in a map file. The map file is of a first file type. The next step is inspecting the appearance of the wafer. When the user detects defects on the wafer, the positions of the defects are directly recorded in the map file and then the modified map file is saved. The map file can be directly modified when the wafer is in the testing procedure so that the testing time is reduced. Furthermore, the precision of the testing is improved.
摘要:
A weighted defect estimating apparatus and a related method for determining a defect estimation value are disclosed. The weighted defect detecting apparatus includes: a defect detecting unit for generating a defect value when a defect in a predetermined region of an optical disc is detected; a weighting circuit, electrically connected to the defect detecting unit, to generate a weighted defect value according to the defect value and a weighting factor corresponding to a location of the defect on the optical disc; and a computing module, electrically connected to the weighting circuit, for computing the defect estimation value according to a plurality of weighted defect values corresponding to the predetermined region.
摘要:
A method for controlling an optical disc drive to resume interrupted recording on an optical disc includes: when the recording of a first recording unit block (RUB) is interrupted, storing an address thereof and storing a first value corresponding to the number of recorded sets of data of the first RUB; according to the address, searching a pseudo-recording start position corresponding to a recorded set of data of a specific RUB which is the first RUB or a second RUB recorded on the optical disc prior to the first RUB; re-encoding at least a portion of raw data corresponding to recorded sets of data on the optical disc and performing pseudo-recording from the pseudo-recording start position without physically writing on the optical disc until a second value matches a target value; and physically writing on the optical disc when the second value matches the target value to resume recording.