公开(公告)号：US20100119436A1

公开(公告)日：2010-05-13

申请号：US12531283

申请日：2008-03-07

Applicant: Yuji Takimoto ,  Naoto Ohta ,  Tetsuro Tojo

Inventor： Yuji Takimoto ,  Naoto Ohta ,  Tetsuro Tojo

IPC: D01F9/12

CPC classification number: B01J21/185 ,  B01J23/83 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/17 ,  C01B2202/06 ,  H01J9/025 ,  H01J2201/30469

Abstract: A purification method for a carbon material containing carbon nanotubes is provided, which satisfies the following requirements: The method should prevent carbon nanotubes from being damaged, broken or flocculated; the method should be capable of removing the catalyst metal and carbon components other than the carbon nanotubes; and the method should be applicable to not only multi-walled carbon nanotubes but also single-walled carbon nanotubes which will undergo significant structural changes when heated to 1400° C. or higher temperatures. The method is characterized by including a carbon material preparation process for preparing a carbon material containing carbon nanotubes by an arc discharge method, using an anode made of a material containing at least carbon and a catalyst metal; and a halogen treatment process for bringing the carbon material into contact with a gas containing a halogen and/or halogen compound.

Abstract translation: 提供了一种含有碳纳米管的碳材料的净化方法，该方法满足以下要求：该方法应防止碳纳米管受损，破裂或絮凝; 该方法应能除去碳纳米管以外的催化剂金属和碳成分; 该方法不仅适用于多壁碳纳米管，而且还适用于单层碳纳米管，当加热至1400℃或更高温度时，其将经历显着的结构变化。 该方法的特征在于包括通过电弧放电法制备含有碳纳米管的碳材料的碳材料制备方法，使用由至少含有碳和催化剂金属的材料制成的阳极; 以及使碳材料与含有卤素和/或卤素化合物的气体接触的卤素处理方法。

公开(公告)号：US06558791B2

公开(公告)日：2003-05-06

申请号：US09828836

申请日：2001-04-10

Applicant: Hidekazu Matsuura ,  Yoshihide Iwazaki ,  Naoto Ohta

Inventor： Hidekazu Matsuura ,  Yoshihide Iwazaki ,  Naoto Ohta

IPC: B32B2734

CPC classification number: H01L23/4951 ,  H01L23/49513 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/181 ,  Y10T428/2852 ,  Y10T428/2887 ,  Y10T428/2896 ,  Y10T428/31663 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part between the semiconductor chip and the lead frame with a sealant. The adhesive has a coming-out length of not more than 2 mm and a water absorption rate of not more than 3 wt. %. Preferably, the adhesive has a glass transition point of at least 200° C.

Abstract translation: 提供一种耐热粘合剂，用于制造半导体封装的粘合剂构件，其通过用粘合剂构件将半导体芯片接合到引线框架并且至少密封半导体芯片以及半导体芯片与第二半导体芯片之间的接合部分 引线框与密封剂。 粘合剂的出料长度不大于2mm，吸水率不超过3重量％。 ％。 优选地，粘合剂具有至少200℃的玻璃化转变点

公开(公告)号：US06489027B1

公开(公告)日：2002-12-03

申请号：US09457745

申请日：1999-12-10

Applicant: Teruhisa Kondo ,  Toshiaki Sogabe ,  Toshiharu Hiraoka ,  Masatoshi Yamaji ,  Naoto Ohta

Inventor： Teruhisa Kondo ,  Toshiaki Sogabe ,  Toshiharu Hiraoka ,  Masatoshi Yamaji ,  Naoto Ohta

IPC: B32B900

CPC classification number: C04B35/6267 ,  C04B35/521 ,  C04B35/524 ,  C04B35/83 ,  C04B2235/46 ,  C04B2235/48 ,  C04B2235/5248 ,  C04B2235/658 ,  C04B2235/72 ,  C04B2235/725 ,  C04B2235/77 ,  C04B2235/96 ,  C30B15/10 ,  C30B35/002 ,  D01F9/12 ,  Y10T428/30 ,  Y10T442/2984

Abstract: A high-purity carbon fiber reinforced carbon composite formed by a process which entails graphitizing a molded member packed with carbon fibers, which fibers are subjected to a purification process under halogen gas prior to being graphitized and prior to being packed with a matrix of carbon material, and the matrix of carbon material, the carbon fiber reinforced carbon composite having an impurities content of not more than 30 ppm in ash content and satisfies either or both of the following conditions for impurities: (1) V is not more than 0.12 ppm by ICP-OES; and (2) Fe is not more than 0.10 ppm by ICP-OES.

