Printed circuit board having landless via hole and method of manufacturing the same
    11.
    发明申请
    Printed circuit board having landless via hole and method of manufacturing the same 审中-公开
    具有无通孔的印刷电路板及其制造方法

    公开(公告)号:US20090255722A1

    公开(公告)日:2009-10-15

    申请号:US12213975

    申请日:2008-06-26

    Abstract: This invention relates to a printed circuit board having a landless via hole, including a circuit pattern formed on a via made of a first metal and having a line width smaller than the diameter of the via hole, in which the circuit pattern includes a seed layer made of a second metal and a plating layer made of a third metal, which is different from the second metal, and to a method of manufacturing the same. In the printed circuit board, the via has no upper land, thus making it possible to finely form the circuit pattern which is connected to the via, thereby realizing a high-density circuit pattern.

    Abstract translation: 本发明涉及一种具有无轨道通孔的印刷电路板,该无线通孔包括形成在由第一金属制成的通孔上并具有小于通孔直径的线宽的电路图案,其中电路图案包括种子层 由与第二金属不同的第三金属制成的第二金属和镀层制成,以及其制造方法。 在印刷电路板中,通孔没有上部焊盘,从而可以精细地形成连接到通孔的电路图案,从而实现高密度电路图案。

    Stage apparatus
    12.
    发明授权
    Stage apparatus 有权
    舞台装置

    公开(公告)号:US07240434B2

    公开(公告)日:2007-07-10

    申请号:US11050761

    申请日:2005-02-07

    CPC classification number: H02N2/0095 Y10S269/903

    Abstract: A stage apparatus may include a first stage, a second stage movable with respect to the first stage, at least one flexure hinge to connect the first stage with the second stage, a plurality of actuators provided between the first stage and the second stage to push the first stage and the second stage and to be symmetric with respect to a center of the first stage and the second stage, and a controller to control the plurality of actuators to move one of the first stage and the second stage with respect to the other one of the first stage and the second stage. Thus, a position error of the stage can be reduced, which enables an ultra precision position control. Further, a piezoelectric driver using piezoelectric elements may be used as the actuator to decrease the position error more than a conventional driver such as a motor. The position error may be decreased to ±10 nm.

    Abstract translation: 平台装置可以包括第一阶段,相对于第一阶段可移动的第二阶段,至少一个挠曲铰链以将第一阶段与第二阶段连接;多个致动器,设置在第一阶段和第二阶段之间以推动 第一级和第二级,并且相对于第一级和第二级的中心对称,以及控制器,用于控制多个致动器相对于另一级移动第一级和第二级中的一者 第一阶段和第二阶段之一。 因此,能够减小平台的位置误差,能够进行超精密位置控制。 此外,使用压电元件的压电驱动器可以用作致动器,以比诸如电动机的常规驱动器更多地降低位置误差。 位置误差可能会降低到±10 nm。

    Stage apparatus
    13.
    发明申请
    Stage apparatus 审中-公开
    舞台装置

    公开(公告)号:US20060006341A1

    公开(公告)日:2006-01-12

    申请号:US11082825

    申请日:2005-03-18

    CPC classification number: G01R31/2893

    Abstract: A stage apparatus including a guide unit having a first guide and a second guide spaced from each other; a movable unit provided between the first guide and the second guide and being movable relative to the guide unit; an air bearing provided between the first guide and the movable unit and coupled to either the first guide or the movable unit; an actuator coupled to one of the movable unit and the second guide and contacting the other one thereof in order to allow the movable unit to be movable relative to the guide unit; and a stage coupled to one of the movable unit and the guide unit and being movable relative to the other one thereof. With this configuration, a stage apparatus which has a relatively simple structure and is easily assembled and disassembled is provided.

