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    Probe cover for ear thermometer
    11.
    发明申请
    Probe cover for ear thermometer 有权
    耳温度计探头盖

    公开(公告)号：US20090116540A1

    公开(公告)日：2009-05-07

    申请号：US12318357

    申请日：2008-12-29

    Applicant: Vincent Weng ,  Kevin Lin ,  James Huang

    Inventor： Vincent Weng ,  Kevin Lin ,  James Huang

    IPC: G01K1/08

    CPC classification number: G01J5/02 ,  G01J5/021

    Abstract: The present invention discloses a probe cover for an ear thermometer, which comprises: a film cover and a base. The film cover has a cover window able to contact the probe window at the front end of the ear thermometer, a hollow cone able to contact the sidewall of the probe and a strengthened element able to contact the cover window and the hollow cone. The thickness of the cover window is same as the thickness of the strengthened element and greater than the thickness of the hollow cone. Thereby, the present invention can prevent the variation of infrared transmittance caused by the misarrangement and non-uniform thickness of the probe cover film disposed at the front of the probe window.

    Abstract translation: 本发明公开了一种用于耳温度计的探针盖，其包括：胶片盖和底座。 胶片盖具有能够接触耳温度计前端的探针窗口的遮盖窗口，能够接触探针侧壁的中空锥体和能够接触遮盖窗和中空锥体的加强元件。 盖窗的厚度与加强元件的厚度相同，大于中空锥体的厚度。 由此，本发明能够防止由设置在探针窗前部的探针覆盖膜的误差和不均匀厚度引起的红外线透射率的变化。

    Thermoformed litter scoop
    12.
    发明授权
    Thermoformed litter scoop 有权
    热成型垃圾勺

    公开(公告)号：US07523973B2

    公开(公告)日：2009-04-28

    申请号：US11835591

    申请日：2007-08-08

    Applicant: Kevin Lin ,  Jorge Robles ,  Jessica A. Scott

    Inventor： Kevin Lin ,  Jorge Robles ,  Jessica A. Scott

    IPC: A01K29/00 ,  B07B1/02

    CPC classification number: A01K1/0114

    Abstract: The present invention provides a thermoformed litter scoop comprising a generally concave scoop portion, and a handle portion attached to the scoop portion. The scoop portion has a bottom, sides and a rear and a plurality of openings therein. The openings are defined to allow the passage of litter granules therethrough. The handle portion has reinforcing ribs and the scoop portion has reinforcing ribs. The invention also describes a method of making a thermoformed scoop.

    Abstract translation: 本发明提供了一种热成型的垃圾勺，其包括大致凹形的勺部分，以及附接到勺部分的把手部分。 勺部具有底部，侧面和后部以及多个开口。 开口限定为允许垃圾颗粒通过其中。 手柄部分具有加强肋，并且铲斗部分具有加强筋。 本发明还描述了制造热成型勺的方法。

    Ear thermometer protection lid structure
    16.
    发明申请
    Ear thermometer protection lid structure 审中-公开
    耳温度计保护盖结构

    公开(公告)号：US20070019703A1

    公开(公告)日：2007-01-25

    申请号：US11527514

    申请日：2006-09-27

    Applicant: Vincent Weng ,  Kevin Lin ,  Joy Liao

    Inventor： Vincent Weng ,  Kevin Lin ,  Joy Liao

    IPC: G01J5/00

    CPC classification number: G01J5/04 ,  G01J5/048 ,  G01J5/049 ,  G01J5/08 ,  G01J5/0893

    Abstract: An ear thermometer protection lid structure is proposed, in which a lid is disposed on a sensing end of an ear thermometer. When the ear thermometer is used to measure the temperature, the lid is taken off and sleeved onto a grasp end of the ear thermometer to increase the length of the grasp end. The grasp portion of the ear thermometer can thus be lengthened to facilitate grasping and prevent the protection lid from being lost. Moreover, the length of the handle portion can be shortened during manufacturing to lower the cost, and the volume of the ear thermometer can be shrunk to facilitate portability.

