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公开(公告)号：US20070290379A1
公开(公告)日：2007-12-20
申请号：US11453388
申请日：2006-06-15
Applicant: Thomas E. Dueber , John D. Summers
Inventor： Thomas E. Dueber , John D. Summers
IPC: H01L23/29
CPC classification number: C08G73/1039 , C08G73/1064 , C09D179/08 , H01G4/224 , H01G9/08 , H05K1/162 , H05K2201/0154 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763
Abstract: Disclosed area compositions comprising: a polyimide resin with a water absorption of 2% or less and, optionally, one or more of an electrically insulated filler, a defoamer and a colorant and one or more organic solvents. The compositions are useful as encapsulants and have a consolidation temperature of 190° C. or less.
Abstract translation: 公开的区域组合物包括：吸水率为2％或更低的聚酰亚胺树脂，以及任选的一种或多种电绝缘填料，消泡剂和着色剂以及一种或多种有机溶剂。 该组合物可用作密封剂并具有190℃或更低的固结温度。
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12.发明授权
公开(公告)号：US5393864A
公开(公告)日：1995-02-28
申请号：US051828
申请日：1993-04-26
Applicant: John D. Summers
Inventor： John D. Summers
CPC classification number: C08G73/1039 , H01B3/306 , H05K1/0346 , H05K3/4676
Abstract: A random polyimide copolymer, based on a rigid dianhydride, a rigid diamine and an additional diamine and/or dianhydride containing one or more flexibilizing linkages. Soft-baked coatings of the poly(amic acid) precursor are readily processed using conventional aqueous base developers, such as tetramethylammonium hydroxide. The polyimide and soft-baked coatings are useful as a dielectric layer In multichip module applications or as a stress buffer coating.
Abstract translation: 基于刚性二酸酐的无规聚酰亚胺共聚物，刚性二胺和含有一个或多个柔性键的另外的二胺和/或二酐。 使用常规的水性碱性显影剂如氢氧化四甲基铵容易地加工聚（酰胺酸）前体的软烘烤涂层。 聚酰亚胺和软烘烤涂层可用作多芯片模块应用中的介电层或作为应力缓冲涂层。
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公开(公告)号：US08270145B2
公开(公告)日：2012-09-18
申请号：US11949914
申请日：2007-12-04
Applicant: Thomas Eugene Dueber , Frank Leonard Schadt, III , John D. Summers
Inventor： Thomas Eugene Dueber , Frank Leonard Schadt, III , John D. Summers
CPC classification number: H05K1/162 , C08G73/22 , C09D11/033 , C09D11/102 , C09D179/04 , H01L23/49894 , H01L2924/0002 , H05K3/285 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763 , Y10T29/49146 , H01L2924/00
Abstract: This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed.
Abstract translation: 本公开涉及使用这种组合物来提供保护性涂层，特别是电子部件的组合物和方法。 公开了涂覆有可以嵌入印刷线路板中的聚苯并恶唑密封剂的箔状陶瓷电容器。
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公开(公告)号：US20100067168A1
公开(公告)日：2010-03-18
申请号：US12514822
申请日：2007-12-11
Applicant: John D. Summers , Tsutomu Mutoh
Inventor： John D. Summers , Tsutomu Mutoh
IPC: H01G4/224
CPC classification number: H05K1/162 , H01G4/224 , H01L23/50 , H01L2924/0002 , H05K3/1291 , H05K2201/0154 , H05K2201/0158 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763 , H05K2203/1126 , H01L2924/00
Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
Abstract translation: 本发明涉及组合物，以及这些组合物用于保护涂层，特别是电子器件的用途。 本发明涉及一种涂覆有复合密封剂并嵌入印刷线路板的烧制箔陶瓷电容器。
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公开(公告)号：US20080185561A1
公开(公告)日：2008-08-07
申请号：US11985950
申请日：2007-11-19
Applicant: John D. Summers
Inventor： John D. Summers
CPC classification number: H01B1/22 , C08G59/245 , C08L63/00 , C08L79/08 , H01C7/005 , H01C17/06586 , H05K1/095 , H05K1/167 , H05K2201/0154 , C08L2666/22
Abstract: Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.
