-
公开(公告)号：US20110316706A1
公开(公告)日：2011-12-29
申请号：US12822473
申请日：2010-06-24
CPC分类号： G01F1/68 , B01D46/0086 , B01D2273/30 , G01K3/14 , G01K7/427
摘要： One embodiment involves detecting the fouling of an air filter used to filter airflow entering a computer system. An expected airflow rate is obtained from a current fan speed. An expected temperature rise between two positions is computed as a function of the expected airflow rate and the power consumption of heat-generating components, such as servers. An actual temperature rise is obtained from temperature sensors. An electronic alert is automatically generated in response to the actual temperature rise exceeding the expected temperature rise by a setpoint. Different setpoints may be used to trigger distinct electronic alerts.
摘要翻译： 一个实施例涉及检测用于过滤进入计算机系统的空气的空气过滤器的结垢。 从当前风扇速度获得预期的气流速率。 根据预期的气流速率和诸如服务器之类的发热组件的功耗来计算两个位置之间的预期温度上升。 从温度传感器获得实际的温升。 响应于超过预期温度上升设定点的实际温升，自动产生电子警报。 不同的设定点可用于触发不同的电子警报。
-
公开(公告)号：US07992454B2
公开(公告)日：2011-08-09
申请号：US12631571
申请日：2009-12-04
IPC分类号： G01F1/22
摘要： A testing system includes a single air collection box and a laminar flow system for obtain an airflow measurement. The single airflow box has air inlet and outlet ports at opposite ends. The laminar flow element has a laminar flow element inlet in fluid communication with the air collection box and a laminar flow element outlet sealed with the air outlet port of the air collection box. A blower in fluid communication with the laminar flow element outlet draws airflow into the air collection box through a unit under test and out of the air collection box through the laminar flow element. A pressure transducer senses the differential air pressure across the laminar flow element and enables a determination of the airflow rate.
摘要翻译： 测试系统包括单个空气收集箱和用于获得气流测量的层流系统。 单个气流箱在相对端具有进气口和出气口。 层流元件具有与空气收集箱流体连通的层流元件入口和与空气收集箱的空气出口密封的层流元件出口。 与层流元件出口流体连通的鼓风机通过被测单元将气流吸入空气收集箱，并通过层流元件离开空气收集箱。 压力传感器检测跨层流元件的差压空气压力，并能够确定气流速率。
-
公开(公告)号：US20100017151A1
公开(公告)日：2010-01-21
申请号：US12176795
申请日：2008-07-21
申请人： Brian M. Kerrigan , Randolph S. Kolvick , Jason A. Matteson , Thomas D. Pahel, JR. , Mark E. Steinke
发明人： Brian M. Kerrigan , Randolph S. Kolvick , Jason A. Matteson , Thomas D. Pahel, JR. , Mark E. Steinke
CPC分类号： B01D46/0086 , H05K7/20181
摘要： Detecting a fouled air filter in a computer equipment enclosure that includes an air filter, a supply plenum connecting the air filter and the computer equipment enclosure, a fan operating at a current fan speed, and a filter monitoring module connected for data communications to a management module. Detecting a fouled air filter according to embodiments of the present invention includes calculating, by the filter monitoring module, a pressure differential across the air filter; determining, for the current fan speed by the filter monitoring module in dependence upon a pressure differential profile for the air filter, whether the calculated pressure differential across the air filter exceeds a predetermined threshold value; and if the calculated pressure differential across the air filter exceeds the predetermined threshold value, reporting, by the filter monitoring module to the management module, that the calculated pressure differential across the air filter exceeds the predetermined threshold value.
