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公开(公告)号：US20240429324A1
公开(公告)日：2024-12-26
申请号：US18419301
申请日：2024-01-22
Applicant: InvenSense, Inc.
Inventor： Jotaro Akiyama , Yuki Shibano , Kento Kaneko , Daishi Arimatsu , Troy Chase
Abstract: A sensing device is formed on a first side of a wafer device, forming a cavity between sensing device and the wafer device. An opening of the cavity faces away from the sensing device, positioned on a second side of the wafer device (positioned opposite to the first side). A hydrophobic layer is formed on the second side of the wafer device, on the cavity, on an interior and on an exterior of the sensing device. A mask is formed on the hydrophobic layer on the second side. The mask is perforated that maintains at least a portion of the hydrophobic layer covering the second side of the wafer device exposed. Light is applied to the second side of the wafer device that removes the at least the portion of the hydrophobic layer covering the second side of the wafer device that is exposed. The mask is removed.
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公开(公告)号：US20240426867A1
公开(公告)日：2024-12-26
申请号：US18214187
申请日：2023-06-26
Applicant: InvenSense, Inc.
Inventor： Matthew Julian Thompson , Roberto Martini
IPC: G01P15/125 , G01P21/00
Abstract: A MEMS sensor may include multiple sense electrodes located relative to respective portions of one or more proof masses of a MEMS layer of the sensor. Individual sense electrodes are capable of individual calibration within the drive and/or sense path for the sense electrode. A distance between each individual sense electrode relative to a proof mass is determined for the at-rest state of the sensor. Calibration values are determined based on these distances, and individual drive and/or sense signals associated with each sense electrode are modified to adjust for changes in distance, such as are caused by shifting, tilting, or bending of the MEMS layer or substrate.
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公开(公告)号：US12161507B2
公开(公告)日：2024-12-10
申请号：US18387043
申请日：2023-11-05
Applicant: InvenSense, Inc.
Inventor： Fabian T. Goericke , Richard J. Przybyla , Benjamin E. Eovino
Abstract: An ultrasonic transducer device comprises a piezoelectric micromachined ultrasonic transducer (PMUT), a transmitter with first and second differential outputs, and a controller. The PMUT includes a membrane layer. A bottom electrode layer, comprising a first bottom electrode and a second bottom electrode, is disposed above the membrane layer. The piezoelectric layer is disposed above the bottom electrode layer. The top electrode layer is disposed above the piezoelectric layer and comprises a segmented center electrode disposed above a center of the membrane layer and a segmented outer electrode spaced apart from the segmented center electrode. The controller, responsive to the PMUT being placed in a transmit mode, is configured to couple the first and second segments of the bottom electrode layer with ground, couple the first output of the transmitter with the segments of the segmented center electrode, and couple the second output with the segments of the segmented outer electrode.
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公开(公告)号：US12158460B2
公开(公告)日：2024-12-03
申请号：US17592800
申请日：2022-02-04
Applicant: INVENSENSE, INC.
Inventor： Mamdouh Yanni , Eiji Iwatsuki
Abstract: Environmental conditions affecting a sensor having a thermal coefficient are compensated by applying an adaptive filter to an environmental condition reference signal. The resulting adaptive cancellation signal may be used to provide feedback control to a first heating element.
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公开(公告)号：US12139397B2
公开(公告)日：2024-11-12
申请号：US17028552
申请日：2020-09-22
Applicant: INVENSENSE, INC.
Inventor： Daesung Lee , Alan Cuthbertson
Abstract: Selective self-assembled monolayer patterning with sacrificial layer for devices is provided herein. A sensor device can include a handle layer and a device layer that comprises a first side and a second side. First portions of the first side are operatively connected to defined portions of the handle layer. At least one area of the second side comprises an anti-stiction area formed with an anti-stiction coating. The device can also include a Complementary Metal-Oxide-Semiconductor (CMOS) wafer operatively connected to second portions of the second side of the device layer. The CMOS wafer comprises at least one bump stop. The anti-stiction area faces the at least one bump stop.
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Patent Agency Ranking
16.发明公开公开(公告)号：US20240346380A1
公开(公告)日：2024-10-17
申请号：US18634510
申请日：2024-04-12
Applicant: InvenSense, Inc.
