Abstract:
An operating method of a memory is provided. The memory includes a memory cell array composed of a plurality of memory cells, a plurality of bit lines, and a plurality of word lines. During programming the memory, a column of memory cells is selected. A voltage difference is respectively occurred between a bit line corresponding to first source/drain regions of the memory cells in the selected column and adjacent two bit lines, and a bias is respectively applied to a word line corresponding to a control gate of each memory cell in the selected column so as to allow a data bit of the memory cell at a plurality of predetermined programmed states and an unusable bit of each memory cell in an adjacent column which shares the same bit line with the selected column at an unusable state.
Abstract:
Memory devices described herein are programmed and erased by physical segregation of an electrically insulating layer out of a memory material to establish a high resistance state, and by re-absorption of at least a portion of the electrically insulating layer into the memory material to establish a low resistance state. The physical mechanism of programming and erasing includes movement of structure vacancies to form voids, and/or segregation of doping material and bulk material, to create the electrically insulating layer consisting of voids and/or dielectric doping material along an inter-electrode current path between electrodes.
Abstract:
A method of programming a phase change device includes selecting a desired threshold voltage (Vth) and applying a programming pulse to a phase change material in the phase change device. The applying of the programming pulse includes applying a quantity of energy to the phase change material to drive at least a portion of this material above a melting energy level. A portion of the energy applied to the phase change material is allowed to dissipate below the melting energy level. The shape of the energy dissipation from the phase change material is controlled until the energy applied to the phase change material is less than a quenched energy level, to cause the phase change device to have the desired Vth. A remaining portion of the energy applied to the phase change material is allowed to dissipate to an environmental level.
Abstract:
A memory device includes bottom and top electrode structures and a memory cell therebetween. The memory cell comprises bottom and top memory elements and a dielectric element therebetween. A lower resistance conduction path is formed through the dielectric element. The dielectric element may have an outer edge and a central portion, the outer edge being thicker than the central portion. To make a memory device, an electrical pulse is applied through the memory cell to form a conduction path through the dielectric element. A passivation element may be formed by oxidizing the outer surface of the memory cell which may also enlarge the outer edge of the dielectric element.
Abstract:
Memory devices are disclosed. One example of a memory device may include two layers of memory arrays each containing at least four memory cells. In particular, the memory device includes two word lines commonly shared by the two layers of the memory arrays, with the word lines coupled with the memory cells and providing gate regions of the memory cells. Additionally, a first pair of bit lines cross under the two word lines and providing source and drain regions to the first layer of the two layers of the memory arrays, and a second pair of bit lines cross over the two word lines and providing source and drain regions to the second layer of the two layers of the memory arrays. A first set of channel regions are disposed between the source and drain regions to the first layer of the two layers of the memory arrays, and a second set of channel regions are disposed between the source and drain regions to the second layer of the two layers of the memory arrays. In addition, charge storage regions are provided with each of them disposed between a corresponding word line and a corresponding channel region.
Abstract:
An operating method of a memory array is provided. The operating method includes performing a programming operation. The programming operation is performed by applying a first voltage to a bit line of the memory array and a second voltage to a plurality of word lines of the memory array to cause simultaneously programming a plurality of selected memory cells in the memory array
Abstract:
An operating method of a memory is provided. The memory includes a memory cell array composed of a plurality of memory cells, a plurality of bit lines, and a plurality of word lines. During programming the memory, a column of memory cells is selected. A voltage difference is respectively occurred between a bit line corresponding to first source/drain regions of the memory cells in the selected column and adjacent two bit lines, and a bias is respectively applied to a word line corresponding to a control gate of each memory cell in the selected column so as to allow a data bit of the memory cell at a plurality of predetermined programmed states and an unusable bit of each memory cell in an adjacent column which shares the same bit line with the selected column at an unusable state.
Abstract:
A memory device includes a plurality of planes of memory arrays, each memory array including a plurality of memory cells. The memory device also includes a plurality of word lines and bit lines coupled to the memory cells in each plane, and at least one transistor to select at least one of the memory arrays.
Abstract:
A method of identifying logical information in a cell, particularly in a programming by hot hole injection nitride electron storage (PHINES) cell by one-side reading scheme is disclosed. The method comprise steps of: erasing the first region and the second region of PHINES cell by increasing a local threshold voltage (Vt) to a certain value; programming at least one of the first region and the second region of the PHINES cell by hot hole injection; and reading a logical state of the PHINES cell by measuring an output current of one of the first region and the second region; wherein different quantity of the output current is caused by interaction between different quantity of the hot hole stored in the first region and the second region, so as to determine the logical state of the PHINES cell by one-side reading scheme.
Abstract:
A method of identifying logical information in a cell, particularly in a programming by hot hole injection nitride electron storage (PHINES) cell by one-side reading scheme is disclosed. The method comprise steps of: erasing the first region and the second region of PHINES cell by increasing a local threshold voltage (Vt) to a certain value; programming at least one of the first region and the second region of the PHINES cell by hot hole injection; and reading a logical state of the PHINES cell by measuring an output current of one of the first region and the second region; wherein different quantity of the output current is caused by interaction between different quantity of the hot hole stored in the first region and the second region, so as to determine the logical state of the PHINES cell by one-side reading scheme.