Abstract:
There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and first and second internal electrodes provided on upper and lower surfaces of the dielectric layer and formed of a thin film including graphene. The multilayer ceramic electronic component includes internal electrodes formed of a thin film including graphene, thereby having increased capacitance and improved thermal stability and withstand voltage characteristics.
Abstract:
There are provided a multilayer thin film for a ceramic electronic component and a method of manufacturing the same. The multilayer thin film includes a substrate; and a ceramic layer and a metal layer alternately formed on at least one of upper and lower surfaces of the substrate, wherein at least one of the ceramic layer and the metal layer has a height corresponding to a thickness of at least one of a plurality of particles arranged on a plane. With the multilayer thin film for a ceramic electronic component, the number of layers increases and a distance between electrodes decreases, whereby capacitance may increase.
Abstract:
There are provided a ceramic sheet product for a ceramic electronic component, a multilayer ceramic electronic component using the same, and a method of manufacturing the multilayer ceramic electronic component. The ceramic sheet product for a ceramic electronic component includes a ceramic layer; a metal layer formed on the ceramic layer; and metal nanostructures contacting the metal layer and protruding from the metal layer to an inner portion of the ceramic layer. With the multilayer ceramic electronic component using the ceramic sheet product for a ceramic electronic component, an interval between electrodes is reduced to thereby allow for the increase of capacitance, whereby a multilayer ceramic electronic component having high capacitance may be provided.
Abstract:
Disclosed herein is a reflow inspection system. The reflow inspection system according to an embodiment of the present invention includes an oven, a stage on which a reflow inspection target is placed inside the oven, and which includes a temperature detecting sensor for detecting a temperature of the reflow inspection target formed on one side thereof; a light source unit formed on one side of the oven and irradiating the reflow inspection target with light, an imaging unit sucking smoke generated in the reflow inspection target, and obtaining image information of the reflow inspection target to thereby transmit the obtained image information to the outside, an image processing unit processing the image information obtained in the imaging unit, and a control unit connected to the stage, the temperature detecting sensor, and the image processing unit to perform control of a reflow inspection process.
Abstract:
Disclosed herein are an apparatus for non-invasively inspecting defects, including: a sample irradiation unit having a sample that is an inspection target seated thereon and irradiating polarization to the sample; a light receiving unit detecting polarization from the sample; and a control unit processing and storing each data detected from the light receiving unit, and a method for inspecting defects using the same.
Abstract:
There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and first and second internal electrodes provided on upper and lower surfaces of the dielectric layer and formed of a thin film including graphene. The multilayer ceramic electronic component includes internal electrodes formed of a thin film including graphene, thereby having increased capacitance and improved thermal stability and withstand voltage characteristics.
Abstract:
There are provided an organic light emitting diode and a fabrication method thereof. The organic light emitting diode includes: an anode formed on a substrate; a thin film layer formed on the anode and including graphene; a light emitting polymer layer formed on the thin film layer; and a cathode formed on the light emitting polymer layer. Heat generated from the device can be effectively dissipated, stability of the device can be enhanced, and a life span of the device can be extended.
Abstract:
There are provided an organic light emitting diode and a method of manufacturing the same. The organic light emitting diode includes: an anode formed on a substrate; a protective layer having at least one inorganic material layer stacked therein, the at least one inorganic material layer containing at least one of a nano-clay and a graphite oxide; a light emitting polymer layer formed on the protective layer; and a cathode formed on the light emitting polymer layer. In the case of the organic light emitting diode, the injection concentration of holes may be controlled, such that the stability of an element may be improved and the lifespan thereof may be increased.
Abstract:
A method of manufacturing a light emitting device includes: forming a plurality of independent light emitting portions on a growth substrate; separating the light emitting portions from the growth substrate; mounting the light emitting portions onto a receiving substrate; and dicing the receiving substrate, onto which the light emitting portions are mounted, into a light emitting unit. Residual stress, which occurs when the light emitting portions are separated from the substrate, can be reduced, and the light emitting portions can be mounted onto the receiving substrate in a fluid state, whereby the light emitting device can be easily mass produced with excellent quality, and its manufacturing costs can be reduced.
Abstract:
A wafer level package for a surface acoustic wave device and a fabrication method thereof include a SAW device formed with a SAW element on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW element between the cap wafer and the SAW device; a cap pad formed on an upper surface of the cap wafer; and a metal line formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.