Abstract translation: 一种高纯度碳纤维增强碳复合材料，其通过使填充有碳纤维的模制构件成石墨化的方法形成，该纤维在被石墨化之前并在填充碳材料基体之前在卤素气体下进行纯化处理 和碳材料基质，灰分含量不大于30ppm的杂质含量的碳纤维增强碳复合物，满足以下条件中的任一个或两个：（1）V为0.12ppm以下 ICP-OES; 和（2）通过ICP-OES，Fe不大于0.10ppm。

公开(公告)号：US6046072A

公开(公告)日：2000-04-04

申请号：US44575

申请日：1998-03-19

Applicant: Hidekazu Matsuura ,  Yoshihide Iwazaki ,  Naoto Ohta

Inventor： Hidekazu Matsuura ,  Yoshihide Iwazaki ,  Naoto Ohta

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/4951 ,  H01L23/49513 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/181 ,  Y10T428/2852 ,  Y10T428/2887 ,  Y10T428/2896 ,  Y10T428/31663

Abstract: A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part between the semiconductor chip and the lead frame with a sealant. The adhesive has a coming-out length of not more than 2 mm and a water absorption rate of not more than 3 wt. %. Preferably, the adhesive has a glass transition point of at least 200.degree. C.

Abstract translation: 提供一种耐热粘合剂，用于制造半导体封装的粘合剂部件，其通过用粘合剂部件将半导体芯片接合到引线框架上，并且至少密封半导体芯片以及半导体芯片和半导体芯片之间的接合部分 引线框与密封剂。 粘合剂的出料长度不大于2mm，吸水率不超过3重量％。 ％。 优选地，粘合剂的玻璃化转变点至少为200℃

公开(公告)号：US20130330504A1

公开(公告)日：2013-12-12

申请号：US14002425

申请日：2012-03-09

Applicant: Takahiro Morishita ,  Hironori Orikasa ,  Makoto Tatsumi ,  Naoto Ohta ,  Masaki Okada

Inventor： Takahiro Morishita ,  Hironori Orikasa ,  Makoto Tatsumi ,  Naoto Ohta ,  Masaki Okada

IPC: C01B31/12 ,  B32B3/12 ,  C01B31/08

CPC classification number: B32B3/12 ,  C01B32/00 ,  C01B32/30 ,  C01B32/348 ,  C01P2006/11 ,  C01P2006/12 ,  C01P2006/14 ,  C01P2006/40 ,  C04B35/524 ,  C04B38/04 ,  C04B2111/00612 ,  C04B2235/3205 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/48 ,  H01G11/24 ,  H01G11/34 ,  H01M4/587 ,  Y02E60/13 ,  Y10T428/24149 ,  Y10T428/249979 ,  Y10T428/27 ,  C04B38/0054 ,  C04B38/0058

Abstract: A porous carbon that has an extremely high specific surface area while being crystalline, and a method of manufacturing the porous carbon are provided.A porous carbon has mesopores 4 and a carbonaceous wall 3 constituting an outer wall of the mesopores 4, wherein the carbonaceous wall 3 has a portion forming a layered structure. The porous carbon is fabricated by mixing a polyamic acid resin 1 as a carbon precursor with magnesium oxide 2 as template particles; heat-treating the mixture in a nitrogen atmosphere at 1000° C. for 1 hour to cause the polyamic acid resin to undergo heat decomposition; washing the resultant sample with a sulfuric acid solution at a concentration of 1 mol/L to dissolve MgO away; and heat-treating the noncrystalline porous carbon in a nitrogen atmosphere at 2500° C.

Abstract translation: 提供具有非常高的比表面积同时结晶的多孔碳，以及制造多孔碳的方法。 多孔碳具有中孔4和构成中孔4的外壁的碳壁3，其中碳壁3具有形成层状结构的部分。 通过将作为碳前体的聚酰胺酸树脂1与作为模板粒子的氧化镁2混合来制造多孔碳; 在氮气气氛中在1000℃下热处理该混合物1小时，使聚酰胺酸树脂发生热分解; 用浓度为1mol / L的硫酸溶液洗涤所得样品以溶解MgO; 并在氮气气氛中在2500℃下热处理非结晶多孔碳。

公开(公告)号：US06399203B1

公开(公告)日：2002-06-04

申请号：US09457739

申请日：1999-12-10

Applicant: Teruhisa Kondo ,  Naoto Ohta ,  Toshiaki Sogabe ,  Masatoshi Yamaji

Inventor： Teruhisa Kondo ,  Naoto Ohta ,  Toshiaki Sogabe ,  Masatoshi Yamaji

IPC: B32B900

CPC classification number: C04B35/83 ,  C04B35/522 ,  C04B2235/48 ,  C04B2235/5256 ,  C04B2235/614 ,  C04B2235/658 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/96 ,  C30B15/00 ,  C30B15/10 ,  C30B35/00 ,  Y10T117/1032 ,  Y10T428/30 ,  Y10T442/2984

Abstract: Since the dense and high purity pyrolytic-carbon-coated layer is formed with a thickness of 10-100 &mgr;m on the surface of the C/C composite, even when metallic impurities of the inside C/C composite are 5-100 ppm in ash content, similar effects to those of a known crucible made of the C/C composite whose inside was subjected to high purification can be produced to achieve full applicability to the structural elements of the CZ apparatus. Also, since the process time required or the C/C composite itself to be subjected to the high purification can be shortened, the effect of reducing the manufacturing costs considerably can be obtained.

Abstract translation: 由于在C / C复合材料的表面上形成厚度为10-100μm的致密且高纯度的热解碳涂层，即使内部C / C复合材料的金属杂质在灰分中为5-100ppm 可以制造与内部进行高纯化的C / C复合体的已知坩埚相同的效果，以实现对CZ装置的结构要素的完全适用性。 此外，由于可以缩短所需的处理时间或C / C复合材料本身进行高纯度化，所以可以显着降低制造成本。

公开(公告)号：US06372080B1

公开(公告)日：2002-04-16

申请号：US08542576

申请日：1995-10-13

Applicant: Hidekazu Matsuura ,  Yoshihide Iwazaki ,  Naoto Ohta

Inventor： Hidekazu Matsuura ,  Yoshihide Iwazaki ,  Naoto Ohta

IPC: C09J700

CPC classification number: H01L23/4951 ,  H01L23/49513 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part between the semiconductor chip and the lead frame with a sealant. The adhesive has a coming-out length of not more than 2 mm and a water absorption rate of not more than 3 wt. %. Preferably, the adhesive has a glass transition point of at least 200° C.

Abstract translation: 提供一种耐热粘合剂，用于制造半导体封装的粘合剂部件，其通过用粘合剂部件将半导体芯片接合到引线框架上，并且至少密封半导体芯片以及半导体芯片和半导体芯片之间的接合部分 引线框与密封剂。 粘合剂的出料长度不大于2mm，吸水率不超过3重量％。 ％。 优选地，粘合剂具有至少200℃的玻璃化转变点

公开(公告)号：US20090280413A1

公开(公告)日：2009-11-12

申请号：US12439311

申请日：2007-07-06

Applicant: Naoto Ohta ,  Kazuhito Hoshi ,  Shingo Bito ,  Akio Yamanaka ,  Tomoyuki Okuni

Inventor： Naoto Ohta ,  Kazuhito Hoshi ,  Shingo Bito ,  Akio Yamanaka ,  Tomoyuki Okuni

IPC: H01M4/58

CPC classification number: H01M4/133 ,  C01B32/20 ,  H01M4/1393 ,  H01M4/583 ,  H01M10/0525 ,  H01M2004/021 ,  H01M2004/027

Abstract: There is obtained a carbon material for lithium-ion secondary battery negative electrode, a low-crystalline carbon impregnated carbon material for lithium-ion secondary battery negative electrode, a negative electrode plate, and a lithium-ion secondary battery, each of which realizes a first charge/discharge cycle with less gas generation and provides a rapid charge/discharge. The carbon material is obtained by: blending and kneading a carbonaceous aggregate with a binder to form a composition; press molding the composition into an article; carbonizing the press molded article; graphitizing the article to obtain an artificial graphite block; milling the block; and carrying out particle size control. The carbon material has characteristics of: (1) R-value=(I1360/I1580)≧0.2, where R-value is defined by the ratio of D band to G band in Raman spectrum using Nd:YAG laser light of 532 nm wavelength; and (2) d(002)≧0.336 nm, and Lc(002)≦50 nm, where d(002) and Lc(002) are crystallographic parameters calculated by Gakushin-method. The carbon material is used for the negative electrode plate of a lithium-ion secondary battery, and used in the lithium-ion secondary battery having therein the negative electrode plate.

Abstract translation: 得到锂离子二次电池用负极用碳材料，锂离子二次电池用负极用低碳碳浸渍碳材料，负极板，锂离子二次电池，实现了 第一次充放电循环，气体产生较少，并提供快速充放电。 碳材料通过以下方式获得：将碳质骨料与粘合剂混合并捏合以形成组合物; 将组合物压制成制品; 将压制成型品碳化; 石墨化制品以获得人造石墨块; 铣块; 并进行粒度控制。 碳材料具有以下特征：（1）R值=（I1360 / I1580）> = 0.2，其中R值由使用Nd：YAG激光532nm的拉曼光谱中的D带与G带的比率定义 波长; 和（2）d（002）> = 0.336nm，Lc（002）<= 50nm，其中d（002）和Lc（002）是通过Gakushin方法计算的晶体参数。 碳材料用于锂离子二次电池的负极板，并用于其中具有负极板的锂离子二次电池中。