    Abstract translation: 提出了一种耳温度计保护盖结构，其中盖子设置在耳温度计的感测端。 当使用耳温度计测量温度时，将盖子取下并套在耳温度计的抓握端，以增加抓握端的长度。 耳温度计的抓握部分因此可以被延长以便于抓握并防止保护盖丢失。 此外，在制造过程中可以缩短手柄部分的长度以降低成本，并且可以缩小耳朵温度计的体积以便于便于携带。

    Wafer Level Packaging of Materials with Different Coefficents of Thermal Expansion
    17.
    发明申请
    Wafer Level Packaging of Materials with Different Coefficents of Thermal Expansion 失效
    具有不同热膨胀系数的材料的晶圆级包装

    公开(公告)号：US20060263931A1

    公开(公告)日：2006-11-23

    申请号：US11461587

    申请日：2006-08-01

    Applicant: Michael McClure ,  Jack Chocola ,  Kevin Lin ,  George Grama

    Inventor： Michael McClure ,  Jack Chocola ,  Kevin Lin ,  George Grama

    IPC: H01L21/00

    CPC classification number: H03H9/059

    Abstract: An electromechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.

    Abstract translation: 机电装置封装包括永久地结合到封装机电装置的器件晶片的帽材料。 使用中间材料将装置和封盖材料在低温下结合在一起，并且包括从装置或盖材料或两者发出的中间材料的结构在接合界面处提供互锁。 一个包装包括具有与装置晶片不同材料的匹配材料和类似热膨胀系数的可重复使用的载体晶片和不同材料的低成本封盖晶片。 用于将盖材料临时粘合到载体晶片的方法包括将盖材料附接到载体晶片，然后将其分开以减轻与器件晶片的热膨胀失配。

    Method for manufacturing a magnetic write element
    18.
    发明授权
    Method for manufacturing a magnetic write element 失效
    磁写入元件的制造方法

    公开(公告)号：US06859997B1

    公开(公告)日：2005-03-01

    申请号：US09665431

    申请日：2000-09-19

    Applicant: Lijun Tong ,  Kevin Lin ,  Joyce Hsiang ,  Yirong Hu

    Inventor： Lijun Tong ,  Kevin Lin ,  Joyce Hsiang ,  Yirong Hu

    IPC: G11B5/127 ,  H04R31/00

    CPC classification number: G11B5/127 ,  Y10T29/49032 ,  Y10T29/49043 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49064

    Abstract: The present invention provides a magnetic write element for use in a magnetic data recording system such as a disk drive. The invention provides a method of manufacturing a well defined coil, which avoids the problem of shallow wall angle problems exhibited by prior art methods due to coil mask shrinkage during high temperature bake. A series of trenches are provided in the coil mask, the trenches being shallower than the coil pattern, and not extending completely through the coil pattern. During the high temperature baking process shrinkage of the coil mask will be absorbed by the trenches and not transferred to the coil pattern, preventing deformation of the coil wall portion of the mask.

    Abstract translation: 本发明提供一种用于诸如磁盘驱动器的磁数据记录系统中的磁写元件。 本发明提供了一种制造明确限定的线圈的方法，其避免了由于高温烘烤期间线圈掩模收缩而由现有技术方法呈现的浅壁角问题。 在线圈掩模中设置一系列沟槽，沟槽比线圈图案浅，并且不完全延伸通过线圈图案。 在高温烘烤过程中，线圈掩模的收缩将被沟槽吸收，而不会转移到线圈图案，防止掩模的线圈壁部分变形。

    Probe cover dispenser
    19.
    发明授权
    Probe cover dispenser 失效
    探头盖分配器

    公开(公告)号：US06840402B2

    公开(公告)日：2005-01-11

    申请号：US10200224

    申请日：2002-07-23

    Applicant: Kevin Lin ,  Chu-Chung Yin

    Inventor： Kevin Lin ,  Chu-Chung Yin

    IPC: G01J5/02 ,  G01K1/08 ,  B65H43/04

    CPC classification number: G01J5/02 ,  G01J5/021

    Abstract: A probe cover dispenser comprises a main body, an elastic component, and a separation board. The main body has a receiving groove therein. A groove is disposed at the top end of the main body. The elastic component is disposed in the receiving groove. One end of the elastic component is fixed at the bottom of the receiving groove, and the other end thereof is connected with a separation sheet. A plurality of probe covers are stacked in the receiving grooves above the separation sheet. The separation board is disposed in the groove at the top end of the main body. One end of the separation board is pivotally connected with the top end of the main body so that the separation board can be screwed into the groove at the top end of the main body to separate the first probe cover from the second probe cover.

    Abstract translation: 探针盖分配器包括主体，弹性部件和分离板。 主体在其中具有接收槽。 凹槽设置在主体的顶端。 弹性部件设置在接收槽中。 弹性部件的一端固定在容纳槽的底部，另一端与分离片连接。 多个探针盖层叠在分离片上方的接收槽中。 分离板设置在主体顶端的槽中。 分离板的一端与主体的顶端枢转地连接，使得分离板可以在主体的顶端被拧入槽中，以将第一探针盖与第二探针盖分开。

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