Abstract translation: 公开了由包含聚酰亚胺组分，空间位阻疏水环氧组分和具有2.1至3.0之间的汉森极性溶解度参数并且具有210-260℃的标准沸点的溶剂组分的聚合物厚膜电阻器制剂制成的电阻器组合物。 聚酰亚胺成分（“A”）与环氧成分（“B”）的重量比为A：B，其中A在1〜15之间，B为1。
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Patent Agency Ranking
16.发明授权Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes 有权具有可回收结晶度和相关工艺的可熔融加工的热塑性无规共聚酰亚胺公开(公告)号：US06476177B2
公开(公告)日：2002-11-05
申请号：US09742860
申请日：2000-12-21
Applicant: Brian C. Auman , William R Corcoran, Jr. , John R Dodd , Mark A Guidry , John D. Summers
Inventor： Brian C. Auman , William R Corcoran, Jr. , John R Dodd , Mark A Guidry , John D. Summers
IPC: C08G7310
CPC classification number: C08G73/1017 , C08G73/101 , C08G73/1014 , C08G73/1042 , C08G73/1071
Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.
Abstract translation: 本文公开了随机，可熔融加工的共聚酰亚胺。 这些共聚酰亚胺是半结晶的，并且从它们的熔体中显示可回收的（半）结晶性。 还公开了涉及制备和制造这些共聚酰亚胺成为具有预定形状的有用制品中的溶液聚合或熔融聚合的相关方法。
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公开(公告)号：US5622654A
公开(公告)日：1997-04-22
申请号：US602394
申请日：1996-02-16
Applicant: John D. Summers , Wilson Tam
Inventor： John D. Summers , Wilson Tam
IPC: C07D409/06 , C09B23/01 , C09B23/14 , G02F1/361 , F21V9/00 , C07D401/00
CPC classification number: C07D409/06 , C09B23/0075 , C09B23/145 , G02F1/3614 , G02F1/3615
Abstract: Nonlinear optical elements are disclosed which comprise a polyimide which is solution and/or melt processible, and a poled NLO dye. Also disclosed is a process for making such elements, and devices in which they can be used. Disclosed NLO dyes include ##STR1##
Abstract translation: 公开了包括溶液和/或可熔融加工的聚酰亚胺和极化的NLO染料的非线性光学元件。 还公开了制造这些元件的方法以及可以使用它们的装置。 披露的NLO染料包括
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公开(公告)号：US07604754B2
公开(公告)日：2009-10-20
申请号：US11985950
申请日：2007-11-19
Applicant: John D. Summers
Inventor： John D. Summers
CPC classification number: H01B1/22 , C08G59/245 , C08L63/00 , C08L79/08 , H01C7/005 , H01C17/06586 , H05K1/095 , H05K1/167 , H05K2201/0154 , C08L2666/22
Abstract: Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.
Abstract translation: 公开了由包含聚酰亚胺组分，空间位阻疏水环氧组分和具有2.1至3.0之间的汉森极性溶解度参数并且具有210-260℃的标准沸点的溶剂组分的聚合物厚膜电阻器制剂制成的电阻器组合物。 聚酰亚胺成分（“A”）与环氧成分（“B”）的重量比为A：B，其中A在1〜15之间，B为1。
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公开(公告)号：US20090141425A1
公开(公告)日：2009-06-04
申请号：US11949914
申请日：2007-12-04
Applicant: Thomas Eugene Dueber , Frank Leonard Schadt, III , John D. Summers
Inventor： Thomas Eugene Dueber , Frank Leonard Schadt, III , John D. Summers
CPC classification number: H05K1/162 , C08G73/22 , C09D11/033 , C09D11/102 , C09D179/04 , H01L23/49894 , H01L2924/0002 , H05K3/285 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763 , Y10T29/49146 , H01L2924/00
Abstract: This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed.
Abstract translation: 本公开涉及使用这种组合物来提供保护性涂层，特别是电子部件的组合物和方法。 公开了涂覆有可以嵌入印刷线路板中的聚苯并恶唑密封剂的箔状陶瓷电容器。
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公开(公告)号：US06469126B1
公开(公告)日：2002-10-22
申请号：US09741943
申请日：2000-12-21
Applicant: Brian C. Auman , William R. Corcoran, Jr. , John D. Summers
Inventor： Brian C. Auman , William R. Corcoran, Jr. , John D. Summers
IPC: C08G7310
CPC classification number: C08G73/1014 , C08G73/101 , C08G73/1017 , C08G73/1042 , C08G73/1071
Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.
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