公开(公告)号：US06476177B2

公开(公告)日：2002-11-05

申请号：US09742860

申请日：2000-12-21

申请人： Brian C. Auman ,  William R Corcoran, Jr. ,  John R Dodd ,  Mark A Guidry ,  John D. Summers

发明人： Brian C. Auman ,  William R Corcoran, Jr. ,  John R Dodd ,  Mark A Guidry ,  John D. Summers

IPC分类号： C08G7310

CPC分类号： C08G73/1017 ,  C08G73/101 ,  C08G73/1014 ,  C08G73/1042 ,  C08G73/1071

摘要： Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

摘要翻译： 本文公开了随机，可熔融加工的共聚酰亚胺。 这些共聚酰亚胺是半结晶的，并且从它们的熔体中显示可回收的（半）结晶性。 还公开了涉及制备和制造这些共聚酰亚胺成为具有预定形状的有用制品中的溶液聚合或熔融聚合的相关方法。

公开(公告)号：US06469126B1

公开(公告)日：2002-10-22

申请号：US09741943

申请日：2000-12-21

申请人： Brian C. Auman ,  William R. Corcoran, Jr. ,  John D. Summers

发明人： Brian C. Auman ,  William R. Corcoran, Jr. ,  John D. Summers

IPC分类号： C08G7310

CPC分类号： C08G73/1014 ,  C08G73/101 ,  C08G73/1017 ,  C08G73/1042 ,  C08G73/1071

摘要： Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

公开(公告)号：US07745516B2

公开(公告)日：2010-06-29

申请号：US11248803

申请日：2005-10-12

申请人： Thomas Eugene Dueber ,  John D. Summers ,  Brian C. Auman ,  Munirpallam Appadorai Subramanian ,  Nyrissa S. Rogado

发明人： Thomas Eugene Dueber ,  John D. Summers ,  Brian C. Auman ,  Munirpallam Appadorai Subramanian ,  Nyrissa S. Rogado

IPC分类号： C08K5/05 ,  C08K5/10 ,  C08K5/103 ,  C08L79/08 ,  B32B15/08

CPC分类号： H01L21/02118 ,  C08L63/00 ,  C08L79/08 ,  C08L2205/02 ,  G03F7/023 ,  G03F7/0387 ,  H01L21/02282 ,  H01L21/312 ,  H05K1/095 ,  H05K2201/0154 ,  Y10T428/31522 ,  C08L2666/20 ,  C08L2666/22

摘要： Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.

摘要翻译： 吸水性聚酰亚胺/环氧基组合物（如糊剂（或溶液））特别适用于制作电子可屏幕印刷的材料和电子元件。 发现一组疏水性环氧化物（和可溶性聚酰亚胺）特别耐吸湿性。 用这些环氧化物（和这些聚酰亚胺）制成的聚酰亚胺/环氧树脂浆料可以任选含有热交联剂，粘合促进剂，封闭异氰酸酯和其它无机填料。 本发明的聚酰亚胺/环氧树脂糊料的玻璃化转变温度可以高于250℃，吸水率小于2％，并且具有正的溶解度测量。

公开(公告)号：US06908685B2

公开(公告)日：2005-06-21

申请号：US10343277

申请日：2001-08-23

申请人： Kenji Uhara ,  Kouichi Sawasaki ,  Naofumi Yasuda ,  Brian C. Auman ,  John D. Summers

发明人： Kenji Uhara ,  Kouichi Sawasaki ,  Naofumi Yasuda ,  Brian C. Auman ,  John D. Summers

IPC分类号： C08G73/10 ,  H05K1/03 ,  B32B15/08 ,  B32B27/08 ,  C08L77/00

CPC分类号： H05K1/0346 ,  C08G73/1042 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31721

摘要： The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

摘要翻译： 本发明提供一种聚酰亚胺膜，其由均苯四酸二酐制备的聚酰胺酸与10至60mol％的苯二胺和40至90mol％的3,4'-氧二苯胺（基于总二胺）组合。 聚酰亚胺薄膜通过在其表面上提供金属互连作为柔性电路中的金属互连板基板，芯片级封装（CSP），球栅阵列（BGA）或带自动键合（TAB） 高弹性模量，低热膨胀系数，碱蚀刻性和成膜性之间的平衡。

公开(公告)号：US5202412A

公开(公告)日：1993-04-13

申请号：US591225

申请日：1990-10-02

申请人： Brian C. Auman ,  John D. Summers

发明人： Brian C. Auman ,  John D. Summers

IPC分类号： C08G73/10 ,  C08G73/14 ,  C08L79/08

CPC分类号： C08G73/1042 ,  C08G73/14

摘要： Soluble polymeric precursors having oligomeric imide and amic acid segments, which are suitable to form segmented, preferably insoluble, polyimide copolymers.

