Abstract:
Embodiments of the present invention may include an integrated circuit module structure for a high-density mounting. An embodiment may include a wiring board, having a mounting space with a mounting length determined in a first direction and a mounting width determined in a second direction, on at least one surface thereof, and a plurality of integrated circuit packages having a package mounting combination length longer than the mounting length of the wiring board. An embodiment may also have some packages among the plurality of integrated circuit packages mounted directly on the mounting space, while other packages are mounted indirectly on the mounting space. The present embodiment may have packages that are overlapped horizontally and vertically distant from one another. Embodiments allow a plurality of chips or packages to be mounted in a limited area without changing a form factor of integrated circuit module even when integrated circuit chip or package size increases.
Abstract:
A clock generator and method of generating a spread spectrum clock (SSC) signal, in which a delay cell array (DCA) control signal may be output based on one of a received spread spectrum clock generator (SSCG) signal and a feedback signal. The SSC signal may be generated based on at least one of the DCA control signal and a plurality of path control signals. Modulation properties of the SSC signal may be controlled based on a plurality of path control signals.
Abstract:
For ODT (on-die termination) control within a memory module system, just one pin from the memory controller is used for sending command signals indicating an activated one of the memory devices. The activated memory device includes components that are turned on for generating the ODT control signal for controlling an ODT circuit of inactivated memory device(s). The components for generating an ODT control signal within the inactivated memory devices are turned off for minimized power consumption.
Abstract:
A data transmission system and method characterized by the use of multiple differential output amplifiers to transmits differential data signals that vary in accordance with control signals derived from a reference data output strobe signal, and multiple differential amplifiers to receive the differential data signals and detect such variations to generate a data input strobe signal corresponding to the data output strobe signal.
Abstract:
In the memory module, a buffer is disposed on one of at least two circuit boards in the memory module. The buffer is for buffering signals for memory chips on at least two circuit boards in the memory module.
Abstract:
Pairs of registers with reduced pins are disposed to overlap on front and back surfaces of a memory module. An input signal INS is transferred through the registers in series in a daisy chain fashion to avoid divergence of the input signal INS for preserved signal integrity. Each register buffers the input signal INS to memory banks disposed closely to sides of the register for reduced wiring area.
Abstract:
In the memory module, a buffer is disposed on one of at least two circuit boards in the memory module. The buffer is for buffering signals for memory chips on at least two circuit boards in the memory module.
Abstract:
Pairs of registers with reduced pins are disposed to overlap on front and back surfaces of a memory module. An input signal INS is transferred through the registers in series in a daisy chain fashion to avoid divergence of the input signal INS for preserved signal integrity. Each register buffers the input signal INS to memory banks disposed closely to sides of the register for reduced wiring area.