利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

19 条记录 (耗时 0.02 秒)

    Input/output device arrangements for terminals
    11.
    发明授权
    Input/output device arrangements for terminals 失效
    端子的输入/输出装置布置

    公开(公告)号：US4533791A

    公开(公告)日：1985-08-06

    申请号：US346219

    申请日：1982-02-05

    申请人： Clifford D. Read ,  William D. Sawyer ,  Donald T. Chadwick

    发明人： Clifford D. Read ,  William D. Sawyer ,  Donald T. Chadwick

    IPC分类号： G06F1/16 ,  G06F3/02 ,  H04M1/02 ,  H04M11/00

    CPC分类号： H04M1/02 ,  G06F3/0202 ,  Y10S379/914

    摘要： In a mounting arrangement of lamellar, input/output devices for a computer or telecommunications terminal, one of the devices is movable relative to another of the devices between a limited operational position in which a first input/output device is operably exposed but masks a second device, and a fully operational position in which both the first and second devices are operably exposed. One embodiment has one input/output device sliding relative to a vertically adjacent input/output device. In another embodiment, input/output devices are hinged relative to each other and to a common cabinet base. The mounting arrangements offer the advantages of spatial economy, input/output device protection, and the capacity for an aesthetically attractive cabinet.

    摘要翻译： 在用于计算机或电信终端的层状输入/输出装置的安装布置中，所述装置中的一个可以相对于所述装置中的另一装置在可操作地暴露第一输入/输出装置的有限操作位置之间移动， 装置和完全可操作的位置，其中第一和第二装置都可操作地暴露。 一个实施例具有一个输入/输出装置相对于垂直相邻的输入/输出装置滑动。 在另一个实施例中，输入/输出装置相对于彼此和公共的柜底铰接。 安装布置提供了空间经济，输入/输出设备保护以及美观吸引力的机柜的优势。

    MEMS device and interposer and method for integrating MEMS device and interposer
    14.
    发明授权
    MEMS device and interposer and method for integrating MEMS device and interposer 有权
    用于集成MEMS器件和插入器的MEMS器件和插入器和方法

    公开(公告)号：US08809135B2

    公开(公告)日：2014-08-19

    申请号：US12697713

    申请日：2010-02-01

    申请人： William D. Sawyer

    发明人： William D. Sawyer

    IPC分类号： H01L21/58 ,  B81B7/00

    CPC分类号： B81B7/0048 ,  B81B2203/0307

    摘要： A method for producing Microelectromechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI) wafer includes providing an SOI wafer, performing a mesa etch to at least partially define the MEMS device, bonding the SOI wafer to an interposer by direct boding, removing the handle layer of the SOI wafer, removing the oxide layer of the SOI wafer, and further etching the device layer of the SOI wafer to define the MEMS device. A structure manufactured according to the above described processes includes an interposer comprising an SOI wafer and a MEMS device mounted on the interposer. The MEMS device comprises posts extending from a silicon plate. The MEMS device is directly mounted to the interposer by bonding the posts of the MEMS device to the device layer of the interposer.

    摘要翻译： 使用绝缘体上硅（SOI）晶片制造微机电系统（MEMS）和相关器件的方法包括提供SOI晶片，执行台面蚀刻以至少部分限定MEMS器件，通过直接将SOI晶片连接到插入器 去除SOI晶片的手柄层，去除SOI晶片的氧化物层，并进一步蚀刻SOI晶片的器件层以限定MEMS器件。 根据上述工艺制造的结构包括内插器，其包括安装在插入件上的SOI晶片和MEMS器件。 MEMS器件包括从硅板延伸的柱。 MEMS器件通过将MEMS器件的柱结合到插入器的器件层而直接安装到插入器。

    Method for integrating MEMS device and interposer
    15.
    发明授权
    Method for integrating MEMS device and interposer 有权
    集成MEMS器件和内插器的方法

    公开(公告)号：US07381630B2

    公开(公告)日：2008-06-03

    申请号：US10889868

    申请日：2004-07-13

    申请人： William D. Sawyer

    发明人： William D. Sawyer

    IPC分类号： H01L21/58

    CPC分类号： B81B7/0048 ,  B81B2203/0307

    摘要： A method for producing Microelectromechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI) wafer includes providing an SOI wafer, performing a mesa etch to at least partially define the MEMS device, bonding the SOI wafer to an interposer by direct boding, removing the handle layer of the SOI wafer, removing the oxide layer of the SOI wafer, and further etching the device layer of the SOI wafer to define the MEMS device. A structure manufactured according to the above described processes includes an interposer comprising an SOI wafer and a MEMS device mounted on the interposer. The MEMS device comprises posts extending from a silicon plate. The MEMS device is directly mounted to the interposer by bonding the posts of the MEMS device to the device layer of the interposer.