公开(公告)号：US09050784B2

公开(公告)日：2015-06-09

申请号：US13315324

申请日：2011-12-09

申请人： Brian C. Auman ,  Carl Robert Haeger

发明人： Brian C. Auman ,  Carl Robert Haeger

IPC分类号： H01L31/048 ,  B32B27/34 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/30 ,  H01L31/049

CPC分类号： B32B27/34 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/304 ,  B32B2457/12 ,  H01L31/049 ,  Y02E10/50 ,  Y10T428/251 ,  Y10T428/256 ,  Y10T428/259 ,  Y10T428/269

摘要： A back-sheet for a photovoltaic module is provided comprising a fire resistant polymeric film and a second polymeric film adhered to the fire resistant polymeric film. The fire resistant polymeric film comprises a polymer that does not melt at temperatures below 275° C. and an inorganic particulate filler selected from inorganic metal oxides and inorganic metal nitrides, and combinations thereof. The fire resistant polymeric film contains from 40 to 75 weight percent inorganic particulate filler based on the total weight of the film, and the fire resistant polymeric film has an average thickness of at least 85 microns. A photovoltaic module comprising such a back-sheet is also provided.

摘要翻译： 提供了一种用于光伏模块的背板，其包括耐火聚合物膜和粘附到耐火聚合物膜上的第二聚合物膜。 耐火聚合物膜包括在低于275℃的温度下不熔化的聚合物和选自无机金属氧化物和无机金属氮化物的无机颗粒填料及其组合。 耐火聚合物膜基于膜的总重量含有40至75重量％的无机颗粒填料，耐火聚合物膜的平均厚度至少为85微米。 还提供了包括这种背板的光伏模块。

公开(公告)号：US20120312366A1

公开(公告)日：2012-12-13

申请号：US13315326

申请日：2011-12-09

申请人： Adam Ben Starry ,  Brian C. Auman ,  Carl Robert Haeger ,  Roger Curtis Wicks

发明人： Adam Ben Starry ,  Brian C. Auman ,  Carl Robert Haeger ,  Roger Curtis Wicks

IPC分类号： B32B19/04 ,  H01L31/0203

CPC分类号： B32B17/10788 ,  B32B17/10018 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/3065 ,  B32B2327/12 ,  H01L31/049 ,  Y02E10/50 ,  Y10T428/251 ,  Y10T428/259 ,  Y10T442/10

摘要： A back-sheet for a photovoltaic module comprises a fire resistant sheet adhered to a fluoropolymer film. The fire resistant sheet comprises 40 to 100 weight percent of crystallized mineral silicate platelets based on the weight of the fire resistant sheet, and the fire resistant sheet has an average thickness of at least 75 microns, and more preferably at least 100 microns. The crystallized mineral silicate platelets of the fire resistant sheet are selected from the group of mica, vermiculite, clay, talc, and combinations thereof. A photovoltaic module made with such a back-sheet is also disclosed.

摘要翻译： 用于光伏组件的背板包括粘附到含氟聚合物膜上的防火片。 基于耐火片的重量，防火片材包含40-100重量％的结晶矿物硅酸盐血小板，耐火片材具有至少75微米，更优选至少100微米的平均厚度。 耐火片的结晶矿物硅酸盐血小板选自云母，蛭石，粘土，滑石及其组合。 还公开了由这种背板制成的光伏组件。

公开(公告)号：US20110124806A1

公开(公告)日：2011-05-26

申请号：US12622977

申请日：2009-11-20

申请人： John W. Simmons ,  Brian C. Auman ,  Kostantinos Kourtakis ,  Salah Boussaad

