Abstract:
This invention relates to a printed circuit board having a landless via hole, including a circuit pattern formed on a via made of a first metal and having a line width smaller than the diameter of the via hole, in which the circuit pattern includes a seed layer made of a second metal and a plating layer made of a third metal, which is different from the second metal, and to a method of manufacturing the same. In the printed circuit board, the via has no upper land, thus making it possible to finely form the circuit pattern which is connected to the via, thereby realizing a high-density circuit pattern.
Abstract:
A stage apparatus may include a first stage, a second stage movable with respect to the first stage, at least one flexure hinge to connect the first stage with the second stage, a plurality of actuators provided between the first stage and the second stage to push the first stage and the second stage and to be symmetric with respect to a center of the first stage and the second stage, and a controller to control the plurality of actuators to move one of the first stage and the second stage with respect to the other one of the first stage and the second stage. Thus, a position error of the stage can be reduced, which enables an ultra precision position control. Further, a piezoelectric driver using piezoelectric elements may be used as the actuator to decrease the position error more than a conventional driver such as a motor. The position error may be decreased to ±10 nm.
Abstract:
A stage apparatus including a guide unit having a first guide and a second guide spaced from each other; a movable unit provided between the first guide and the second guide and being movable relative to the guide unit; an air bearing provided between the first guide and the movable unit and coupled to either the first guide or the movable unit; an actuator coupled to one of the movable unit and the second guide and contacting the other one thereof in order to allow the movable unit to be movable relative to the guide unit; and a stage coupled to one of the movable unit and the guide unit and being movable relative to the other one thereof. With this configuration, a stage apparatus which has a relatively simple structure and is easily assembled and disassembled is provided.
Abstract:
Disclosed herein is a method of manufacturing a printed circuit board that simultaneously forms a via and an embedding land and thus improves the matching value of the via and the embedding land to secure interlayer conduction reliability, and further simultaneously forms the via and the embedding land to reduce manufacturing costs. In addition, the embedding land is formed to be embedded in the second insulating layer to implement high-density/high-integration of the printed circuit board and a via is formed in less time as compared to a method of forming a via hole using laser to reduce a process time.
Abstract:
A transporting apparatus which can horizontally transport a carrier using an air bearing of which a rotational degree of freedom is kept relative to a surface of a base. The transporting apparatus is movable along a surface of a base and includes an air bearing placed on a base, a connector connected to an upper part of the air bearing and provided with a supporter in a center thereof, the supporter having a flexure hinge structure to allow the air bearing to be freely rotated relative to the base, and the carrier supported by the supporter of the connector to be transported while keeping a level with respect to the surface of the base. With this configuration, a movement of the air bearing does not affect the carrier, thereby improving accuracy and reliability of the transporting apparatus.
Abstract:
A stage apparatus may include a first stage, a second stage movable with respect to the first stage, at least one flexure hinge to connect the first stage with the second stage, a plurality of actuators provided between the first stage and the second stage to push the first stage and the second stage and to be symmetric with respect to a center of the first stage and the second stage, and a controller to control the plurality of actuators to move one of the first stage and the second stage with respect to the other one of the first stage and the second stage. Thus, a position error of the stage can be reduced, which enables an ultra precision position control. Further, a piezoelectric driver using piezoelectric elements may be used as the actuator to decrease the position error more than a conventional driver such as a motor. The position error may be decreased to ±10 nm.
Abstract:
A transporting apparatus which can horizontally transport a carrier using an air bearing of which a rotational degree of freedom is kept relative to a surface of a base. The transporting apparatus is movable along a surface of a base and includes an air bearing placed on a base, a connector connected to an upper part of the air bearing and provided with a supporter in a center thereof, the supporter having a flexure hinge structure to allow the air bearing to be freely rotated relative to the base, and the carrier supported by the supporter of the connector to be transported while keeping a level with respect to the surface of the base. With this configuration, a movement of the air bearing does not affect the carrier, thereby improving accuracy and reliability of the transporting apparatus.
Abstract:
The present disclosure relates to an active diesel particulate filter (DPF) regeneration system of an engine, and more particularly, to an active DPF regeneration system and method, in which a non-work load is arbitrarily provided to the engine to quickly perform an active DPF regeneration even in a state where substantial work of a construction machine is stopped.
Abstract:
Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer.
Abstract:
Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer.