Abstract:
Methods 300 and 350 are disclosed for fabricating shallow isolation trenches and structures in multi-bit SONOS flash memory devices. One method aspect 300 comprises forming 310 a multi-layer dielectric-charge trapping-dielectric stack 420 over a substrate 408 of the wafer 402, for example, an ONO stack 420, removing 312 the multi-layer dielectric-charge trapping-dielectric stack 420 in a periphery region 406 of the wafer 402, thereby defining a multi-layer dielectric-charge trapping-dielectric stack 420 in a core region 404 of the wafer 402. The method 300 further comprises forming 314 a gate dielectric layer 426 over the periphery region 406 of the substrate 408, forming 316 a first polysilicon layer 428 over the multi-layer dielectric-charge trapping-dielectric stack 420 in the core region 402 and the gate dielectric 426 in the periphery region 406 , then concurrently forming 318 an isolation trench 438 in the substrate 408 in the core region 404 and in the periphery region 406. Thereafter, the isolation trenches are filled 326 with a dielectric material 446, and a second polysilicon layer 452 that is formed 332 over the first polysilicon layer 428 and the filled trenches 438, forming an self-aligned STI structure 446. The method 300 avoids ONO residual stringers at STI edges in the periphery region, reduces active region losses, reduces thinning of the periphery gate oxide and the ONO at the STI edge, and reduces dopant diffusion during isolation implantations due to reduced thermal process steps.
Abstract:
A memory device may include a source region and a drain region formed in a substrate and a channel region formed in the substrate between the source and drain regions. The memory device may further include a first oxide layer formed over the channel region, the first oxide layer having a first dielectric constant, and a charge storage layer formed upon the first oxide layer. The memory device may further include a second oxide layer formed upon the charge storage layer, a layer of dielectric material formed upon the second oxide layer, the dielectric material having a second dielectric constant that is greater than the first dielectric constant, and a gate electrode formed upon the layer of dielectric material.
Abstract:
A semiconductor device includes a substrate that further includes source, drain and channel regions. The device may further include a bottom oxide layer formed upon the substrate, a charge storage layer formed upon the bottom oxide layer, and a steam oxide layer thermally grown upon the charge storage layer. The device may also include an alumina oxide layer formed upon the steam oxide layer and a gate electrode formed upon the alumina oxide layer.
Abstract:
A voice browser dialog enabler for multimodal dialog uses a multimodal markup document with fields have markup-based forms associated with each field and defining fragments. A voice browser driver resides on a communication device and provides the fragments and identifiers that identify the fragments. A voice browser implementation resides on a remote voice server and receives the fragments from the driver and downloads a plurality of speech grammars. Input speech is matched against those speech grammars associated with the corresponding identifiers received in a recognition request from the voice browser driver.
Abstract:
Methods and structures are presented for protecting flash memory wordlines and memory cells from process-related charging during fabrication. Undoped polysilicon is formed at the ends of doped polysilicon wordlines to create resistors through which process charges are discharged to a doped polysilicon discharge structure coupled with a substrate. The wordlines, resistors, and the discharge structure can be formed as a unitary patterned polysilicon structure, where the wordline and discharge portions are selectively doped to be conductive and the resistor portions are substantially undoped to provide a resistance high enough to allow normal cell operation after fabrication while providing a discharge path for process-related charging during fabrication.
Abstract:
A memory cell array comprises a two dimensional array of memory cells fabricated on a semiconductor substrate. The memory cells are arranged in a plurality of rows and a plurality columns. Each column of memory cells comprising a plurality of alternating channel regions and source/drain regions. A conductive interconnect is positioned above each source/drain region and coupled to only one other source/drain region. The one other source/drain region is in a second column that is adjacent to the column. The conductive interconnects are positioned such that every other conductive interconnect connects to the adjacent column to a right side of the column and every other conductive interconnect connects to adjacent column to the left side of the column. A plurality of source/drain control lines extends between adjacent columns of memory cells and electrically couples to each conductive interconnect that couples between the adjacent columns.
Abstract:
A replaceable roller bogie for a single sheet feeder includes pre-feed and separation rollers mounted on a frame which also has a frame positioning lever thereon. Roller drive gears are mounted between spaced plates on the frame and include a pre-feed roller clutch gear with elastomeric teeth which is mounted in slots on the frame which limit motion travel of the clutch gear to prevent over engagement of gear teeth on the clutch gear with gear teeth on the pre-feed roller drive gear. The replaceable bogie is pivotally supported on the sheet feeder and held in place by a manually operable release and latch mechanism.
Abstract:
A cream substitute comprising from 5% to 40% by weight of butter, from about 0.25% to about 5% by weight of a thickening agent, and about 0.25% to about 4% of a food protein, based on the total weight of the cream substitute, together with a sufficient amount of water to total 100% by weight, and, optionally, from about 0.05% to about 2% by weight of a food acceptable acid.
Abstract:
One aspect of the present invention relates to a method of forming spacers in a silicon-oxide-nitride-oxide-silicon (SONOS) type nonvolatile semiconductor memory device, involving the steps of providing a semiconductor substrate having a core region and periphery region, the core region containing SONOS type memory cells and the periphery region containing gate transistors; implanting a first implant into the core region and a first implant into the periphery region of the semiconductor substrate; forming a spacer material over the semiconductor substrate; masking the core region and forming spacers adjacent the gate transistors in the periphery region; and implanting a second implant into the periphery region of the semiconductor substrate.
Abstract:
A method and system for providing a flash memory cell on a semiconductor is disclosed. In one aspect, the method and system include providing a plurality of gate stacks and providing a drain implant at an angle. The plurality of gate stacks define a plurality of drain areas and a plurality of source areas. The angle is measured from a direction perpendicular to the surface of the semiconductor. The angle allows the plurality of gate stacks to block the drain implant from reaching the plurality of source areas. In another aspect, the method and system include providing a plurality of gate stacks and providing a source implant at an angle. The plurality of gate stacks define a plurality of drain areas and a plurality of source areas. The angle is measured from a direction perpendicular to the surface of the semiconductor. The angle allows the plurality of gate stacks to block the source implant from reaching the plurality of drain areas.