公开(公告)号：US20070293667A1

公开(公告)日：2007-12-20

申请号：US11300626

申请日：2005-12-14

Applicant: Werner Mederski ,  Ralf Devant ,  Gerhard Barnickel ,  Sabine Bernotat-Danielowski ,  James Vickers ,  Bertram Cezanne ,  Daljit Dhanoa ,  Bao-Ping Zhao ,  James Rinker ,  Mark Player ,  Edward Jaeger ,  Richard Soll

Inventor： Werner Mederski ,  Ralf Devant ,  Gerhard Barnickel ,  Sabine Bernotat-Danielowski ,  James Vickers ,  Bertram Cezanne ,  Daljit Dhanoa ,  Bao-Ping Zhao ,  James Rinker ,  Mark Player ,  Edward Jaeger ,  Richard Soll

IPC: C07D239/72 ,  C07D403/02 ,  C07D413/02

CPC classification number: C07D239/94 ,  C07D403/12 ,  C07D405/12 ,  C07D409/10 ,  C07D409/14 ,  C07D413/12

Abstract: Quinazolines of the formula I in which R, R1, R2, R3, R4 and Y have the meaning indicated in Patent Claim 1, and their salts or solvates as glycoprotein IbIX antagonists.

Abstract translation: 其中R 1，R 2，R 2，R 3，R 4和Y 4的式I的喹唑啉 具有专利权利要求1中所示的含义，并且其盐或溶剂合物作为糖蛋白IbIX拮抗剂。

公开(公告)号：US20070238206A1

公开(公告)日：2007-10-11

申请号：US11762944

申请日：2007-06-14

Applicant: Majid Aghababazadeh ,  Jose Estabil ,  Nader Pakdaman ,  Gary Steinbrueck ,  James Vickers

Inventor： Majid Aghababazadeh ,  Jose Estabil ,  Nader Pakdaman ,  Gary Steinbrueck ,  James Vickers

IPC: H01L21/66

CPC classification number: H01L22/20 ,  G01R31/2831 ,  G01R31/3025 ,  G01R31/31707 ,  G01R31/31718 ,  G01R31/318505 ,  G01R31/318511 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter at the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed.

公开(公告)号：US20060019974A1

公开(公告)日：2006-01-26

申请号：US10380908

申请日：2001-09-17

Applicant: Werner Mederski ,  Ralf Devant ,  Maria Devant ,  Gerhard Barnickel ,  Sabine Bernotat-Danielowski ,  James Vickers ,  Bertram Cezanne ,  Daljit Dhanoa ,  Bao-Ping Zhao ,  James Rinker ,  Mark Player ,  Edward Jaeger ,  Richard Soll

Inventor： Werner Mederski ,  Ralf Devant ,  Maria Devant ,  Gerhard Barnickel ,  Sabine Bernotat-Danielowski ,  James Vickers ,  Bertram Cezanne ,  Daljit Dhanoa ,  Bao-Ping Zhao ,  James Rinker ,  Mark Player ,  Edward Jaeger ,  Richard Soll

IPC: A61K31/517 ,  C07D403/02 ,  C07D239/94

CPC classification number: C07D239/94 ,  C07D239/95 ,  C07D401/12 ,  C07D403/12 ,  C07D405/12 ,  C07D409/04 ,  C07D409/14

Abstract: Quinazolines of the formula (I) in which R, R1, R2, R3, R4 and Y have the meaning indicated in Patent claim 1, and their salts or solvates as glycoprotein IbIX antagonists.

Abstract translation: 式（I）的喹唑啉其中R 1，R 2，R 2，R 3，R 4， 并且Y具有专利权利要求1中所示的含义，并且其盐或溶剂合物作为糖蛋白IbIX拮抗剂。

公开(公告)号：US20050130888A1

公开(公告)日：2005-06-16

申请号：US10517653

申请日：2003-06-13

Applicant: Adrian West ,  Meng Chuah ,  James Vickers ,  Roger Chung

Inventor： Adrian West ,  Meng Chuah ,  James Vickers ,  Roger Chung

IPC: A61K38/17 ,  A61P25/16 ,  A61P25/28

CPC classification number: A61K38/1709

Abstract: A method of stimulating neuronal growth or repair comprising exposing a target neuron or neuronal area to a solution of the metallothionein isoform MT-IIA.

