公开(公告)号：US08368094B2

公开(公告)日：2013-02-05

申请号：US12813621

申请日：2010-06-11

Applicant: Min-Hsun Hsieh ,  Chien-Yuan Wang ,  Jin-Ywan Lin ,  Chiu-Lin Yao

Inventor： Min-Hsun Hsieh ,  Chien-Yuan Wang ,  Jin-Ywan Lin ,  Chiu-Lin Yao

IPC: H01L33/00

CPC classification number: H01L33/42 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A optoelectronic device comprises a semiconductor stack layer; a first transparent conductive oxide (abbreviate as “TCO” hereinafter) layer located on the semiconductor stack layer, wherein the first TCO layer has at least one opening; and a second TCO layer covering the first TCO layer, wherein the second TCO layer is filled into the opening of the first TCO layer and contacted with the semiconductor stack layer, and one of the first TCO layer and the second TCO layer forms an ohmic contact with the semiconductor stack layer.

Abstract translation: 光电子器件包括半导体叠层层; 位于半导体堆叠层上的第一透明导电氧化物（以下简称TCO），其中第一TCO层具有至少一个开口; 以及覆盖所述第一TCO层的第二TCO层，其中所述第二TCO层填充到所述第一TCO层的开口中并与所述半导体堆叠层接触，并且所述第一TCO层和所述第二TCO层中的一个形成欧姆接触 与半导体堆叠层。

公开(公告)号：US20120329301A1

公开(公告)日：2012-12-27

申请号：US13528872

申请日：2012-06-21

Applicant: ZHUANG-XING LI ,  XIAO-ZHI FU ,  XUE-HAI SHEN ,  ZE-LIN YAO

Inventor： ZHUANG-XING LI ,  XIAO-ZHI FU ,  XUE-HAI SHEN ,  ZE-LIN YAO

IPC: H01R13/62

CPC classification number: H01R12/721

Abstract: A card edge connector (100) includes an insulative housing, a set of contacts (2) retained in the insulative housing and an ejector (3). The insulative housing has a central slot (12) and at least one tower portion (13). The tower portion includes a pair of outer walls (131) and a receiving slot (135) formed between the outer walls. Each outer wall has a ladder with a circular hole (1312) formed therein. The ejector has a pair of spindles (312) received in the circular holes and a pair of standoffs (313). Each standoff has a horizontal surface (3131) abutting against a corresponding horizontal resisting surface (1314) formed on the ladder so as to make centers of the spindle and the circular hole overlap when the ejector rotates inwardly.

Abstract translation: 卡缘连接器（100）包括绝缘壳体，保持在绝缘壳体中的一组触点（2）和喷射器（3）。 绝缘壳体具有中心槽（12）和至少一个塔架部分（13）。 塔架部分包括形成在外壁之间的一对外壁（131）和接收槽（135）。 每个外壁具有形成在其中的圆形孔（1312）的梯子。 喷射器具有容纳在圆形孔中的一对主轴（312）和一对支座（313）。 每个支座具有与形成在梯子上的对应的水平阻力表面（1314）抵接的水平表面（3131），以便当喷射器向内旋转时使主轴和圆形孔的中心重叠。

公开(公告)号：US08274092B2

公开(公告)日：2012-09-25

申请号：US12905795

申请日：2010-10-15

Applicant: Chiu-Lin Yao ,  To-Cheng Hsu

Inventor： Chiu-Lin Yao ,  To-Cheng Hsu

IPC: H01L33/22

CPC classification number: H01L33/22 ,  H01L33/387 ,  H01L2933/0016

Abstract: This invention provides an optoelectronic semiconductor device having a rough surface and the manufacturing method thereof. The optoelectronic semiconductor device comprises a semiconductor stack having a rough surface and an electrode layer overlaying the semiconductor stack. The rough surface comprises a first region having a first topography and a second region having a second topography. The method comprises the steps of forming a semiconductor stack on a substrate, forming an electrode layer on the semiconductor stack, thermal treating the semiconductor stack, and wet etching the surface of the semiconductor stack to form a rough surface.

Abstract translation: 本发明提供一种具有粗糙表面的光电半导体器件及其制造方法。 光电子半导体器件包括具有粗糙表面的半导体叠层和覆盖半导体叠层的电极层。 粗糙表面包括具有第一形貌的第一区域和具有第二形貌的第二区域。 该方法包括以下步骤：在衬底上形成半导体堆叠，在半导体堆叠上形成电极层，热处理半导体堆叠，以及湿蚀刻半导体叠层的表面以形成粗糙表面。