发明人： John W. Simmons ,  Brian C. Auman ,  Kostantinos Kourtakis ,  Salah Boussaad

IPC分类号： C08L79/08 ,  C08G73/10

CPC分类号： C08G73/1067 ,  C08G73/1042 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08

摘要： A film is disclosed, containing 40-100 weight percent polyimide. The polyimide is derived from a dianhydride component and a diamine component. The dianhydride component is at least 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA), and optionally is also pyromellitic dianhydride (PMDA) in a mole ratio of 50-100:50-0 (BPDA:PMDA). The diamine component comprises 1,5-naphthalenediamine (1,5-ND) and 1,4-diaminobenzene (PPD) and/or meta phenylene diamine (MPD) in a mole ratio of 15-95:85-5 (1,5-ND:PPD+MPD). The films have exceptional high temperature storage modulus (elastic modulus) and exceptionally low high temperature creep (eplast).

摘要翻译： 公开了一种含有40-100重量％聚酰亚胺的膜。 聚酰亚胺衍生自二酐组分和二胺组分。 二酐组分为至少3,3'，4,4'-联苯四羧酸二酐（BPDA），并且任选还含有摩尔比为50-100:50-0（BPDA：PMDA）的均苯四酸二酐（PMDA）。 二胺组分包含摩尔比为15-95:85-5（1,5）的1,5-萘二胺（1,5-ND）和1,4-二氨基苯（PPD）和/或间苯二胺（MPD） -ND：PPD + MPD）。 这些薄膜具有优异的高温储存模量（弹性模量）和特别低的高温蠕变（eplast）。

公开(公告)号：US07547849B2

公开(公告)日：2009-06-16

申请号：US11153206

申请日：2005-06-15

申请人： Yueh-Ling Lee ,  Meredith L. Dunbar ,  Harry Richard Zwicker ,  Carl B. Wang ,  Brian C. Auman ,  Shane Fang

发明人： Yueh-Ling Lee ,  Meredith L. Dunbar ,  Harry Richard Zwicker ,  Carl B. Wang ,  Brian C. Auman ,  Shane Fang

IPC分类号： H05K1/00 ,  B32B3/00

CPC分类号： H05K3/185 ,  C23C18/02 ,  C23C18/1216 ,  C23C18/1233 ,  C23C18/1295 ,  C23C18/204 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31725 ,  Y10T428/31786

摘要： A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.

摘要翻译： 可光活化的聚合物组合物和聚合物复合材料包括选自环氧树脂，二氧化硅填充的环氧树脂，双马来酰亚胺树脂，双马来酰亚胺三嗪，含氟聚合物，聚酯，聚苯醚/聚苯醚树脂，聚丁二烯/聚异戊二烯交联树脂（和共聚物），液体 结晶聚合物，聚酰胺，氰酸酯或其组合，聚合物粘合剂的存在量为40,45,50,55,60,65,70,75,80,85,90,95,96或97重量 - 聚合物组合物的总重量; 存在量为3,4,5,6,7,8,9,10,11,12,13,14,15,20,25,30,35,40,45,50,55的尖晶石晶体填料 和60重量％的聚合物组合物的总重量，以及制备其的方法。

公开(公告)号：US20080213605A1

公开(公告)日：2008-09-04

申请号：US11999665

申请日：2007-12-06

申请人： Gary C. Briney ,  Brian C. Auman ,  Christopher J. Milasincic

发明人： Gary C. Briney ,  Brian C. Auman ,  Christopher J. Milasincic

IPC分类号： B32B27/20

CPC分类号： B32B27/34 ,  B32B27/20 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0269 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The invention is directed to substrates for electronic circuitry. The substrates of the invention have a first polyimide layer having a functional filler and a second polyimide layer having a functional filler. The first layer is non-identical to the second layer, and a surface of the first layer is in contact with and is directly bonded to a surface of the second layer. Filler from each layer extends into the interface between the two layers, and a plurality of covalent bonds are present between the first and second functional layers that chemically bond the two layers together to provide a reliable, predictable multifunctional substrate for electronic circuitry with improved performance relative to polyimide layers bonded together by an adhesive.