Abstract translation: 刺激神经元生长或修复的方法包括将靶神经元或神经元区域暴露于金属硫蛋白亚型MT-IIA的溶液中。

公开(公告)号：US07547702B2

公开(公告)日：2009-06-16

申请号：US10380908

申请日：2001-09-17

Applicant: Werner Mederski ,  Maria Devant, legal representative ,  Gerhard Barnickel ,  Sabine Bernotat-Danielowski ,  James Vickers ,  Bertram Cezanne ,  Daljit Dhanoa ,  Bao-Ping Zhao ,  James Rinker ,  Mark R. Player ,  Edward Jaegar ,  Richard Soll

Inventor： Ralf Devant

IPC: A61K31/517 ,  A61K31/535 ,  C07D239/72 ,  C07D413/12

CPC classification number: C07D239/94 ,  C07D239/95 ,  C07D401/12 ,  C07D403/12 ,  C07D405/12 ,  C07D409/04 ,  C07D409/14

Abstract: Quinazolines of the formula (I) in which R, R1, R2, R3, R4 and Y have the meaning indicated in Patent claim 1, and their salts or solvates as glycoprotein 1bIX antagonists.

Abstract translation: 其中R，R 1，R 2，R 3，R 4和Y具有专利权利要求1中所示含义的式（I）的喹唑啉及其作为糖蛋白1bIX拮抗剂的盐或溶剂合物。

公开(公告)号：US20050279923A1

公开(公告)日：2005-12-22

申请号：US10872595

申请日：2004-06-22

Applicant: Radu Ispasoiu ,  Thomas Gockel ,  James Vickers

Inventor： Radu Ispasoiu ,  Thomas Gockel ,  James Vickers

IPC: F25B21/02 ,  G02B7/02 ,  H01J3/14 ,  H01J5/02 ,  H01L31/0203 ,  H01L31/024

CPC classification number: G02B7/028 ,  F25B21/02 ,  H01L31/0203 ,  H01L31/024

Abstract: An integrated housing for a lens and a photodetector, which is being cooled to low temperatures to enable the detector to detect faint emission of photons. An enclosure is provided to which a lens is affixed from one side using a retaining ring, and a photodetector is affixed from the opposite side. The enclosure is affixed to a TE cooler. The enclosure and the retaining ring are made from materials having similar thermal expansion coefficients.

Abstract translation: 用于透镜和光电检测器的集成外壳，其被冷却至低温以使得检测器能够检测光子的微弱发射。 提供了一个外壳，使用保持环从一侧固定透镜，并且从相对侧固定光电检测器。 外壳固定在TE冷却器上。 外壳和保持环由具有相似热膨胀系数的材料制成。

公开(公告)号：US20070206846A1

公开(公告)日：2007-09-06

申请号：US11745732

申请日：2007-05-08

Applicant: Daniel COTTON ,  Nader PAKDAMAN ,  James VICKERS ,  Thomas WONG

Inventor： Daniel COTTON ,  Nader PAKDAMAN ,  James VICKERS ,  Thomas WONG

IPC: G06K9/00

CPC classification number: G01R31/311

Abstract: A system for probe-less non-invasive detection of electrical signals from integrated circuit devices is disclosed. The system includes an illumination source, collection optics, imaging optics, and a photon sensor. In a navigation mode, the light source is activated and the imaging optics is used to identify the target area on the chip and appropriately position the collection optics. Once the collection optics is appropriately positioned, the light source is deactivated and the photon sensor is used to detect photons emitted from the chip. No mention of cooling (active device measurement capability) and advanced optics to detect the features (SIL).

Abstract translation: 公开了一种用于从集成电路器件进行无信号探测电信号的系统。 该系统包括照明源，收集光学器件，成像光学器件和光子传感器。 在导航模式中，光源被激活，成像光学元件用于识别芯片上的目标区域并适当地定位收集光学元件。 一旦收集光学器件被适当地定位，则光源被去激活，并且光子传感器用于检测从芯片发射的光子。 没有提到冷却（有源器件测量能力）和高级光学元件来检测特征（SIL）。