摘要翻译： 在包括空气过滤器，连接空气过滤器和计算机设备外壳的供气室，以当前风扇速度运行的风扇和连接到管理数据通信的过滤器监控模块的计算机设备外壳中检测污浊空气过滤器 模块。 检测根据本发明的实施例的污浊空气过滤器包括通过过滤器监控模块计算空气过滤器两端的压力差; 根据所述空气过滤器的压差曲线来确定由所述过滤器监控模块获得的当前风扇速度，所述计算出的所述空气过滤器上的压差是否超过预定阈值; 并且如果计算出的空气过滤器的压差超过预定阈值，则由过滤器监视模块向管理模块报告计算出的空气过滤器上的压力差超过预定阈值。
-
公开(公告)号：US20090154096A1
公开(公告)日：2009-06-18
申请号：US11957619
申请日：2007-12-17
CPC分类号： H05K7/20754 , F25D17/06 , F25D2317/0655 , F25D2317/0661 , Y10T29/49826
摘要： Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.
摘要翻译： 提供了用于促进采用蒸气压缩热交换系统的电子系统以及前后盖的空气冷却的装置和方法。 热交换系统的蒸发器壳体安装到电子系统的系统壳体，并且至少部分地延伸到系统壳体的空气入口侧和出口侧之间。 蒸发器壳体包括空气入口和出口以及蒸发器。 前盖与空气入口侧或空气出口开口相邻地安装在系统或蒸发器壳体上，后盖与空气出口侧或进气口相邻地安装在系统或蒸发器壳体上。 系统壳体，后盖，蒸发器壳体和前盖一起限定通过系统壳体和蒸发器壳体的闭环气流路径，其中蒸气压缩热交换系统冷却空气循环通过。
-
15.发明授权公开(公告)号：US08659897B2
公开(公告)日：2014-02-25
申请号：US13360328
申请日：2012-01-27
CPC分类号： G06F1/20 , G06F2200/201
摘要： Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.
摘要翻译： 存储器系统中的每对存储器模块使用诸如热管或液体流管的共用冷却管来冷却。 示例实施例包括在相应冷却管的相对侧上的一对存储器模块插槽。 内部散热板热耦合到冷却管并且与存储器模块的与附带的冷却管相邻的第一面热接合。 热量从存储器模块的第二面传导到冷却管，例如从与存储器模块的相对的第二面和内板热接合的外板。
-
16.发明申请公开(公告)号：US20130192794A1
公开(公告)日：2013-08-01
申请号：US13361929
申请日：2012-01-30
申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： F28F9/00
CPC分类号： H05K13/00 , H01L21/4882 , H01L23/40 , H01L23/42 , H01L23/44 , H01L23/467 , H01L23/473 , H01L2224/16225 , H05K7/20009 , H05K7/20254 , Y10T29/49117
摘要： Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices.
摘要翻译： 提供冷却系统互换性的几种设备和方法。 一种装置包括热耦合到集成电路的导热板。 导热板被配置为可互换地耦合到液体冷却组件或空气冷却组件，并且液体冷却组件和空气冷却组件是分离的装置。
-
17.发明申请COOLED ELECTRONIC SYSTEM WITH THERMAL SPREADERS COUPLING ELECTRONICS CARDS TO COLD RAILS 失效冷却电子系统与热电偶耦合电子卡到冷轨公开(公告)号：US20120281358A1
公开(公告)日：2012-11-08
申请号：US13102211
申请日：2011-05-06
申请人： Timothy J. CHAINER , Michael A. GAYNES , David P. GRAYBILL , Madhusudan K. IYENGAR , Vinod KAMATH , Bejoy J. KOCHUPARAMBIL , Roger R. SCHMIDT , Mark D. SCHULTZ , Daniel P. SIMCO , Mark E. STEINKE
发明人： Timothy J. CHAINER , Michael A. GAYNES , David P. GRAYBILL , Madhusudan K. IYENGAR , Vinod KAMATH , Bejoy J. KOCHUPARAMBIL , Roger R. SCHMIDT , Mark D. SCHULTZ , Daniel P. SIMCO , Mark E. STEINKE
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781 , H05K7/2079
摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
摘要翻译： 提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内或从插座中取出卡。 液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。
-
公开(公告)号：US08255740B2
公开(公告)日：2012-08-28
申请号：US12891309
申请日：2010-09-27
IPC分类号： G06F11/00
CPC分类号： G06F11/0793 , G06F11/073
摘要： Embodiments of the present invention include computer-implemented methods for selectively applying remedial actions, according to a predefined order, for reducing the error rate in a computer memory system. In one embodiment, an ordered set of remedial actions are sequentially invoked in response to a single-bit error (SBE) in a DIMM reaching successive error thresholds. For example, in an air-cooled system, the remedial actions may include dynamically increasing a DIMM refresh rate, dynamically increasing a rate of airflow used to cool the DIMMs, and dynamically throttling the DIMMs. The remedial actions may be layered as they are successively invoked, to provide a cumulative remedial effect. At least two of the remedial actions may be simultaneously invoked in response to a multi-bit error rate reaching an associated threshold.