    Abstract translation: 一种舞台装置,包括具有彼此间隔开的第一引导件和第二引导件的引导单元; 设置在所述第一引导件和所述第二引导件之间并且可相对于所述引导单元移动的可移动单元; 空气轴承,其设置在所述第一引导件和所述可移动单元之间并且联接到所述第一引导件或所述可移动单元; 联接到所述可移动单元和所述第二引导件中的一个的致动器,并且使所述可动单元相对于所述引导单元可移动; 以及联接到所述可移动单元和所述引导单元中的一个并且可相对于所述另一个移动的台。 利用这种结构,提供了一种具有相对简单结构并易于组装和拆卸的平台装置。

    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
    14.
    发明申请
    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
    制造印刷电路板的方法

    公开(公告)号:US20120152753A1

    公开(公告)日:2012-06-21

    申请号:US13045941

    申请日:2011-03-11

    CPC classification number: H05K3/4647 H05K3/4602 H05K2201/096 H05K2203/025

    Abstract: Disclosed herein is a method of manufacturing a printed circuit board that simultaneously forms a via and an embedding land and thus improves the matching value of the via and the embedding land to secure interlayer conduction reliability, and further simultaneously forms the via and the embedding land to reduce manufacturing costs. In addition, the embedding land is formed to be embedded in the second insulating layer to implement high-density/high-integration of the printed circuit board and a via is formed in less time as compared to a method of forming a via hole using laser to reduce a process time.

    Abstract translation: 本发明公开了一种制造印刷电路板的方法,该印刷电路板同时形成通孔和嵌入台面,从而提高通孔和嵌入层的匹配值,从而确保层间传导可靠性,并且进一步同时形成通孔和嵌入层 降低制造成本。 此外,与通过使用激光形成通孔的方法相比,嵌入式焊盘形成为嵌入第二绝缘层中以实现印刷电路板的高密度/高集成度,并且在较少的时间内形成通孔 以减少处理时间。

    Transporting apparatus
    15.
    发明授权
    Transporting apparatus 有权
    运输设备

    公开(公告)号:US07255478B2

    公开(公告)日:2007-08-14

    申请号:US11050782

    申请日:2005-02-07

    CPC classification number: F16C29/025 F16C32/0603 F16C32/0666

    Abstract: A transporting apparatus which can horizontally transport a carrier using an air bearing of which a rotational degree of freedom is kept relative to a surface of a base. The transporting apparatus is movable along a surface of a base and includes an air bearing placed on a base, a connector connected to an upper part of the air bearing and provided with a supporter in a center thereof, the supporter having a flexure hinge structure to allow the air bearing to be freely rotated relative to the base, and the carrier supported by the supporter of the connector to be transported while keeping a level with respect to the surface of the base. With this configuration, a movement of the air bearing does not affect the carrier, thereby improving accuracy and reliability of the transporting apparatus.

    Abstract translation: 一种能够使用相对于基座的表面保持旋转自由度的空气轴承水平地输送托架的输送装置。 输送装置可以沿着基座的表面移动并且包括放置在基座上的空气轴承,连接到空气轴承的上部并且在其中心具有支撑件的连接器,支撑件具有弯曲铰链结构 允许空气轴承相对于基座自由旋转,并且载体由待连接器的支撑件支撑,同时保持相对于基座的表面的水平。 利用这种构造,空气轴承的移动不影响载体,从而提高输送装置的精度和可靠性。

    Stage apparatus
    16.
    发明申请
    Stage apparatus 有权
    舞台装置

    公开(公告)号:US20050198844A1

    公开(公告)日:2005-09-15

    申请号:US11050761

    申请日:2005-02-07

    CPC classification number: H02N2/0095 Y10S269/903

    Abstract: A stage apparatus may include a first stage, a second stage movable with respect to the first stage, at least one flexure hinge to connect the first stage with the second stage, a plurality of actuators provided between the first stage and the second stage to push the first stage and the second stage and to be symmetric with respect to a center of the first stage and the second stage, and a controller to control the plurality of actuators to move one of the first stage and the second stage with respect to the other one of the first stage and the second stage. Thus, a position error of the stage can be reduced, which enables an ultra precision position control. Further, a piezoelectric driver using piezoelectric elements may be used as the actuator to decrease the position error more than a conventional driver such as a motor. The position error may be decreased to ±10 nm.

