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公开(公告)号：US07531462B2
公开(公告)日：2009-05-12
申请号：US11444301
申请日：2006-06-01
IPC分类号： H01L21/302
CPC分类号： H01L22/12 , G01N21/9501
摘要： A method of inspecting a semiconductor wafer, comprises removing a device structure film on the semiconductor wafer with a chemical solution to expose a crystal surface of the semiconductor wafer; coating a protected area, which is a part of the crystal surface of the semiconductor wafer, with a mask material for protecting the crystal surface of the semiconductor wafer; etching the semiconductor wafer selectively, thereby making a crystal defect in a non-protected area, which is a part of the crystal surface of the semiconductor wafer that is not coated with the mask material, appear after the crystal surface is coated with the mask material; removing the mask material after the selective etching; carrying out quantitative measurement of the protected area and the non-protected area using an optical defect inspection apparatus or a beam-type defect inspection apparatus; and calculating the number of crystal defects of the semiconductor wafer base on the result of the measurement.
摘要翻译： 一种检查半导体晶片的方法，包括用化学溶液去除半导体晶片上的器件结构膜以暴露半导体晶片的晶体表面; 用保护半导体晶片的晶体表面的掩模材料涂覆作为半导体晶片的晶体表面的一部分的保护区域; 选择性地蚀刻半导体晶片，从而在未涂覆有掩模材料的半导体晶片的晶体表面的一部分的非保护区域中出现晶体缺陷，在晶体表面涂覆有掩模材料之后 ; 在选择性蚀刻之后去除掩模材料; 使用光学缺陷检查装置或光束型缺陷检查装置进行保护区域和非保护区域的定量测量; 并根据测量结果计算半导体晶片基底的晶体缺陷数。
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公开(公告)号：US20080147226A1
公开(公告)日：2008-06-19
申请号：US11959968
申请日：2007-12-19
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32179 , G05B2219/32221 , G05B2219/45031 , Y02P90/22
摘要： A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.
摘要翻译： 管理系统包括设定质量控制值变化的可变周期的可变周期设定部。 然后，检索单元检索夹着可变周期的事件。 这些事件可以是半导体制造装置的维护和/或校正值的改变。 分析周期设定单元设定用于分析由检索单元检索的事件之间的质量控制值的变化原因的分析期间。
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13.发明申请公开(公告)号：US20070276528A1
公开(公告)日：2007-11-29
申请号：US11727824
申请日：2007-03-28
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32075 , G05B2219/32222 , G05B2219/45031 , Y02P90/22
摘要： According to the present, there is proved a semiconductor fabrication apparatus management system having: a sensor which monitors and outputs a plurality of apparatus parameters of a semiconductor fabrication apparatus which fabricates a semiconductor device; a measurement unit which measures a dimensional value of the semiconductor device, and outputs the dimensional value as dimensional data; an apparatus parameter storage unit which stores the apparatus parameters; a dimensional data storage unit which stores the dimensional data; an apparatus parameter controller which calculates predicted dimensional data by extracting the dimensional data from the dimensional data storage unit, and controls at least one of the plurality of apparatus parameters on the basis of the predicted dimensional data; and an abnormality factor extraction unit which analyzes correlations between the controlled apparatus parameter and other apparatus parameters, and extracts an abnormal apparatus parameter on the basis of a calculated correlation coefficient.
摘要翻译： 根据现在，已经证明了一种半导体制造装置管理系统，其具有：监视并输出制造半导体装置的半导体制造装置的多个装置参数的传感器; 测量单元，其测量半导体器件的尺寸值，并将该尺寸值作为尺寸数据输出; 装置参数存储单元，其存储所述装置参数; 存储尺寸数据的尺寸数据存储单元; 装置参数控制器，其通过从所述尺寸数据存储单元提取所述尺寸数据来计算预测尺寸数据，并且基于所述预测尺寸数据来控制所述多个装置参数中的至少一个; 以及异常因子提取单元，其分析受控设备参数和其他设备参数之间的相关性，并且基于计算的相关系数提取异常设备参数。
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14.发明申请公开(公告)号：US20060287754A1
公开(公告)日：2006-12-21
申请号：US11471675
申请日：2006-06-21
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/31477 , G05B2219/32057 , G05B2219/32097 , G05B2219/45031 , Y02P90/12 , Y02P90/20 , Y02P90/22
摘要： A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.
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15.发明授权公开(公告)号：US07970486B2
公开(公告)日：2011-06-28
申请号：US11714231
申请日：2007-03-06
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32194 , G05B2219/45031 , Y02P90/18 , Y02P90/22
摘要： A method for controlling a semiconductor manufacturing apparatus for processing wafers divided for each lot, has acquiring quality control value data group containing quality control value data of wafers in a plurality of lots previously processed, and an equipment engineering system parameter group containing equipment engineering system parameters corresponding to the wafers; creating a prediction formula of quality control value data, acquiring a first equipment engineering system parameters; inputting the first equipment engineering system parameters to the prediction formula, and performing calculation to predict first quality control value data of the wafers in the first lot; determining processing of the wafers corresponding to the first quality control value data; acquiring measured first quality control value data of the wafers in the first lot; replacing the quality control value data corresponding to the wafers in the first processed lot; updating the prediction formula.