摘要翻译： 本发明的实施例包括用于根据预定义的顺序选择性地应用补救动作以减少计算机存储器系统中的错误率的计算机实现的方法。 在一个实施例中，响应于DIMM中的单位错误（SBE）达到连续的错误阈值，顺序地调用有序的一组补救动作。 例如，在风冷系统中，补救措施可以包括动态地增加DIMM刷新速率，动态地增加用于冷却DIMM的气流速率，以及动态地调节DIMM。 补救措施可以按照它们被依次调用来分层，以提供累积的补救效果。 响应于达到相关阈值的多位错误率，可以同时调用至少两个补救动作。
-
19.发明申请ELECTROHYDRODYNAMIC AIRFLOW ACROSS A HEAT SINK USING A NON-PLANAR ION EMITTER ARRAY 有权使用非平面离子发射器阵列的散热器进行电动气动公开(公告)号：US20120048529A1
公开(公告)日：2012-03-01
申请号：US12872107
申请日：2010-08-31
申请人： Michael S. June , Chunjian Ni , Dana S. Royer , Mark E. Steinke
发明人： Michael S. June , Chunjian Ni , Dana S. Royer , Mark E. Steinke
CPC分类号： H05K7/2039 , F28F13/16 , H01L23/3672 , H01L23/467 , H01L2924/0002 , Y10T29/49002 , H01L2924/00
摘要： A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.
摘要翻译： 用于冷却发热装置的系统包括形成电动力（EHD）空气流动装置的散热器和多个离子发射器元件。 散热器具有与诸如处理器之类的发热装置热连通的基座。 多个散热鳍片耦合到电接地以形成离子收集器。 离子发射器元件沿着多个翅片的第一端设置在非平面图案中，使得每个离子发射器元件与最近翅片的第一端等距。 电源在多个离子发射器元件和多个翅片之间施加电势，以引起使散热器流过散热器的离子流。 优选具有与散热片的每个翅片等距的至少三个离子发射器元件。
-
20.发明申请LIQUID COOLANT CONDUIT SECURED IN AN UNUSED SOCKET FOR MEMORY MODULE COOLING 有权液体冷却液管道用于存储模块冷却的未使用的插座公开(公告)号：US20110286175A1
公开(公告)日：2011-11-24
申请号：US12785779
申请日：2010-05-24
申请人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, JR. , Mark E. Steinke , Aparna Vallury
发明人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, JR. , Mark E. Steinke , Aparna Vallury
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.
摘要翻译： 用于冷却安装在计算机系统中的存储器模块的装置包括液体冷却剂导管，该液体冷却剂导管连接到导管支撑结构，导管支撑结构具有选择性地固定在计算机系统的第一预配置存储器模块插槽内的形状因子，以便定位液体冷却剂导管 在第一个插槽之上。 热管提供液体导管与散热器组件之间的直接热接触，与存储器模块的表面直接热接触。 该装置可以包括用于类似地冷却第二存储器模块的第二热管和第二散热器组件。 在替代配置中，设备可以冷却导管的相对侧上的存储器模块或存储器模块，这些存储器模块都在导管的同一侧。
-
-
-
-
-
-
-
-
-
搜索结果
55 条记录 (耗时 0.017 秒)
