公开(公告)号：US07545039B2

公开(公告)日：2009-06-09

申请号：US11410986

申请日：2006-04-26

Applicant: Yung-Yu Hsu ,  Rong-Chang Feng ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Ji-Cheng Lin ,  Shan-Pu Yu ,  Shou-Lung Chen ,  Chih-Yuah Cheng

Inventor： Yung-Yu Hsu ,  Rong-Chang Feng ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Ji-Cheng Lin ,  Shan-Pu Yu ,  Shou-Lung Chen ,  Chih-Yuah Cheng

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2201/09909 ,  H01L2924/00

Abstract: A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.

Abstract translation: 提供一种用于减小通孔应力的结构及其制造方法。 使用栅格结构中的应力块与绝缘材料的主要部分直接接触，具有高的热膨胀系数，使厚度方向上的一个或多个导线或通孔被固定。 因此，由温度加载引起的剪切应力可以被应力块阻挡或吸收。

公开(公告)号：US20070210457A1

公开(公告)日：2007-09-13

申请号：US11308180

申请日：2006-03-10

Applicant: Ji-Cheng Lin ,  Yao-Sheng Lin ,  Shyh-Ming Chang ,  Su-Tsai Lu ,  Hsien-Chie Cheng ,  Tai-Hong Chen

Inventor： Ji-Cheng Lin ,  Yao-Sheng Lin ,  Shyh-Ming Chang ,  Su-Tsai Lu ,  Hsien-Chie Cheng ,  Tai-Hong Chen

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L24/10 ,  H01L23/49811 ,  H01L24/13 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A composite bump suitable for disposing on a substrate pad is provided. The composite bump includes a compliant body and an outer conductive layer. The coefficient of thermal expansion (CTE) of the compliant body is between 5 ppm/° C. and 200 ppm/° C. The outer conductive layer covers the compliant body and is electrically connected to the pad. The compliant body can provide a stress buffering effect for a bonding operation. Furthermore, by setting of the CTE of the compliant body within a preferable range, damages caused by thermal stress are reduced while the bonding effect is enhanced.

Abstract translation: 提供了适合于设置在基板焊盘上的复合凸块。 复合凸块包括柔性本体和外导电层。 柔性体的热膨胀系数（CTE）在5ppm /℃和200ppm /℃之间。外部导电层覆盖柔性体并与衬垫电连接。 柔性体可以为粘接操作提供应力缓冲效果。 此外，通过将柔性体的CTE设定在优选范围内，由于热应力引起的损伤降低，同时结合效果增强。