Methods and apparatus for monitoring a process in a plasma processing system by measuring a plasma frequency
    12.
    发明申请
    Methods and apparatus for monitoring a process in a plasma processing system by measuring a plasma frequency 审中-公开
    通过测量等离子体频率来监测等离子体处理系统中的处理的方法和装置

    公开(公告)号:US20060065632A1

    公开(公告)日:2006-03-30

    申请号:US10952562

    申请日:2004-09-27

    CPC classification number: H01J37/3299 H01J37/32082 H01J37/32935

    Abstract: A method for in-situ monitoring a process in a plasma processing system having a plasma processing chamber is disclosed. The method includes positioning a substrate in the plasma processing chamber. The method also includes striking a plasma within the plasma processing chamber while the substrate is disposed within the plasma processing chamber. The method further includes obtaining a measured plasma frequency that exists after the plasma is struck, the measured plasma frequency value having a first value when the plasma is absent and at least a second value different from the first value when the plasma is present. The method also includes correlating the measured plasma frequency value with an attribute of the process, if the measured plasma frequency value is outside of a predefined plasma frequency value envelope.

    Abstract translation: 公开了一种用于在具有等离子体处理室的等离子体处理系统中进行原位监测方法。 该方法包括将基板定位在等离子体处理室中。 该方法还包括在衬底设置在等离子体处理室内时在等离子体处理室内击打等离子体。 该方法还包括获得在等离子体被击打之后存在的测量等离子体频率,当等离子体不存在时测量的等离子体频率值具有第一值,并且当存在等离子体时,获得与第一值不同的至少第二值。 如果所测量的等离子体频率值在预定的等离子体频率值包络之外,则该方法还包括将所测量的等离子体频率值与该过程的属性相关联。

    Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage
    13.
    发明申请
    Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage 有权
    通过测量自偏压来监测等离子体处理系统中的工艺的方法和装置

    公开(公告)号:US20060065623A1

    公开(公告)日:2006-03-30

    申请号:US10951553

    申请日:2004-09-27

    CPC classification number: H01J37/32935

    Abstract: A method for in-situ monitoring a process in a plasma processing system having a plasma processing chamber is disclosed. The method includes positioning a substrate in the plasma processing chamber. The method also includes striking a plasma within the plasma processing chamber while the substrate is disposed within the plasma processing chamber. The method further includes obtaining a measured self-bias voltage that exists after the plasma is struck, the measured self-bias voltage value having a first value when the plasma is absent and at least a second value different from the first value when the plasma is present. The method also includes correlating the measured self-bias voltage value with an attribute of the process, if the measured self-bias voltage value is outside of a predefined self-bias voltage value envelope.

    Abstract translation: 公开了一种用于在具有等离子体处理室的等离子体处理系统中进行原位监测方法。 该方法包括将基板定位在等离子体处理室中。 该方法还包括在衬底设置在等离子体处理室内时在等离子体处理室内击打等离子体。 该方法还包括获得在等离子体被击打之后存在的测量的自偏压,当等离子体不存在时,所测量的自偏压值具有第一值,当等离子体为等离子体时,获得与第一值不同的第二值 当下。 该方法还包括将所测量的自偏压值与该过程的属性相关联,如果所测量的自偏压值在预定义的自偏压值包络之外。

    METHODS FOR FORMING HIGH ASPECT RATIO FEATURES ON A SUBSTRATE
    15.
    发明申请
    METHODS FOR FORMING HIGH ASPECT RATIO FEATURES ON A SUBSTRATE 审中-公开
    在基板上形成高比例特征的方法

    公开(公告)号:US20100330805A1

    公开(公告)日:2010-12-30

    申请号:US11934589

    申请日:2007-11-02

    CPC classification number: H01L21/31116 H01L21/31144

    Abstract: Methods for forming anisotropic features for high aspect ratio application in etch process are provided. The methods described herein advantageously facilitates profile and dimension control of features with high aspect ratios. In one embodiment, a method for anisotropic etching a dielectric layer on a substrate includes providing a substrate having a patterned mask layer disposed on a dielectric layer in an etch chamber, supplying a gas mixture including at least a fluorine and carbon containing gas and a silicon fluorine gas into the etch chamber, and etching features in the dielectric layer in the presence of a plasma formed from the gas mixture.

    Abstract translation: 提供了用于在蚀刻工艺中形成用于高纵横比应用的各向异性特征的方法。 本文所述的方法有利地有利于具有高纵横比的特征的轮廓和尺寸控制。 在一个实施例中,用于各向异性蚀刻衬底上的电介质层的方法包括提供具有设置在蚀刻室中的电介质层上的图案化掩模层的衬底,提供至少包含含氟和含碳气体的气体混合物和硅 氟气进入蚀刻室,并且在由气体混合物形成的等离子体的存在下蚀刻介电层中的特征。

    Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage
    17.
    发明授权
    Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage 有权
    通过测量自偏压来监测等离子体处理系统中的工艺的方法和装置

    公开(公告)号:US07323116B2

    公开(公告)日:2008-01-29

    申请号:US10951553

    申请日:2004-09-27

    CPC classification number: H01J37/32935

    Abstract: A method for in-situ monitoring a process in a plasma processing system having a plasma processing chamber is disclosed. The method includes positioning a substrate in the plasma processing chamber. The method also includes striking a plasma within the plasma processing chamber while the substrate is disposed within the plasma processing chamber. The method further includes obtaining a measured self-bias voltage that exists after the plasma is struck, the measured self-bias voltage value having a first value when the plasma is absent and at least a second value different from the first value when the plasma is present. The method also includes correlating the measured self-bias voltage value with an attribute of the process, if the measured self-bias voltage value is outside of a predefined self-bias voltage value envelope.

