公开(公告)号：US20160248094A1

公开(公告)日：2016-08-25

申请号：US15027175

申请日：2014-10-01

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Hiroshi NAGATA ,  Yasuo CHIKUSA

IPC: H01M4/62 ,  H01M10/054 ,  H01M10/0562 ,  H01M4/136 ,  H01M4/38

CPC classification number: H01M4/62 ,  H01M4/136 ,  H01M4/38 ,  H01M4/381 ,  H01M4/5815 ,  H01M4/625 ,  H01M10/054 ,  H01M10/0562 ,  H01M2004/027 ,  H01M2004/028

Abstract: The present invention aims to maximize the advantageous physical properties of sulfur and provide a cathode mixture that can be suitably used in a cathode mixture layer of an all-solid-state sodium-sulfur battery in which charge/discharge capacity can be ensured even during operation at normal temperature. The present invention also aims to provide an all-solid-state sodium-sulfur battery including a cathode mixture layer containing the cathode mixture. The present invention relates to a cathode mixture for use in a cathode mixture layer of an all-solid-state sodium-sulfur battery, the cathode mixture including the following components (A) to (C): (A) an ion-conductive material containing phosphorus at a weight ratio of 0.2 to 0.55; (B) sulfur and/or its discharge product; and (C) a conductive material, the component (C) containing a conductive material (C1) having a specific surface area of 1000 m2/g or more.

Abstract translation: 本发明的目的在于使硫的有利物理性能最大化，并提供可以适用于全固态钠硫电池的阴极混合物层的阴极混合物，其中即使在操作期间也能确保充放电容量 在常温下。 本发明的目的还在于提供一种包含阴极混合物层的全固态钠硫电池。 本发明涉及一种用于全固态钠硫电池的阴极混合层的阴极混合物，该阴极混合物包括以下组分（A）至（C）：（A）离子导电材料 含磷重量比为0.2〜0.55; （B）硫和/或其排出产物; 和（C）导电材料，含有比表面积为1000m 2 / g以上的导电材料（C1）的组分（C）。

公开(公告)号：US20160196892A1

公开(公告)日：2016-07-07

申请号：US14591591

申请日：2015-01-07

Applicant: Nagase ChemteX Corporation

Inventor： Tatsuya OHORI ,  Yasunori KURUSHIMA ,  Takashi HASEGAWA ,  Takahiro SAKURAI

IPC: H01B1/12 ,  C09D11/108 ,  G06F3/041 ,  C09D141/00 ,  H01B13/34 ,  C09D11/52 ,  C09D181/02

CPC classification number: H01B1/127 ,  C09D11/10 ,  C09D11/52 ,  C09D141/00 ,  C09D181/02 ,  G06F3/041

Abstract: Provided is a conductive resin composition suitable for forming a transparent conductive film with good appearance and excellent transparency. The conductive resin composition includes: (A) a conductive polymer; (B) a conductivity enhancer; (C) a binder; and (D) a thickener, the composition having a viscosity at 25° C. of 50 to 8000 dPa·s, and containing the thickener (D) in an amount of less than 200 parts by weight per 100 parts by weight of solids of the conductive polymer (A).

Abstract translation: 提供一种适合于形成外观美观，透明度优异的透明导电膜的导电性树脂组合物。 导电性树脂组合物包括：（A）导电性高分子; （B）电导率增强剂; （C）粘合剂; 和（D）增稠剂，该组合物在25℃下的粘度为50至8000dPa·s，并且每100重量份固体的固体含有少于200重量份的增稠剂（D） 导电聚合物（A）。

公开(公告)号：US20150225589A1

公开(公告)日：2015-08-13

申请号：US14616260

申请日：2015-02-06

Applicant: Nagase ChemteX Corporation

Inventor： Tatsuya OHORI ,  Yasunori KURUSHIMA ,  Takahiro SAKURAI

IPC: C09D11/52 ,  C09D11/102 ,  H01B1/12 ,  C09D11/108

CPC classification number: C09D11/52 ,  C09D11/10 ,  H01B1/124

Abstract: Provided is an ink composition having excellent printing properties and capable of forming a thick transparent conductive film with low surface resistivity even when it is used in gravure offset printing or pad printing. The ink composition contains (A) a conductive polymer, (B) a binder, and (C) a conductivity enhancer, wherein the composition has a viscosity at 25° C. of 5 to 500 dPa·s and a solids content of 10% to 80% by weight, and the composition exhibits a surface resistivity of 2000 Ω/sq or lower and a total light transmittance of 70% or higher when applied at a wet film thickness of 15 μm.