    Abstract translation: 舞台装置可以包括第一阶段,相对于第一阶段可移动的第二阶段,至少一个挠曲铰链以将第一阶段与第二阶段连接;多个致动器,设置在第一阶段和第二阶段之间以推动 第一级和第二级,并且相对于第一级和第二级的中心对称;以及控制器,用于控制多个致动器相对于另一级移动第一级和第二级中的一者 第一阶段和第二阶段之一。 因此,能够减小平台的位置误差,能够进行超精密位置控制。 此外,使用压电元件的压电驱动器可以用作致动器,以比诸如电动机的常规驱动器更多地降低位置误差。 位置误差可能会降低到±10 nm。

    Transporting apparatus
    17.
    发明申请
    Transporting apparatus 有权
    运输设备

    公开(公告)号:US20050180666A1

    公开(公告)日:2005-08-18

    申请号:US11050782

    申请日:2005-02-07

    CPC classification number: F16C29/025 F16C32/0603 F16C32/0666

    Abstract: A transporting apparatus which can horizontally transport a carrier using an air bearing of which a rotational degree of freedom is kept relative to a surface of a base. The transporting apparatus is movable along a surface of a base and includes an air bearing placed on a base, a connector connected to an upper part of the air bearing and provided with a supporter in a center thereof, the supporter having a flexure hinge structure to allow the air bearing to be freely rotated relative to the base, and the carrier supported by the supporter of the connector to be transported while keeping a level with respect to the surface of the base. With this configuration, a movement of the air bearing does not affect the carrier, thereby improving accuracy and reliability of the transporting apparatus.

    Abstract translation: 一种能够使用相对于基座的表面保持旋转自由度的空气轴承水平地输送托架的输送装置。 输送装置可以沿着基座的表面移动并且包括放置在基座上的空气轴承,连接到空气轴承的上部并且在其中心具有支撑件的连接器,支撑件具有弯曲铰链结构 允许空气轴承相对于基座自由旋转,并且载体由待连接器的支撑件支撑,同时保持相对于基座的表面的水平。 利用这种构造,空气轴承的移动不影响载体,从而提高输送装置的精度和可靠性。

    Method of manufacturing printed circuit board having landless via hole
    19.
    发明授权
    Method of manufacturing printed circuit board having landless via hole 失效
    具有无通孔的印刷电路板的制造方法

    公开(公告)号:US08418361B2

    公开(公告)日:2013-04-16

    申请号:US13299685

    申请日:2011-11-18

    Abstract: Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer.

    Abstract translation: 制造印刷电路板的方法,包括:提供包括具有通孔下部的第一电路层的基板; 在所述第一电路层上形成绝缘层; 在绝缘层中形成通孔; 用第一金属填充通孔,从而形成通孔; 在绝缘层上形成具有第二金属的种子层和通孔的暴露表面; 在种子层上施加抗蚀剂膜,并且形成具有形成在通孔上的宽度的第二电路层的开口的抗蚀剂图案小于通孔的宽度; 用第三金属电镀由开口限定的电路区域,从而形成由第三金属形成的镀层; 并去除抗蚀剂膜,并且选择性地去除种子层的暴露部分,从而形成第二电路层。

    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING LANDLESS VIA HOLE
    20.
    发明申请
    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING LANDLESS VIA HOLE 失效
    制造具有通孔的印刷电路板的方法

    公开(公告)号:US20120060369A1

    公开(公告)日:2012-03-15

    申请号:US13299685

    申请日:2011-11-18

    Abstract: Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer.

    Abstract translation: 制造印刷电路板的方法,包括:提供包括具有通孔下部的第一电路层的基板; 在所述第一电路层上形成绝缘层; 在绝缘层中形成通孔; 用第一金属填充通孔,从而形成通孔; 在绝缘层上形成具有第二金属的种子层和通孔的暴露表面; 在种子层上施加抗蚀剂膜,并且形成具有形成在通孔上的宽度的第二电路层的开口的抗蚀剂图案小于通孔的宽度; 用第三金属电镀由开口限定的电路区域,从而形成由第三金属形成的镀层; 并去除抗蚀剂膜,并且选择性地去除种子层的暴露部分,从而形成第二电路层。

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