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    Housing comprising a housing underpart and method for emitting electromagnetic radiation
    1.
    发明授权
    Housing comprising a housing underpart and method for emitting electromagnetic radiation 有权
    壳体包括壳体和用于发射电磁辐射的方法

    公开(公告)号：US08220973B2

    公开(公告)日：2012-07-17

    申请号：US12198393

    申请日：2008-08-26

    申请人： Moritz Engl ,  Florin Oswald

    发明人： Moritz Engl ,  Florin Oswald

    IPC分类号： F21V5/00

    CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A housing includes a housing underpart, the housing underpart being provided with a housing cavity. The housing cavity comprises an opening on one housing side and, on the floor of the cavity, contains an electromagnetic radiation emitting semiconductor chip. A cover that is at least partially transparent to the electromagnetic radiation covers the housing cavity. A method for emitting electromagnetic radiation in a preferred direction is also disclosed.

    摘要翻译： 壳体包括下部的壳体，所述壳体下部具有壳体空腔。 壳体腔包括在一个壳体侧上的开口，并且在空腔的地板上包含电磁辐射发射半导体芯片。 对电磁辐射至少部分透明的盖子覆盖壳体空腔。 还公开了在优选方向上发射电磁辐射的方法。

    HOUSING COMPRISING A HOUSING UNDERPART AND METHOD FOR EMITTING ELECTROMAGNETIC RADIATION
    3.
    发明申请
    HOUSING COMPRISING A HOUSING UNDERPART AND METHOD FOR EMITTING ELECTROMAGNETIC RADIATION 有权
    包含壳体的壳体和用于发射电磁辐射的方法

    公开(公告)号：US20090059588A1

    公开(公告)日：2009-03-05

    申请号：US12198393

    申请日：2008-08-26

    申请人： Moritz Engl ,  Florin Oswald

    发明人： Moritz Engl ,  Florin Oswald

    IPC分类号： F21V13/00

    CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A housing includes a housing underpart, the housing underpart being provided with a housing cavity. The housing cavity comprises an opening on one housing side and, on the floor of the cavity, contains an electromagnetic radiation emitting semiconductor chip. A cover that is at least partially transparent to the electromagnetic radiation covers the housing cavity. A method for emitting electromagnetic radiation in a preferred direction is also disclosed.

    摘要翻译： 壳体包括下部的壳体，所述壳体下部具有壳体空腔。 壳体腔包括在一个壳体侧上的开口，并且在空腔的地板上包含电磁辐射发射半导体芯片。 对电磁辐射至少部分透明的盖子覆盖壳体空腔。 还公开了在优选方向上发射电磁辐射的方法。

    Optoelectronic component
    9.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US08093610B2

    公开(公告)日：2012-01-10

    申请号：US12443305

    申请日：2007-09-07

    申请人： Alexander Wilm ,  Julius Muschaweck ,  Moritz Engl

    发明人： Alexander Wilm ,  Julius Muschaweck ,  Moritz Engl

    IPC分类号： H01L33/00

    CPC分类号： H01L33/50 ,  H01L33/44 ,  H01L33/58

    摘要： An optoelectronic component with a desired color impression in the switched-off state includes, in particular, a semiconductor layer sequence with an active region, that during operation radiates electromagnetic radiation with a first spectrum, and a wavelength conversion layer that is disposed downstream from the semiconductor layer sequence in the beam path of the electromagnetic radiation with the first spectrum, and that at least partially converts a subspectrum of the electromagnetic radiation with the first spectrum into electromagnetic radiation with a second spectrum, and a filter layer that reflects at least a part of the radiation incident from outside onto the optoelectronic component.

    摘要翻译： 在关断状态下具有期望的色彩印象的光电子部件特别包括具有有源区的半导体层序列，其在操作期间辐射具有第一光谱的电磁辐射，以及波长转换层，其布置在 具有第一光谱的电磁辐射的光束路径中的半导体层序列，并且将具有第一光谱的电磁辐射的子光谱至少部分地转换成具有第二光谱的电磁辐射，以及反射至少一部分的滤光层 从外部入射到光电子部件上的辐射。

    LED array
    10.
    发明授权
    LED array 有权
    LED阵列

    公开(公告)号：US07726835B2

    公开(公告)日：2010-06-01

    申请号：US11816951

    申请日：2006-02-06

    申请人： Georg Bogner ,  Moritz Engl ,  Stefan Grötsch ,  Patrick Kromotis ,  Jorg Erich Sorg

    发明人： Georg Bogner ,  Moritz Engl ,  Stefan Grötsch ,  Patrick Kromotis ,  Jorg Erich Sorg

    IPC分类号： H01L27/15

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/42 ,  H01L33/505 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface, and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.

    摘要翻译： 在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体， 透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面 ，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。 至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。