Abstract translation: 提供了具有优异的印刷特性的油墨组合物，并且即使在用于凹版胶版印刷或移印印刷时也能够形成具有低表面电阻率的厚的透明导电膜。 油墨组合物含有（A）导电性聚合物，（B）粘合剂和（C）导电性增强剂，其中，组合物在25℃下的粘度为5〜500dPa·s，固体含量为10％ 至80重量％，并且当以15μm的湿膜厚度施加时，组合物的表面电阻率为2000Ω·cm·cm / sq以下，总透光率为70％以上。

公开(公告)号：US20140194590A1

公开(公告)日：2014-07-10

申请号：US14205950

申请日：2014-03-12

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Yutaka TSUJIMURA

IPC: C08G59/02

CPC classification number: C08G59/686

Abstract: Provided are a thermoplastic epoxy resin composition comprising (A) an epoxy compound having two epoxy groups in one molecule, (B) a compound having two phenolic hydroxyl groups in one molecule, and at least one compound selected from the group consisting of dihexylamine, diheptylamine, di(2-ethylhexyl)amine, N-ethylhexylamine, trihexylamine, dioctylamine, tri n-octylamine, N,N-dimethyl-n-octylamine, and N,N-dimethyldecylamine as (C) a curing accelerator, and a thermoplastic cured epoxy resin with transparency to visible light produced by curing the thermoplastic epoxy resin composition.

Abstract translation: 提供一种热塑性环氧树脂组合物，其包含（A）在一个分子中具有两个环氧基的环氧化合物，（B）在一个分子中具有两个酚羟基的化合物和至少一种选自二己胺，二庚胺 ，二（2-乙基己基）胺，N-乙基己基胺，三己胺，二辛胺，三正辛胺，N，N-二甲基正辛胺和N，N-二甲基十二胺作为（C）固化促进剂， 环氧树脂，其通过固化热塑性环氧树脂组合物而产生的可见光具有透明性。

公开(公告)号：US12129392B2

公开(公告)日：2024-10-29

申请号：US17627051

申请日：2020-07-13

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Yuki Sugiura ,  Yohei Uetsuki

IPC: C09D183/04 ,  C08K3/22 ,  C08K5/5419 ,  C08L83/04 ,  B29C59/02 ,  B29K83/00 ,  B29K105/16 ,  B29K509/02

CPC classification number: C09D183/04 ,  C08K3/22 ,  C08K5/5419 ,  C08L83/04 ,  B29C59/022 ,  B29K2083/00 ,  B29K2105/162 ,  B29K2509/02 ,  B29K2995/0088 ,  C08K2003/2237 ,  C08K2003/2244

Abstract: Provided is a resin composition for imprinting excellent in imprint properties and optical properties such as high refractive index and low haze. The invention relates to a resin composition for imprinting containing: (A) a polysiloxane resin represented by the following formula (1): (R1SiO3/2)a(R22SiO2/2)b(R33SiO1/2)c(SiO4/2)d wherein R1, R2, and R3 are each independently a hydrogen atom, a hydroxy group, an alkoxy group, a C1-C12 hydrocarbon group, or a C1-C12 substituent having one or more crosslinkable functional groups, with at least one of R1, R2, or R3 being a C1-C12 substituent having one or more crosslinkable functional groups, and when a plurality of R1s, R2s, or R3s are present, they may be different from one another; and a, b, c, and d are numbers satisfying the following conditions: 0.001≤a≤1.00, 0≤b≤0.999, 0≤c≤0.30, 0≤d≤0.30, and a+b+c+d=1.0; and (B) a fine particulate inorganic oxide, wherein the ratio by weight of the sum of the polysiloxane resin (A) and optionally an alkoxysilane compound and a curable resin to the fine particulate inorganic oxide (B) is 0.2 to 2.5.