    Abstract translation: 公开了一种用于在具有等离子体处理室的等离子体处理系统中进行原位监测方法。 该方法包括将基板定位在等离子体处理室中。 该方法还包括在衬底设置在等离子体处理室内时在等离子体处理室内击打等离子体。 该方法还包括获得在等离子体被击打之后存在的测量的自偏压,当等离子体不存在时,所测量的自偏压值具有第一值,当等离子体为等离子体时,获得与第一值不同的第二值 当下。 该方法还包括将所测量的自偏压值与该过程的属性相关联,如果所测量的自偏压值在预定义的自偏压值包络之外。

    Treatment for corrosion in substrate processing
    18.
    发明授权
    Treatment for corrosion in substrate processing 有权
    处理基板加工腐蚀

    公开(公告)号:US07084070B1

    公开(公告)日:2006-08-01

    申请号:US10623016

    申请日:2003-07-17

    Abstract: A method for processing substrate to form a semiconductor device is disclosed. The substrate includes an etch stop layer disposed above a metal layer. The method includes etching through the etch stop layer down to the copper metal layer, using a plasma etch process that utilizes a chlorine-containing etchant source gas, thereby forming etch stop layer openings in the etch stop layer. The etch stop layer includes at least one of a SiN and SiC material. Thereafter, the method includes performing a wet treatment on the substrate using a solution that contains acetic acid (CH3COOH) or acetic acid/ammonium hydroxide (NH4OH) to remove at least some of the copper oxides. Alternatively, the copper oxides may be removed using a H2 plasma. BTA passivation may be optionally performed on the substrate.

    Abstract translation: 公开了一种用于处理基板以形成半导体器件的方法。 衬底包括设置在金属层上方的蚀刻停止层。 该方法包括使用利用含氯蚀刻剂源气体的等离子体蚀刻工艺将蚀刻停止层蚀刻到铜金属层下方,从而在蚀刻停止层中形成蚀刻停止层开口。 蚀刻停止层包括SiN和SiC材料中的至少一种。 此后,该方法包括使用含有乙酸(CH 3 COOH)或乙酸/氢氧化铵(NH 4 OH)的溶液对底物进行湿处理至 去除至少一些铜氧化物。 或者,可以使用H 2 O 3等离子体去除铜氧化物。 可以任选地在衬底上进行BTA钝化。

    Methods and apparatus for monitoring a process in a plasma processing system by measuring impedance
    19.
    发明申请
    Methods and apparatus for monitoring a process in a plasma processing system by measuring impedance 审中-公开
    通过测量阻抗来监测等离子体处理系统中的过程的方法和装置

    公开(公告)号:US20060065631A1

    公开(公告)日:2006-03-30

    申请号:US10951548

    申请日:2004-09-27

    CPC classification number: H01J37/3299 H01J37/32082 H01J37/32935

    Abstract: A method for in-situ monitoring a process in a plasma processing system having a plasma processing chamber is disclosed. The method includes positioning a substrate in the plasma processing chamber. The method also includes striking a plasma within the plasma processing chamber while the substrate is disposed within the plasma processing chamber. The method further includes obtaining a measured impedance that exists after the plasma is struck, the measured impedance value having a first value when the plasma is absent and at least a second value different from the first value when the plasma is present. The method also includes correlating the measured impedance value with an attribute of the process, if the measured impedance value is outside of a predefined impedance value envelope.

    Abstract translation: 公开了一种用于在具有等离子体处理室的等离子体处理系统中进行原位监测方法。 该方法包括将基板定位在等离子体处理室中。 该方法还包括在衬底设置在等离子体处理室内时在等离子体处理室内击打等离子体。 该方法还包括获得在等离子体被击打之后存在的测量阻抗,当等离子体不存在时测量的阻抗值具有第一值,并且当存在等离子体时,获得与第一值不同的至少第二值。 该方法还包括将测量的阻抗值与该过程的属性相关联,如果测量的阻抗值在预定的阻抗值包络之外。

    Serving reliable content through search
    20.
    发明授权
    Serving reliable content through search 有权
    通过搜索提供可靠的内容

    公开(公告)号:US08601017B2

    公开(公告)日:2013-12-03

    申请号:US12977130

    申请日:2010-12-23

    CPC classification number: G06F17/30867 G06Q10/10 H04L67/306

    Abstract: A system and method for serving reliable content in search, the method comprising: receiving at a server computer from a user, a request to search a network for certain information; searching the network for the information requested and obtaining a set of results including user-generated content; searching the user's list of social connections; determining whether any of the search results related to a person in the user's list of social connections/contacts; and providing an indication of greater reliability for the search results that correspond to persons from the user's list of social connections.

    Abstract translation: 一种用于在搜索中提供可靠内容的系统和方法,所述方法包括:从服务器计算机接收用户搜索某些信息的请求; 搜索网络获得所请求的信息,并获得包括用户生成的内容的一组结果; 搜索用户的社会关系列表; 确定任何搜索结果是否与用户的社交连接/联系人列表中的人有关; 并且提供与来自用户社交连接列表的人相对应的搜索结果的更高可靠性的指示。

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