摘要翻译： 一种用于控制用于处理每批批次的晶片的半导体制造装置的方法，具有包含先前处理的多个批次中的晶片的质量控制值数据的采集质量控制值数据组，以及包含设备工程系统参数的设备工程系统参数组 对应于晶片; 创建质量控制值数据预测公式，获取第一设备工程系统参数; 将第一设备工程系统参数输入到预测公式中，并且执行计算以预测第一批中的晶片的第一质量控制值数据; 确定与第一质量控制值数据对应的晶片的处理; 获取第一批中的晶片的测量的第一质量控制值数据; 替换与第一处理批次中的晶片对应的质量控制值数据; 更新预测公式。
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16.发明授权Semiconductor wafer treatment method, semiconductor wafer inspection method, semiconductor device development method and semiconductor wafer treatment apparatus 失效半导体晶片处理方法，半导体晶片检查方法，半导体器件显影方法和半导体晶片处理装置公开(公告)号：US07314766B2
公开(公告)日：2008-01-01
申请号：US10706090
申请日：2003-11-13
IPC分类号： H01L21/00
CPC分类号： H01L22/24 , H01L2924/0002 , H01L2924/00
摘要： A treatment method of a semiconductor wafer includes treating the semiconductor wafer in a first solution having at least one kind of an oxidative acid and an oxidizing agent and treating the semiconductor wafer in a second solution having at least one of HF and NH4F.
摘要翻译： 半导体晶片的处理方法包括在具有至少一种氧化酸和氧化剂的第一溶液中处理半导体晶片，并且在具有HF和NH 4中的至少一种的第二溶液中处理半导体晶片 F。
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17.发明申请公开(公告)号：US20070225853A1
公开(公告)日：2007-09-27
申请号：US11714231
申请日：2007-03-06
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32194 , G05B2219/45031 , Y02P90/18 , Y02P90/22
摘要： A method for controlling a semiconductor manufacturing apparatus for processing wafers divided for each lot, has acquiring quality control value data group containing quality control value data of wafers in a plurality of lots previously processed, and an equipment engineering system parameter group containing equipment engineering system parameters corresponding to the wafers; creating a prediction formula of quality control value data, acquiring a first equipment engineering system parameters; inputting the first equipment engineering system parameters to the prediction formula, and performing calculation to predict first quality control value data of the wafers in the first lot; determining processing of the wafers corresponding to the first quality control value data; acquiring measured first quality control value data of the wafers in the first lot; replacing the quality control value data corresponding to the wafers in the first processed lot; updating the prediction formula.
摘要翻译： 一种用于控制用于处理每批批次的晶片的半导体制造装置的方法，具有包含先前处理的多个批次中的晶片的质量控制值数据的采集质量控制值数据组，以及包含设备工程系统参数的设备工程系统参数组 对应于晶片; 创建质量控制值数据预测公式，获取第一设备工程系统参数; 将第一设备工程系统参数输入到预测公式中，并且执行计算以预测第一批中的晶片的第一质量控制值数据; 确定与第一质量控制值数据对应的晶片的处理; 获取第一批中的晶片的测量的第一质量控制值数据; 替换与第一处理批次中的晶片对应的质量控制值数据; 更新预测公式。
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18.发明申请公开(公告)号：US20060131696A1
公开(公告)日：2006-06-22
申请号：US11350027
申请日：2006-02-09
申请人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
发明人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
CPC分类号： H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54433 , H01L2223/54493 , H01L2924/0002 , Y10S438/974 , H01L2924/00
摘要： A semiconductor wafer has a bevel contour formed along the periphery thereof, products formed on the wafer, and an ID mark formed on the bevel contour. The ID mark shows at least the properties, manufacturing conditions, and test results of the products.
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19.发明授权公开(公告)号：US07057259B2
公开(公告)日：2006-06-06
申请号：US10101337
申请日：2002-03-20
申请人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
发明人： Tsunetoshi Arikado , Masao Iwase , Soichi Nadahara , Yuso Udo , Yukihiro Ushiku , Shinichi Nitta , Moriya Miyashita , Junji Sugamoto , Hiroaki Yamada , Hajime Nagano , Katsujiro Tanzawa , Hiroshi Matsushita , Norihiko Tsuchiya , Katsuya Okumura
IPC分类号： H01L29/06
CPC分类号： H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54433 , H01L2223/54493 , H01L2924/0002 , Y10S438/974 , H01L2924/00
摘要： A semiconductor wafer has a bevel contour formed along the periphery thereof, products formed on the wafer, and an ID mark formed on the bevel contour. The ID mark shows at least the properties, manufacturing conditions, and test results of the products.
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公开(公告)号：US20050194590A1
公开(公告)日：2005-09-08
申请号：US11068778
申请日：2005-03-02
CPC分类号： H01L22/20 , G01R31/2894 , G05B23/0248 , G05B2219/31357 , Y02P90/14
摘要： A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.
摘要翻译： 一种制造装置的控制系统，包括制造信息输入单元，其获取控制制造装置的装置参数的时间序列数据; 故障模式分类模块将每个晶片的故障平面内分布分为故障模式; 索引计算单元，被配置为通过算法对所述时间序列数据进行统计处理，以计算与各个算法对应的索引; 索引分析单元，提供分类有和没有目标故障模式的索引的第一和第二频率分布，以实现第一和第二频率分布之间的显着性测试; 异常参数提取单元通过比较显着性检验值与检测参考值，提取失效原因指标的故障模式。
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