Abstract:
A display apparatus and a method of controlling contents thereof, the display apparatus including: a communication unit which is connected to a first external device; a content input unit which receives second source-type multimedia content from a second external device; and a controller which controls the communication unit to search first source-type multimedia content stored in the first external device and to transmit to the first external device a control signal for requesting the searched first source-type multimedia content to be received by the communication unit, and which generates unified index information for unified navigation of the first and the second source-type multimedia contents received from the first and second external device.
Abstract:
An image sensor package, a method of manufacturing the same, and an image sensor module including the image sensor package are provided. In the image sensor package, an image sensor chip is installed onto a depression of a transmissive substrate. An adhesive bonds the image sensor chip to the transmissive substrate and seals an Active Pixel Sensor (APS) on the image sensor chip, protecting it from fine particle contamination. An IR cutting film is disposed on the transmissive substrate to minimize the height of the image sensor package. The image sensor package is electrically connected to external connection pads in the depression. Consequently, the image sensor package has a minimum height, is not susceptible to particle contamination, and does not require expensive alignment processes during manufacturing.
Abstract:
Provided are a remote controller and a method of controlling the remote controller, wherein the remote controller is operable to be in one of a first operating mode or a second operating mode, and which is connectable to a docking station, the remote controller including: an internal display screen, which displays at least one digital image; and a controller which may be operable to change between the first and second operating modes, wherein if the remote controller is connected to the docking station and if the remote controller is in the second operating mode, the controller controls the remote controller to change to the first operating mode to provide predetermined multimedia content.
Abstract:
A method of manufacturing a semiconductor device includes forming a diffusion barrier layer on a substrate, and forming at least two features on the substrate such that the diffusion barrier layer is respectively disposed between each feature and the substrate and contacts the at least two features. A first impurity region of the substrate contains impurities of a first type, a second impurity region of the substrate contains impurities of a second type, different from the first type, a first feature of the at least two features is in the first impurity region, and a second feature of the at least two features is in the second impurity region, such that the second feature is electrically isolated from first feature by the different impurity regions.
Abstract:
Disclosed are a main image processing apparatus, a sub image processing apparatus and a control method thereof. The control method of the sub image processing apparatus includes receiving a user's touch input through the sub image processing apparatus; determining which contents correspond to a touched area where the touch input occurs; sensing change in location of the touch input; and transmitting a control command for the contents to the main image processing apparatus in response to the sensed change in the location of the touch input. With this, it is more convenient for a user to control the main image processing apparatus through the sub image processing apparatus supporting the touch input.
Abstract:
Disclosed are a display apparatus which displays contents and a method of controlling the same, the display apparatus including: a display unit; a user selection unit; a user interface generator which generates user interface information; an image processor; and a controller which controls the user interface generator to generate a guide image indicating a contents search mode on an edge of the display unit if performing a first operation to set up the contents search mode through the user selection unit, displays searched contents if performing a second operation to search contents while displaying the guide image, and controls the image processor to play selected contents if performing a third operation to select contents from searched contents.
Abstract:
Disclosed is a method and apparatus for displaying a contents list. The method includes: displaying a loading image, which is preset for displaying, on a loading region to display a thumbnail image corresponding to contents of the loading image, wherein the loading image corresponds to the thumbnail images; animating the loading image displayed in the loading region; and displaying the thumbnail image in the loading region, by substituting the thumbnail image for the loading image.
Abstract:
A display apparatus and a method for displaying a widget thereon are provided. The display apparatus includes a generation unit which generates a displayable target widget, a display unit which displays the generated target widget, and a controlling unit which processes one or more target widgets related to a program a user is viewing so that the target widgets are displayed.
Abstract:
A display apparatus and a user interface display method of the display apparatus are provided. The display apparatus classifies menu items of a service menu or an OSD menu according to the frequency of use of the menu items, generates icons corresponding to the classified menu items, and displays the icons on a screen using a user interface. Accordingly, the user can display a user interface on the screen in a preferable manner, and easily find and utilize a desired menu item.
Abstract:
A stack type semiconductor chip package includes a first wafer mold, a protection substrate, and a second wafer mold that are stacked in a wafer level process. The first wafer mold includes a first chip having first pads and a first mold layer encapsulating the first chip. The protection substrate is placed on the first wafer mold, is mechanically bonded with the first wafer mold using a first adhesive layer, and includes wiring layers facing the first pads. The second wafer mold is placed under the first wafer mold, is mechanically bonded with the first wafer mold using a second adhesive layer, and includes a second chip having second pads, and a second mold layer encapsulating the second chip. First vias electrically connect the wiring layers of the protection substrate with the second pads. Second vias electrically connect the wiring layers of the protection substrate with external connection terminals.