Memory cell array with staggered local inter-connect structure
    1.
    发明申请
    Memory cell array with staggered local inter-connect structure 失效
    具有交错局部互连结构的存储单元阵列

    公开(公告)号:US20050077567A1

    公开(公告)日:2005-04-14

    申请号:US10685044

    申请日:2003-10-14

    摘要: A memory cell array comprises a two dimensional array of memory cells fabricated on a semiconductor substrate. The memory cells are arranged in a plurality of rows and a plurality columns. Each column of memory cells comprising a plurality of alternating channel regions and source/drain regions. A conductive interconnect is positioned above each source/drain region and coupled to only one other source/drain region. The one other source/drain region is in a second column that is adjacent to the column. The conductive interconnects are positioned such that every other conductive interconnect connects to the adjacent column to a right side of the column and every other conductive interconnect connects to adjacent column to the left side of the column. A plurality of source/drain control lines extends between adjacent columns of memory cells and electrically couples to each conductive interconnect that couples between the adjacent columns.

    摘要翻译: 存储单元阵列包括在半导体衬底上制造的存储器单元的二维阵列。 存储单元布置成多行和多列。 每列存储单元包括多个交替沟道区和源极/漏极区。 导电互连位于每个源极/漏极区域上方并且仅耦合到另一个源极/漏极区域。 另一个源/漏区位于与该列相邻的第二列中。 导电互连被定位成使得每隔一个导电布线连接到列的右侧的相邻列,并且每隔一个导电布线连接到列的左侧的相邻列。 多个源极/漏极控制线在相邻列的存储器单元之间延伸,并且电耦合到在相邻列之间耦合的每个导电互连。

    Method and system for using a spacer to offset implant damage and reduce lateral diffusion in flash memory devices
    3.
    发明授权
    Method and system for using a spacer to offset implant damage and reduce lateral diffusion in flash memory devices 有权
    使用间隔物补偿植入物损伤并减少闪存装置中的横向扩散的方法和系统

    公开(公告)号:US06410956B1

    公开(公告)日:2002-06-25

    申请号:US09478864

    申请日:2000-01-07

    IPC分类号: H01L2976

    CPC分类号: H01L29/66825

    摘要: A system and method for providing a memory cell on a semiconductor is disclosed. In one aspect, the method and system include providing at least one gate stack on the semiconductor, depositing at least one spacer, and providing at least one source implant in the semiconductor. The at least one gate stack has an edge. A portion of the at least one spacer is disposed along the edge of the at least one gate stack. In another aspect, the method and system include providing at least one gate stack on the semiconductor, providing a first junction implant in the semiconductor, depositing at least one spacer, and providing a second junction implant in the semiconductor after the at least one spacer is deposited. The at least one gate stack has an edge. A portion of the at least one spacer is disposed at the edge of the at least one gate stack. In a third aspect, the method and system include providing at least one gate stack on the semiconductor, providing at least one source implant in the semiconductor, depositing at least one spacer after the at least one source implant is provided, and providing at least one drain implant in the semiconductor after the spacer is deposited. The at least one gate has an edge. A portion of the at least one spacer is disposed along the edge of the at least one gate.

    摘要翻译: 公开了一种在半导体上提供存储单元的系统和方法。 在一个方面,所述方法和系统包括在半导体上提供至少一个栅极堆叠,沉积至少一个间隔物,以及在半导体中提供至少一个源极注入。 至少一个栅极堆叠具有边缘。 所述至少一个间隔物的一部分沿着所述至少一个栅极叠层的边缘设置。 在另一方面,该方法和系统包括在半导体上提供至少一个栅极叠层,在半导体中提供第一结注入,沉积至少一个间隔物,以及在至少一个间隔物之后在半导体中提供第二结注入 存放 至少一个栅极堆叠具有边缘。 所述至少一个间隔件的一部分设置在所述至少一个栅极叠层的边缘处。 在第三方面,所述方法和系统包括在半导体上提供至少一个栅极堆叠,在半导体中提供至少一个源极注入,在提供至少一个源极植入之后沉积至少一个间隔物,并且提供至少一个 在间隔物沉积之后在半导体中的漏极注入。 至少一个门具有边缘。 所述至少一个间隔物的一部分沿着所述至少一个栅极的边缘设置。

    Ramp source hot-hole programming for trap based non-volatile memory devices
    5.
    发明授权
    Ramp source hot-hole programming for trap based non-volatile memory devices 有权
    用于基于陷阱的非易失性存储器设备的斜坡源热孔编程

    公开(公告)号:US06934190B1

    公开(公告)日:2005-08-23

    申请号:US10863933

    申请日:2004-06-09

    IPC分类号: G11C16/04 G11C16/10 G11C16/34

    CPC分类号: G11C16/10 G11C16/3454

    摘要: Methods of operating dual bit memory devices including programming with a range of values are provided. The present invention employs a range of ramp source program pulses to iteratively perform a program operation that employs hot hole injection. The range is related to channel lengths of individual dual bit memory cells within the memory device. To program a bit of a particular dual bit memory cell, a negative gate program voltage is applied to its gate, a positive drain voltage is applied to its acting drain, and its substrate is connected to ground. Additionally, a ramp source voltage of the range of ramp source program pulses is concurrently applied to an acting source of the dual bit memory cell. A verification operation is then performed and the programming is repeated with a decremented ramp source voltage on verification failure.

    摘要翻译: 提供了包括具有一定范围值的编程的双位存储器件的操作方法。 本发明采用一系列斜坡源程序脉冲来迭代地执行采用热空穴注入的程序操作。 该范围与存储器件内的各个双位存储单元的通道长度有关。 为了编程一个特定的双位存储单元,负栅极编程电压被施加到其栅极,正的漏极电压被施加到其作用漏极,并且其衬底连接到地。 此外,斜坡源程序脉冲范围的斜坡源电压同时施加到双位存储单元的作用源。 然后执行验证操作,并且在验证失败时以递减的斜坡源电压重复编程。

    Diode fabrication for ESD/EOS protection
    8.
    发明授权
    Diode fabrication for ESD/EOS protection 有权
    用于ESD / EOS保护的二极管制造

    公开(公告)号:US06770938B1

    公开(公告)日:2004-08-03

    申请号:US10050394

    申请日:2002-01-16

    IPC分类号: H01L2362

    CPC分类号: H01L27/0255

    摘要: An ESD protection device is provided for an integrated circuit. The ESD protection device includes a power supply clamp device formed from a diode and coupled between a first power supply VCC and a second power supply VSS. An input protection device is also provided which is formed from a diode coupled between an input pad and the first power supply and a second diode coupled between the input pad and a second power supply. The diodes have an adjusted reverse breakdown voltage that is higher than the voltage supply VCC used to power the peripheral circuitry that drives circuitry within a core of the integrated circuit. The adjusted reverse breakdown voltage is also lower than the breakdown voltage of gate oxide layers used within the peripheral circuitry.

    摘要翻译: 为集成电路提供ESD保护装置。 ESD保护装置包括由二极管形成并耦合在第一电源VCC和第二电源VSS之间的电源钳位装置。 还提供一种输入保护装置,其由耦合在输入焊盘和第一电源之间的二极管和耦合在输入焊盘和第二电源之间的第二二极管形成。 二极管具有调整的反向击穿电压,其高于用于为驱动集成电路的核心内的电路的外围电路供电的电压源VCC。 调整的反向击穿电压也低于在外围电路中使用的栅极氧化物层的击穿电压。