Inventor： Juan S. Mejia SANTAMARIA , Abbas ATAYA , Rémi Louis Clément PONÇOT
IPC: G06N20/00
CPC classification number: G06N20/00
Abstract: Disclosed embodiments provide data augmentation techniques in which collected sensor data and simulated sensor data created by transforming collected sensor data are used to train a machine learning model (MLM), the MLM is then deployed on an integrated circuit chip of an embedded device, live sensor data received by the embedded device is then either transformed and input to the MLM or input to the MLM without transformation, and the MLM then performs a prediction by, for example, recognizing a gesture made by the user of the embedded device.
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公开(公告)号：US20240302183A1
公开(公告)日：2024-09-12
申请号：US18596233
申请日：2024-03-05
Applicant: INVENSENSE, INC
Inventor： Gennadii Berkovich , Dmitri Churikov , Chris Goodall , Jacques Georgry , Abdelrahman Ali
IPC: G01C21/00
CPC classification number: G01C21/3841 , G01C21/3807 , G01C21/3848
Abstract: Systems and methods are disclosed for creating a magnetic map by obtaining magnetic field measurements from a plurality of platforms. A first set of poses for each platform is determined and information from the magnetic map is obtained for any existing magnetic field values for the first set. Magnetic constraints on poses of the platform are determined and used for determining a second set of poses for each platform. The magnetic field values of the magnetic map are then updated based at least in part on the second set of poses for each platform.
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18.发明公开公开(公告)号：US20240230400A9
公开(公告)日：2024-07-11
申请号：US18490312
申请日：2023-10-19
Applicant: INVENSENSE, INC. , TDK Electronics AG
Inventor： Pirmin Rombach , Kurt Rasmussen , Dennis Mortensen , Jan Ravnkilde , Cheng-Yen Liu , Jotaro Akiyama , Sushil Bharatan , Troy Chase
CPC classification number: G01H11/06 , H04R7/10 , H04R7/12 , H04R19/04 , H04R31/003 , H04R2201/003 , H04R2307/023
Abstract: Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.
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公开(公告)号：US20240171188A1
公开(公告)日：2024-05-23
申请号：US18500886
申请日：2023-11-02
Applicant: INVENSENSE, INC.
Inventor： Wouter Bracke , Bert Serneels , Athanasios Sarafianos , Tim Piessens
IPC: H03M1/08 , G01D5/24 , G01R19/00 , G01R19/257
CPC classification number: H03M1/0827 , G01D5/24 , G01R19/0053 , G01R19/257 , G01R19/0023
Abstract: A continuous time single drive capacitance-to-voltage (C2V) converter can be employed for single sensor, balanced single sensor, or differential sensor. First sensor and/or second sensor can be employed to sense a condition. A capacitive bridge can comprise a first capacitive digital-to-analog-converter (DAC) and second capacitive DAC as a differential node. First capacitive DAC can be associated with first sensor, and second capacitive DAC can be associated with a third capacitive DAC, in series with first sensor, if single sensor is implemented or the second sensor if balanced single sensor or differential sensor is implemented. Capacitive bridge can be connected to differential input of a capacitive feedback amplifier that can be a continuous time amplifier with no signal sampling and no noise folding. Capacitive feedback amplifier can comprise capacitively coupled input common mode feedback, which can remove noise from a sensor drive, and output common mode feedback.
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20.发明授权公开(公告)号：US11990917B2
公开(公告)日：2024-05-21
申请号：US17805761
申请日：2022-06-07
Applicant: INVENSENSE, INC.
Inventor： Omid Oliaei , Stephen Bart
CPC classification number: H03M1/462 , H03M1/008 , H03M1/0604 , H03M1/0626 , H03M1/122
Abstract: The present invention relates to an incremental analog to digital converter incorporating noise shaping and residual error quantization. In one embodiment, a circuit includes an incremental analog to digital converter, comprising a loop filter that filters an analog input signal in response to receiving a reset signal, resulting in a filtered analog input signal, and a successive approximation register (SAR) quantizer, coupled with the filtered analog input signal, that converts the filtered analog input signal to an intermediate digitized output of a first resolution based on a reference voltage, wherein the SAR quantizer comprises a feedback loop that shapes quantization noise generated by the SAR quantizer as a result of converting the filtered analog input signal; and a digital filter, coupled with the intermediate digitized output, that generates a digitized output signal of a second resolution, greater than the first resolution, by digitally filtering the intermediate digitized output.
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