公开(公告)号：US11848659B2

公开(公告)日：2023-12-19

申请号：US16651833

申请日：2018-09-28

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki Hashimoto ,  Takuya Ishibashi ,  Hiroyuki Okada ,  Kazuki Nishimura

IPC: H03H9/10 ,  B29C51/12 ,  B29C51/14 ,  B32B27/08 ,  H03H9/05 ,  H05K3/28 ,  H10N30/02 ,  H10N30/88 ,  H10N30/87 ,  B29K101/10 ,  B29L31/34

CPC classification number: H03H9/1085 ,  B29C51/12 ,  B29C51/14 ,  B32B27/08 ,  H03H9/059 ,  H05K3/284 ,  H10N30/02 ,  H10N30/875 ,  H10N30/88 ,  H10N30/883 ,  B29K2101/10 ,  B29L2031/34 ,  Y10T29/49146

Abstract: A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a step of preparing a sheet having thermosetting property; a disposing step of disposing the sheet on the mounting member so as to face the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members and to cure the sheet, wherein the second circuit members include a reference member, and a first adjacent member and a second adjacent member each adjacent to the reference member, a separation distance D1 between the reference member and the first adjacent member is different from a separation distance D2 between the reference member and the second adjacent member, at least one of the plurality of the second circuit members is a hollow member to be provided with a space from the first circuit member, and in the sealing step, the plurality of the second circuit members are sealed so as to maintain the space.

公开(公告)号：US11710645B2

公开(公告)日：2023-07-25

申请号：US16772643

申请日：2018-12-13

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Eiichi Nomura ,  Yutaka Miyamoto ,  Takayuki Hashimoto

IPC: H01L21/56 ,  H05K3/46 ,  H01L23/12 ,  H01L23/31 ,  H03H3/08 ,  H03H9/25 ,  H05K1/14

CPC classification number: H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H03H3/08 ,  H03H9/25 ,  H05K1/144 ,  H05K3/4632 ,  H05K2203/068 ,  H05K2203/1147

Abstract: A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

公开(公告)号：US20210053258A1

公开(公告)日：2021-02-25

申请号：US16999743

申请日：2020-08-21

Applicant: Nagase Chemtex Corporation

Inventor： Yosuke Oi

IPC: B29C43/14 ,  C08K7/18 ,  B29C43/00

Abstract: A method of producing a sealed structure, the method including: preparing a substrate and a curable resin composition in a liquid form; and sealing the substrate with the curable resin composition, to form a sealed body including the substrate and a cured product of the curable resin composition. The sealing step includes: printing the curable resin composition onto the substrate, to cover the substrate with a first coating film of the curable resin composition; and compression-molding the first coating film and the substrate together using a mold, with a pressing surface of the mold abut against the first coating film, to convert the first coating film into a second coating film. A ratio of a projected area S1 of the first coating film onto the substrate to a projected area S2 of the second coating film onto the substrate: S1/S2 is 0.9 or more.

公开(公告)号：US20200287518A1

公开(公告)日：2020-09-10

申请号：US16650709

申请日：2018-09-28

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki HASHIMOTO ,  Takuya ISHIBASHI ,  Kazuki NISHIMURA

IPC: H03H9/08 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H01L41/047 ,  H01L41/053 ,  H01L41/23 ,  H01L41/338

Abstract: A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a laminate sheet including a first thermal-conductive layer and a second thermal-conductive layer, the first thermal-conductive layer disposed at least on one outermost side; a disposing step of disposing the laminate sheet on the mounting member such that the first thermal-conductive layer faces the second circuit members; and a sealing step of pressing the laminate sheet against the first circuit member and heating the laminate sheet, to seal the second circuit members so as to maintain the space, and to cure the laminate sheet. The first thermal-conductive layer after curing has a coefficient of thermal conductivity in a thickness direction at room temperature being equal to or greater than that in a principal surface direction, and the second thermal-conductive layer after curing has a coefficient of thermal conductivity in a principal surface direction at room temperature being greater than that in a thickness direction.

公开(公告)号：US20190300764A1

公开(公告)日：2019-10-03

申请号：US16354613

申请日：2019-03-15

Applicant: SUMITOMO RUBBER INDUSTRIES, LTD. ,  NAGASE CHEMTEX CORPORATION

Inventor： Masumi SUZUKI ,  Yogun KIDA ,  Takuya KURIHARA ,  Dong MIAO ,  Noboru OKABE ,  Natsuki MAEKAWA ,  Toyohiro NAGANO ,  Masato FUSHIKI ,  Tetsuya HOSOMI

IPC: C09J163/00 ,  B60C11/00 ,  D06M13/395 ,  D06M15/55 ,  D06M15/693 ,  C09J11/06

Abstract: An object of the present disclosure is to provide an adhesive composition for an organic fiber which has excellent heat-resistant adhesiveness that allows an organic fiber and a rubber composition to maintain high adhesive force even when being exposed to high temperatures.An adhesive composition for an organic fiber contains: (a) an epoxy compound that is a sorbitol polyglycidyl ether and has a chlorine content not greater than 9.6% by weight; and (b) a blocked isocyanate.