公开(公告)号：US20070205608A1

公开(公告)日：2007-09-06

申请号：US11676270

申请日：2007-02-16

Applicant: James Vickers ,  Ian White ,  David White ,  Joshua Baker

Inventor： James Vickers ,  Ian White ,  David White ,  Joshua Baker

IPC: E05C19/12

CPC classification number: E05B13/002 ,  E05B1/0092 ,  E05B5/00 ,  E05B17/0025 ,  E05C19/145 ,  Y10S292/31 ,  Y10T292/0917 ,  Y10T292/1092

Abstract: The present invention is directed to a latching system that includes a latch assembly, a cup, and a keeper plate. The latch assembly includes a base, a lever, and a catch. The lever is pivotally connected to the base and the catch is pivotally connected to the lever. The base is pivotally attached to the cup such that it rotates about an axis of rotation that is perpendicular in direction in relation to the direction of the axis of rotation of the lever relative to the base. The keeper plate includes a keeper projection. The lever can be lifted and the latch assembly rotated about the axis of rotation of the base to clear the keeper from the catch and thereby allow the opening of a first closure member relative to a second closure member.

Abstract translation: 本发明涉及一种包括闩锁组件，杯子和保持板的闭锁系统。 闩锁组件包括基座，杠杆和卡扣。 杠杆枢转地连接到基座，并且卡扣枢转地连接到杠杆。 基座枢转地附接到杯子，使得其围绕相对于杆相对于基座的旋转轴线的方向在垂直于方向的旋转轴线旋转。 保持板包括保持器突起。 杠杆可被提升，并且闩锁组件围绕基座的旋转轴线旋转，以使锁定器从扣件中清除，从而允许第一关闭件相对于第二封闭件打开。

公开(公告)号：US20050090916A1

公开(公告)日：2005-04-28

申请号：US10927406

申请日：2004-08-25

Applicant: Majid Aghababazadeh ,  Jose Estabil ,  Nader Pakdaman ,  Gary Steinbrueck ,  James Vickers

Inventor： Majid Aghababazadeh ,  Jose Estabil ,  Nader Pakdaman ,  Gary Steinbrueck ,  James Vickers

IPC: G01R31/28 ,  G01R31/317 ,  G01R31/3185 ,  H01L21/66 ,  H01L23/544 ,  G06F17/00 ,  H01L21/301 ,  H01L21/46 ,  H01L21/78

CPC classification number: H01L22/20 ,  G01R31/2831 ,  G01R31/3025 ,  G01R31/31707 ,  G01R31/31718 ,  G01R31/318505 ,  G01R31/318511 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter at the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed.

Abstract translation: 可以从晶片处于部分制造状态开始分析晶片的制造。 可以在晶片的管芯的有效区域上的多个位置处确定指定性能参数的值。 已知指定的性能参数指示制造中的特定制造工艺。 然后可以基于多个位置处的性能参数的值的方差来获得评估信息。 这可以在不影响从芯片产生的芯片的可用性的情况下完成。 评价信息可以用于评估执行由性能参数值指示的包括特定制造过程的一个或多个处理。

公开(公告)号：US20050090027A1

公开(公告)日：2005-04-28

申请号：US10927258

申请日：2004-08-25

Applicant: Majid Aghababazadeh ,  Jose Estabil ,  Nader Pakdaman ,  Gary Steinbrueck ,  James Vickers

Inventor： Majid Aghababazadeh ,  Jose Estabil ,  Nader Pakdaman ,  Gary Steinbrueck ,  James Vickers

IPC: G01R31/28 ,  G01R31/317 ,  G01R31/3185 ,  H01L21/66 ,  H01L23/544 ,  G01R31/26 ,  H01L21/301 ,  H01L21/46 ,  H01L21/78 ,  H01L23/58 ,  H01L29/10

CPC classification number: H01L22/20 ,  G01R31/2831 ,  G01R31/3025 ,  G01R31/31707 ,  G01R31/31718 ,  G01R31/318505 ,  G01R31/318511 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter at the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed.

Abstract translation: 可以从晶片处于部分制造状态开始分析晶片的制造。 可以在晶片的管芯的有效区域上的多个位置处确定指定性能参数的值。 已知指定的性能参数指示制造中的特定制造工艺。 然后可以基于多个位置处的性能参数的值的方差来获得评估信息。 这可以在不影响从芯片产生的芯片的可用性的情况下完成。 评价信息可以用于评估执行由性能参数值指示的包括特定制造过程的一个或多个处理。