公开(公告)号：US20050158550A1

公开(公告)日：2005-07-21

申请号：US10501333

申请日：2003-01-24

Applicant: Naoto Ohta ,  Katsuhide Nagaoka ,  Kazuhito Hoshi ,  Hidehiko Nozaki ,  Tatsuro Tojo ,  Toshiaki Sogabe

Inventor： Naoto Ohta ,  Katsuhide Nagaoka ,  Kazuhito Hoshi ,  Hidehiko Nozaki ,  Tatsuro Tojo ,  Toshiaki Sogabe

IPC: H01M4/36 ,  B32B27/00 ,  H01M4/133 ,  H01M4/583 ,  H01M4/587 ,  H01M10/0525 ,  H01M4/58

CPC classification number: H01M4/133 ,  H01M4/366 ,  H01M4/587 ,  H01M10/0525 ,  H01M2004/021 ,  Y10T428/2998

Abstract: The invention provides an anode material for lithium ion secondary battery using a coated graphite powder as a raw material. The coated graphite powder is coated with carbonized material of thermoplastic resin of a carbonization yield of not more than 20 wt % in a proportion of not more than 10 parts by weight the carbonized material per 100 parts by weight graphite powder. The graphite powder as coated with thermoplastic resin increases 5% or more in accumulative pore volume of the graphite powder having a pore size of 0.012 μm to 40 μm as measured by a mercury porosimeter method, as compared with the graphite powder before coated with the thermoplastic resin. The coated graphite powder has a mesopore volume defined by IUPAC of 0.01 cc/g or less as calculated with the BJH method as viewed from desorption isotherm, which is also equal to 60% or less of the pore volume of the graphite powder before coated with the thermoplastic resin, an average particle size ranging from 10 μm to 50 μm, as measured by a laser-scattering-particle-size-distribution measuring device, and a ratio of standard deviation to the average particle size (σ/D) of 0.02 or less.

Abstract translation: 本发明提供一种使用涂覆石墨粉作为原料的锂离子二次电池的负极材料。 涂覆的石墨粉末以每100重量份石墨粉末碳化材料不超过10重量份的比例涂覆碳化产率为20重量％以下的热塑性树脂碳化材料。 与热塑性树脂一起涂覆的石墨粉末，与用热塑性树脂涂覆之前的石墨粉末相比，通过水银孔率计法测量，孔径为0.012μm至40μm的石墨粉末的累积孔体积增加5％或更多 树脂。 涂覆的石墨粉末具有由解吸等温线观察时用BJH法计算的0.01cc / g以下的由IUPAC定义的中孔体积，其等于涂布前的石墨粉末的孔体积的60％以下 热塑性树脂，通过激光散射 - 粒度分布测量装置测量的平均粒度为10〜50μm，标准偏差与平均粒径（sigma / D）的比值为0.02 或更少。

公开(公告)号：US6001277A

公开(公告)日：1999-12-14

申请号：US952892

申请日：1998-07-16

Applicant: Kunihiro Ichimura ,  Nobuo Miyadera ,  Yasuo Miyadera ,  Yutaka Honda ,  Iwao Fukuchi ,  Naoto Ohta ,  Perminder Singh Johar

Inventor： Kunihiro Ichimura ,  Nobuo Miyadera ,  Yasuo Miyadera ,  Yutaka Honda ,  Iwao Fukuchi ,  Naoto Ohta ,  Perminder Singh Johar

IPC: C08L101/00 ,  G02F1/1337 ,  C09K19/56

CPC classification number: G02F1/133788 ,  G02F1/133711 ,  Y10T428/1005

Abstract: Related to a liquid-crystal alignment film that can align liquid-crystal molecules without resort to the rubbing.The liquid-crystal alignment film of the present invention comprises a resin (e.g., a polyimide) containing a photoisomerizable and dichroic structural unit (e.g., a stilbene derivative), and is furnished with the ability to align liquid-crystal molecules when a film formed of the resin is irradiated with linearly polarized light; the ability to align liquid-crystal molecules being held and fixed.The liquid-crystal alignment film of the present invention is used in electric-filed driven type liquid-crystal display devices.

Abstract translation: PCT No.PCT / JP96 / 01422 Sec。 371日期：1998年7月16日 102（e）日期1998年7月16日PCT提交1996年5月25日PCT公布。 WO96 / 37807 PCT公开号 日期1996年11月28日与可以对齐液晶分子而不用摩擦的液晶取向膜相关。 本发明的液晶取向膜包含含有光可异构化和二色性结构单元（例如二苯乙烯衍生物）的树脂（例如，聚酰亚胺），并且具有在形成膜时对准液晶分子的能力 用线性偏振光照射树脂; 保持和固定液晶分子的对准能力。 本发明的液晶取向膜用于电动液晶显示装置。