Abstract:
A lighting device (1) comprising at least one light source (7), at least one at least partially transparent bulb (4) at least partially surrounding the at least one light source (7), and at least one base (2) for mechanically holding and electrically contacting the lighting device (1), wherein the bulb (4) at least partially features a plurality of plane sections (5) on at least one surface (11, 12) of the bulb (4).
Abstract:
A heat sink (2;16,17;22) for an illumination device (1;15;20), wherein the heat sink is made up of comprises several heat sink parts (3,4;16,17;23,27), wherein at least two of the heat sink parts (3,4;16,17;23,27) include different heat sink materials
Abstract:
A motor-vehicle headlight is specified, having at least one light-emitting diode, and an apparatus for controllable manipulation of the beam path of the electromagnetic radiation emitted from the light-emitting diode. The described motor-vehicle headlight is distinguished inter alia by a particularly variable emission characteristic.
Abstract:
In various embodiments, a lighting device is provided, which may include at least one semiconductor light source, at least one sensor and evaluation electronics functionally connected to the at least one sensor, wherein the evaluation electronics are arranged to trigger at least one action of the lighting device upon at least one predetermined sensor signal of the at least one sensor.
Abstract:
An optoelectronic semiconductor device at least one radiation-emitting semiconductor chip (3); at least one converter element (4) disposed downstream of the semiconductor chip (3) and serving for converting electromagnetic radiation emitted by the semiconductor chip (3) during operation, wherein the converter element (4) emits colored light upon irradiation with ambient light; a means for diffusely scattering light (5), which is designed to scatter ambient light impinging on the device in a switched-off operating state of the device in such a way that a light exit area (62) of the device appears white.
Abstract:
A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.
Abstract:
In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.
Abstract:
A housing includes a housing underpart, the housing underpart being provided with a housing cavity. The housing cavity comprises an opening on one housing side and, on the floor of the cavity, contains an electromagnetic radiation emitting semiconductor chip. A cover that is at least partially transparent to the electromagnetic radiation covers the housing cavity. A method for emitting electromagnetic radiation in a preferred direction is also disclosed.
Abstract:
An LED array comprising at least two LED chips (2) contains a temperature sensor (3), and means are provided for regulating the operating current of the LED chips (2) as a function of the temperature detected by the temperature sensor (3). This makes it possible for the LED chips (2) to be operated for long periods at high operating current, thereby reducing the risk of thermal overload.
Abstract:
A light-emitting diode arrangement having at least one light-emitting diode chip (1), each light-emitting diode chip (1) being assigned at least one optical element (4). In addition, the light-emitting diode arrangement has at least one heat-conducting element (13) which is suitable to carry away the heat generated by the light-emitting diode chip, and at least one cooling apparatus which is suitable to carry heat away from the heat-conducting element. The light-emitting diode arrangement is particularly well suited, for example, to use in motor vehicle headlamps.