公开(公告)号：US08215994B2

公开(公告)日：2012-07-10

申请号：US12906176

申请日：2010-10-18

Applicant: Gustavo F. Duenas ,  Ze-Lin Yao ,  Jason Chou ,  Xue-Wu Bu

Inventor： Gustavo F. Duenas ,  Ze-Lin Yao ,  Jason Chou ,  Xue-Wu Bu

IPC: H01R24/00

CPC classification number: H01R13/6471 ,  H01R12/721

Abstract: A card edge connector for use with a daughter board, and comprises an insulative elongated housing extending along a longitudinal direction, and defining opposite first and second side walls and a central slot formed therebetween for receiving the daughter board therein, a plurality of contacts each defining a retention portion retained in the housing, a resilient contact portion extending into the central slot from an upper portion of the retention portion for contacting with the daughter board, and a solder tail extending out of the housing form a lower portion of the retention portion. Wherein the contacts include a first row of contacts disposed in the first side wall, and a second row of contacts disposed in the second side wall. The first row of contacts have at least two adjacent grounding contacts electrically connected with each other during the contact portions of the contacts are contacting with the daughter board.

Abstract translation: 一种与子板一起使用的卡缘连接器，并且包括沿着纵向方向延伸的绝缘细长壳体，并且限定相对的第一和第二侧壁以及形成在其间的用于在其中容纳子板的中心狭槽，多个触点各自限定 保持部分保持在壳体中，弹性接触部分从保持部分的上部延伸到中心狭槽中，用于与子板接触，并且从壳体延伸出的焊接尾部形成保持部分的下部。 其中触点包括设置在第一侧壁中的第一排触点和设置在第二侧壁中的第二排触点。 在触头的接触部分与子板接触的过程中，第一排触点具有彼此电连接的至少两个相邻的接地触点。

公开(公告)号：US20120080697A1

公开(公告)日：2012-04-05

申请号：US13175698

申请日：2011-07-01

Applicant: Shih-I Chen ,  Chia-Liang Hsu ,  Tzu-Chieh Hsu ,  Han-Min Wu ,  Ye-Ming Hsu ,  Chien-Fu Huang ,  Chao-Hsing Chen ,  Chiu-Lin Yao ,  Hsin-Mao Liu ,  Chien-Kai Chun

Inventor： Shih-I Chen ,  Chia-Liang Hsu ,  Tzu-Chieh Hsu ,  Han-Min Wu ,  Ye-Ming Hsu ,  Chien-Fu Huang ,  Chao-Hsing Chen ,  Chiu-Lin Yao ,  Hsin-Mao Liu ,  Chien-Kai Chun

IPC: H01L33/46 ,  H01L33/08

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/08 ,  H01L33/10 ,  H01L33/145 ,  H01L33/32 ,  H01L33/382 ,  H01L33/385 ,  H01L33/40 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/483 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting element includes a supportive substrate; a reflective layer formed on the supportive substrate; a transparent layer formed on the reflective layer; a light-emitting stacked layer formed on the transparent layer; an etching-stop layer formed between the transparent layer and the reflective layer; and a plurality of contact parts formed between the light-emitting stacked layer and the transparent layer.

Abstract translation: 发光元件包括支撑基板; 形成在所述支撑基板上的反射层; 形成在反射层上的透明层; 形成在透明层上的发光层叠层; 形成在所述透明层和所述反射层之间的蚀刻停止层; 以及形成在发光层叠层和透明层之间的多个接触部。

公开(公告)号：US20120061667A1

公开(公告)日：2012-03-15

申请号：US13231250

申请日：2011-09-13

Applicant: Chein-Fu Huang ,  Chao-Hsing CHEN ,  Chiu-Lin Yao ,  Hsin-Mao Liu ,  Chien-Kai Chung

Inventor： Chein-Fu Huang ,  Chao-Hsing CHEN ,  Chiu-Lin Yao ,  Hsin-Mao Liu ,  Chien-Kai Chung

IPC: H01L33/32 ,  H01L33/26

CPC classification number: H01L27/153 ,  H01L33/20 ,  H01L33/22 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting element includes: a substrate including a first surface and a second surface different from the first surface; a plurality of light-emitting structure units disposed on the second surface; and a trench formed on the first surface and between the plurality of light-emitting structure units.

Abstract translation: 发光元件包括：基板，包括第一表面和与第一表面不同的第二表面; 设置在所述第二表面上的多个发光结构单元; 以及形成在所述第一表面上和所述多个发光结构单元之间的沟槽。

公开(公告)号：US20120025250A1

公开(公告)日：2012-02-02

申请号：US13193970

申请日：2011-07-29

Applicant: Min-Hsun Hsieh ,  Wei-Yu Chen ,  Li-Ming Chang ,  Chien-Yuan Wang ,  Chiu-Lin Yao

Inventor： Min-Hsun Hsieh ,  Wei-Yu Chen ,  Li-Ming Chang ,  Chien-Yuan Wang ,  Chiu-Lin Yao

IPC: H01L33/20

CPC classification number: H01L33/382 ,  H01L33/24 ,  H01L33/385 ,  H01L33/387 ,  H01L2933/0016

Abstract: This application provides a semiconductor light-emitting device and the manufacturing method thereof. The semiconductor light-emitting device comprises a semiconductor light-emitting structure and a thinned substrate. The semiconductor light-emitting structure comprises a plurality of semiconductor layers and a plurality of first channels, wherein a plurality of first channels has a predetermined depth that penetrating at least two layers of the plurality of semiconductor layers.

