Abstract:
Disclosed herein is a resistive touch screen. The resistive touch screen includes a resistive touch panel configured to include a lower substrate formed with a lower electrode pattern in an active region through which images pass, an upper substrate formed with an upper electrode pattern to be opposite to the lower electrode pattern, and a spacer spacing the upper substrate from the lower substrate in order to contact the upper electrode pattern to the lower electrode pattern by external pressure; and a window bonded to the upper portion of the resistive touch panel by an optical clear adhesive, and including a covering film formed in the outer side region on the lower surface thereof and an elastic suppressing layer formed in the inner side region of the covering film.
Abstract:
There is provided a light emitting device of a simpler structure, capable of ensuring a broad light emitting area and a high light emitting efficiency, while manufactured in a simplified and economically efficient process. The light emitting device including: a semiconductor layer; an active layer formed on the semiconductor layer, the active layer comprising at least one of a quantum well structure, a quantum dot and a quantum line; an insulating layer formed on the active layer; and a metal layer formed on the insulating layer.
Abstract:
There is provided a light emitting device that can reduce the size of a light emitting device module by using a more simplified light emitting device that directly uses an alternating current source, prevent a decrease in luminous efficiency that is caused due to the use of a separate driving device, solve a problem with an ohmic contact of a p-type electrode, reduce the number of electrodes, and secure a larger area of light emission. A light emitting device for an alternating current source according to an aspect of the invention includes a first conductive type first semiconductor layer, a first electrode formed on the first conductive type first semiconductor layer and electrically connected to the alternating current source, a second conductive type second semiconductor layer formed on the first conductive type first semiconductor layer, a first conductive type third semiconductor layer formed on the second conductive type second semiconductor layer, and a second electrode formed on the third semiconductor layer and electrically connected to the alternating current source. Here, the light emitting device operates in response to a voltage from the alternating current source through the first electrode and the second electrode.
Abstract:
There are provided a semiconductor light emitting device using a phosphor film formed on a nanowire structure and a method of manufacturing the device, the device including: a substrate; a light emitting structure comprising a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer sequentially formed on the substrate; a plurality of nanowire structures formed on the light emitting structure and formed of a transparent material; and a phosphor film formed on at least an upper surface and a side surface of each of the plurality of nanowire structures.
Abstract:
Provided is a light emitting transistor comprising a first conductivity-type collector layer formed on a substrate; a second conductivity-type base layer formed on the collector layer; and a first conductivity-type emitter layer formed on the base layer. At least one of the collector layer, the base layer, and the emitter layer has a nanorod structure with a plurality of nanorods.
Abstract:
The present invention relates to an universal power supply apparatus wherein the power suitable for various kinds of portable electronic devices having different shapes and voltages of power input terminals is selectively supplied, and a power supply apparatus wherein a supplied voltage can be changed with only selection of a tip suitable for a portable electronic device. The power supply apparatus of the present invention includes a main unit having an electronic circuit for converting a received voltage, a cable, and a tip having a select pin. According to the present invention, as a desired power supply voltage is automatically adjusted by selecting a proper tip according to a subject electronic device, a manufacture cost is reduced. Further, as the power supply apparatus of the present invention can be used for various kinds of portable electronic devices by exchanging a tip, its operation is very easy.
Abstract:
Methods are provided for extracting color distortion data from multimedia data in a content-based multimedia search and for searching multimedia data based on the extracted color distortion data. A method is also provided for generating multimedia data to be used in the content-based multimedia search. The color distortion data includes hues of the distorted color identifying which color affected such a distortion and intensity data representing how much color distortion data affected such a distortion.
Abstract:
Disclosed herein is a needle for being connected to a suture, including: a body having a tip portion disposed at one end portion thereof and a rear end portion disposed at the other end portion thereof; and a suture connection part formed in a side surface portion of the body, wherein the suture connection part includes a reception path extended toward a lengthwise axial portion of the body and receiving a portion of the suture therein, and a closure member constituting a portion of the body and deformed by external force after a portion of the suture is received in the reception path, thereby closing a portion of the reception path.
Abstract:
A semiconductor package or device including a uniquely configured leadframe defining a plurality of leads which are arranged and partially etched in a manner facilitating a substantial reduction in burr formation resulting from a saw singulation process used to complete the fabrication of the semiconductor device. The semiconductor device includes a die pad defining multiple peripheral edge segments. In addition, the semiconductor device includes a plurality of leads which are provided in a prescribed arrangement. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, the lands, and the semiconductor die are encapsulated by the package body, with at least portions of the bottom surfaces of the die pad and the leads being exposed in a common exterior surface of the package body.
Abstract:
Disclosed herein is a needle for being connected to a suture, including: a body having a tip portion disposed at one end portion thereof and a rear end portion disposed at the other end portion thereof; and a suture connection part formed in a side surface portion of the body, wherein the suture connection part includes a reception path extended toward a lengthwise axial portion of the body and receiving a portion of the suture therein, and a closure member constituting a portion of the body and deformed by external force after a portion of the suture is received in the reception path, thereby closing a portion of the reception path.