    摘要翻译： 使用绝缘体上硅（SOI）晶片制造微机电系统（MEMS）和相关器件的方法包括提供SOI晶片，执行台面蚀刻以至少部分限定MEMS器件，通过直接将SOI晶片连接到插入器 去除SOI晶片的手柄层，去除SOI晶片的氧化物层，并进一步蚀刻SOI晶片的器件层以限定MEMS器件。 根据上述工艺制造的结构包括内插器，其包括安装在插入件上的SOI晶片和MEMS器件。 MEMS器件包括从硅板延伸的柱。 MEMS器件通过将MEMS器件的柱结合到插入器的器件层而直接安装到插入器。

    Method for microfabricating structures using silicon-on-insulator material
    16.
    发明授权
    Method for microfabricating structures using silicon-on-insulator material 有权
    使用绝缘体上硅材料微结构的方法

    公开(公告)号：US07335527B2

    公开(公告)日：2008-02-26

    申请号：US11231103

    申请日：2005-09-20

    申请人： William D. Sawyer ,  Jeffrey T. Borenstein

    发明人： William D. Sawyer ,  Jeffrey T. Borenstein

    IPC分类号： H01L21/00 ,  B81C1/00

    CPC分类号： B81C1/00182 ,  B81C1/00579 ,  B81C3/001 ,  B81C2201/0191

    摘要： The invention provides a general fabrication method for producing MicroElectroMechanical Systems (MEMS) and related devices using Silicon-On-Insulator (SOI) wafer. The method includes providing an SOI wafer that has (i) a handle layer, (ii) a dielectric layer, and (iii) a device layer, wherein a mesa etch has been made on the device layer of the SOI wafer, providing a substrate, wherein a pattern has been etched onto the substrate, bonding the SOI wafer and the substrate together, removing the handle layer of the SOI wafer, removing the dielectric layer of the SOI wafer, then performing a structural etch on the device layer of the SOI wafer to define the device.

    摘要翻译： 本发明提供了使用绝缘体上硅（SOI）晶片生产微电子机械系统（MEMS）和相关器件的一般制造方法。 该方法包括提供SOI晶片，其具有（i）手柄层，（ii）电介质层和（iii）器件层，其中在SOI晶片的器件层上进行台面蚀刻，提供衬底 其中图案已被蚀刻到衬底上，将SOI晶片和衬底接合在一起，去除SOI晶片的手柄层，去除SOI晶片的电介质层，然后对SOI的器件层进行结构蚀刻 晶圆来定义设备。

    Spontaneous caller identification with call-waiting
    17.
    发明授权
    Spontaneous caller identification with call-waiting 失效
    呼叫等待的自发呼叫者识别

    公开(公告)号：US5263084A

    公开(公告)日：1993-11-16

    申请号：US733027

    申请日：1991-07-22

    申请人： Guy J. Chaput ,  Suzanne D. White ,  Dana A. Merrill ,  William D. Sawyer ,  Lester L. White

    发明人： Guy J. Chaput ,  Suzanne D. White ,  Dana A. Merrill ,  William D. Sawyer ,  Lester L. White

    IPC分类号： H04M3/42 ,  H04M1/57 ,  H04M3/428 ,  H04M1/56 ,  H04M15/06

    CPC分类号： H04M3/428 ,  H04M1/57 ,  H04M3/4288

    摘要： An enhanced telephony call waiting feature is provided wherein identifying information related to a third party wishing to converse with a first party already engaged in a conversation with a second party is spontaneously provided to the first party. The method comprises the steps of the local office sending a call waiting tone having predetermined characteristics to the first party and its apparatus responding thereto by muting its associated handset for a predetermined interval of time. The local office then transmits the identification data relating to the third party and the first party apparatus receives and displays to the first party the identification information related to the third party thereby allowing the first party to either accept or reject the waiting call in the conventional manner but also based on the displayed information.

    摘要翻译： 提供了增强型电话呼叫等待功能，其中自动地向第一方提供与希望与已经参与与第二方的对话的第一方交谈的第三方相关的识别信息。 该方法包括以下步骤：本地办公室发送具有预定特征的呼叫等待音调给第一方及其设备通过在预定的时间间隔内静音其相关手机来对其进行响应。 然后，本地办公室发送与第三方相关的识别数据，第一方设备向第一方接收和显示与第三方相关的识别信息，从而允许第一方以常规方式接受或拒绝等待呼叫 而且还基于显示的信息。