Abstract translation: 本申请提供了一种半导体发光器件及其制造方法。 半导体发光器件包括半导体发光结构和薄化衬底。 半导体发光结构包括多个半导体层和多个第一通道，其中多个第一通道具有穿透多个半导体层的至少两层的预定深度。

公开(公告)号：US20110253979A1

公开(公告)日：2011-10-20

申请号：US13170360

申请日：2011-06-28

Applicant: Chiu-Lin Yao ,  Ta-Cheng Hsu

Inventor： Chiu-Lin Yao ,  Ta-Cheng Hsu

IPC: H01L33/06 ,  H01L33/58

CPC classification number: H01L33/06 ,  H01L2933/0083

Abstract: A light-emitting device and the method for making the same is disclosed. The light-emitting device is a semiconductor device, comprising a growth substrate, an n-type semiconductor layer, a quantum well active layer and a p-type semiconductor layer. It combines the holographic and the quantum well interdiffusion (QWI) to form a photonic crystal light-emitting device having a dielectric constant of two-dimensional periodic variation or a material composition of two-dimensional periodic variation in the quantum well active layer. The photonic crystal light-emitting devices can enhance the internal efficiency and light extraction efficiency.

Abstract translation: 公开了一种发光器件及其制造方法。 发光装置是包括生长衬底，n型半导体层，量子阱有源层和p型半导体层的半导体器件。 它结合了全息和量子阱相互扩散（QWI）以形成具有二维周期性变化的介电常数或量子阱活性层中的二维周期性变化的材料组成的光子晶体发光器件。 光子晶体发光器件可以提高内部效率和光提取效率。

公开(公告)号：US08007303B2

公开(公告)日：2011-08-30

申请号：US12890717

申请日：2010-09-27

Applicant: Ze-Lin Yao ,  Zhuang-Xing Li ,  Ting-Shun Liu

Inventor： Ze-Lin Yao ,  Zhuang-Xing Li ,  Ting-Shun Liu

IPC: H01R13/62

CPC classification number: H01R12/721 ,  H01R12/7005

Abstract: A card edge connector for mating with an electronic card includes an elongated housing, a number of contacts and a retainer retained to the housing. The housing has a pair of side walls, a central slot between the side walls and a first tower upwardly extending at one end thereof. The first tower defines a first U-shaped cavity downwardly extending from a top end thereof and a mounting slot upwardly extending from a lower end thereof and located at outside of the first cavity. The first cavity communicates with the central slot along a length direction of the housing to receive the electronic card. The retainer has a non-flexible fastening portion retained in the mounting slot and a flexible locking barb obliquely protruding into the first cavity from a top end of the fastening portion to lock with the electronic card.

Abstract translation: 用于与电子卡匹配的卡缘连接器包括细长壳体，多个触点和保持在壳体上的保持器。 壳体具有一对侧壁，侧壁之间的中心狭槽和在其一端向上延伸的第一塔架。 第一塔限定了从其顶端向下延伸的第一U形空腔和从其下端向上延伸并位于第一空腔外侧的安装槽。 第一腔沿着壳体的长度方向与中心槽连通以接收电子卡。 保持器具有保持在安装槽中的非柔性紧固部分和从紧固部分的顶端倾斜地突出到第一腔中的柔性锁定倒钩，以与电子卡锁定。

公开(公告)号：US20110143563A1

公开(公告)日：2011-06-16

申请号：US12961498

申请日：2010-12-07

Applicant: ZHUANG-XING LI ,  ZE-LIN YAO ,  TING-SHUN LIU

Inventor： ZHUANG-XING LI ,  ZE-LIN YAO ,  TING-SHUN LIU

IPC: H01R13/62

CPC classification number: H01R12/7005

Abstract: A card edge connector includes a longitudinal insulative housing having a receiving slot formed therein and extending in a longitudinal direction for insertion of a module; a set of contacts retained in the insulative housing and protruding into the receiving slot for mating with the module; an ejector rotatably attached to one longitudinal end of the insulative housing for latching with or ejecting the module; and a spring member retained in the other longitudinal end of the insulative housing and having a pair of resilient locking arms for locking with the module.

Abstract translation: 卡缘连接器包括纵向绝缘壳体，其具有形成在其中并沿纵向方向延伸以用于插入模块的接收槽; 保持在所述绝缘壳体中并且突出到所述接收槽中以与所述模块配合的一组触点; 可旋转地连接到绝缘壳体的一个纵向端部的弹出器，用于闩锁或弹出模块; 以及弹簧构件，其保持在所述绝缘壳体的另一纵向端部中并具有用于与所述模块锁定的一对弹性锁定臂。