公开(公告)号：US20210363283A1

公开(公告)日：2021-11-25

申请号：US17238207

申请日：2021-04-23

Applicant: eChem Solutions Corp.

Inventor： Hsiao-Jen Lai ,  Yu-Chun Chen

IPC: C08F283/00 ,  C08K3/32 ,  C08K3/105 ,  C08K5/134 ,  C08K5/36 ,  C08K5/18 ,  C08K5/524 ,  G02F1/1335

Abstract: A resin composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), an alkali-soluble resin (B), an ethylenically unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl-based compound (F). The phenyl-based compound (F) includes at least one of a compound represented by following Formula (F-1) and a compound represented by following Formula (F-2). Based on a total usage amount of the resin composition as 100 parts by weight, a usage amount of the phenyl-based compound (F) is 0.05 to 5 parts by weight. In Formula (F-1) and Formula (F-2), the definition of R1, R3, R4, Y, Z, m, n and p are the same as defined in the detailed description.

公开(公告)号：US20210221946A1

公开(公告)日：2021-07-22

申请号：US17143159

申请日：2021-01-07

Applicant: eChem Solutions Corp.

Inventor： Yu-Wen Chen ,  Yi-Lun Chiu ,  Chia-Hao Lou ,  Chen-Wen Chiu

IPC: C08G63/197 ,  C08F2/50 ,  G02B5/20 ,  C08K3/04 ,  C08K3/08

Abstract: A resin composition and a filter element are provided. The resin composition includes a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), and a photoinitiator (E). The black coloring agent (A) includes a titanium black (A-1) and a carbon black (A-2). Based on a total usage amount of 100 parts by weight of the titanium black (A-1) and the carbon black (A-2), a usage amount of the titanium black (A-1) is 50 parts by weight to 75 parts by weight.

公开(公告)号：US11029598B2

公开(公告)日：2021-06-08

申请号：US16119464

申请日：2018-08-31

Applicant: eChem Solutions Corp.

Inventor： Tz Jin Yang ,  Ming Che Chung

IPC: G03F7/20 ,  G03F7/023 ,  G03F7/039 ,  G03F7/004 ,  C08G73/10 ,  G03F7/38 ,  G03F7/26 ,  G03F7/16 ,  G03F7/075 ,  G03F7/022

Abstract: The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator. In the formulas (1) and (2), n is an integer of 10 to 600, Ar1 is a tetravalent organic group; Ar2 is a divalent to tetravalent organic group; Ar3 is a divalent aromatic group; and R1 is an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.

公开(公告)号：US12157815B2

公开(公告)日：2024-12-03

申请号：US17352371

申请日：2021-06-21

Applicant: eChem Solutions Corp.

Inventor： Yung-Yu Lin ,  Chi-Yu Lai ,  Che-Wei Chang

IPC: C08L79/08 ,  C08G73/10 ,  C08G73/12 ,  C09J7/38 ,  C09J7/40 ,  C09J179/08

Abstract: A polyimide resin composition, a polyimide resin adhesive layer, a laminate, and a manufacturing method of an electronic component are provided. The polyimide resin composition includes a polyimide resin. The polyimide resin is obtained by the polymerization reaction of a diamine (A) and a tetracarboxylic dianhydride (B). The diamine (A) includes a diamine (A-1) represented by following Formula (I-1) and a diamine (A-2) represented by following Formula (I-2). A molar ratio ((A-1):(A-2)) of the diamine (A-1) to the diamine (A-2) is 0.1:0.2 to 0.6.

公开(公告)号：US11914292B2

公开(公告)日：2024-02-27

申请号：US17308055

申请日：2021-05-05

Applicant: eChem Solutions Corp.

Inventor： Ya-Qian Chen ,  Yu-Chun Chen

IPC: G03F7/029 ,  G02F1/1335 ,  G03F7/031

CPC classification number: G03F7/029 ,  G02F1/133614 ,  G03F7/031

Abstract: The photosensitive resin composition includes an alkali-soluble resin (A), an ethylenically-unsaturated monomer (B), a photopolymerization initiator (C), a solvent (D), and a pigment (E). The alkali- soluble resin (A) includes an alkali-soluble resin (A-1), wherein the alkali-soluble resin (A-1) includes a structural unit represented by formula (I-1) and a structural unit represented by formula (I-2). The photopolymerization initiator (C) includes an acylphosphine oxide compound represented by formula (III-1).

公开(公告)号：US20230348133A1

公开(公告)日：2023-11-02

申请号：US18220841

申请日：2023-07-12

Applicant: eChem Solutions Corp.

Inventor： CHEN YA KAO ,  TZ JIN YANG

IPC: B65D8/02 ,  H01L21/67 ,  F16L37/56

CPC classification number: B65D11/08 ,  H01L21/67017 ,  F16L37/56

Abstract: A pipe connectable plastic bucket includes a bucket and at least two quick-connect devices. The bucket has a plurality of through holes for communication between the inside and the outside of the bucket. The at least two quick-connect devices respectively correspond to the plurality of through holes, and are disposed on the bucket. The at least two quick-connect devices are adapted to connect to pipes, and are used for allowing a fluid entering and exiting the bucket through the plurality of the through holes. The at least two quick-connect devices comprise a first quick-connect device for allowing the liquid to enter and to exit the bucket. The present invention also provides a method of using the pipe connectable plastic bucket.

公开(公告)号：US20230324793A1

公开(公告)日：2023-10-12

申请号：US18297004

申请日：2023-04-07

Applicant: eChem Solutions Corp.

Inventor： Hsiao-Chi Chiu ,  Jui-Yu Hsu

IPC: G03F7/029

CPC classification number: G03F7/029 ,  G03F7/0048

Abstract: A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), a thermal acid generator (D), a photoinitiator (E) and a solvent (F). The weight average molecular weight of the alkali-soluble resin (A) is 5,000-40,000. The polymerizable monomer (B) includes an epoxy monomer (B1), ethylenically unsaturated monomer (B2) or the combination thereof. The thermal acid generator (D) includes hexafluoroonium salt. The epoxy monomer (B1) includes a compound represented by following Formula (B-1).




In Formula (B-1), the definition of X1 to X3 and Z4 to Z6 are the same as defined in the detailed description.

公开(公告)号：US11603458B2

公开(公告)日：2023-03-14

申请号：US17412286

申请日：2021-08-26

Applicant: eChem Solutions Corp.

Inventor： Chin-Chen Huang ,  Yu-Wen Chen ,  Yu-Lun Li ,  Chen-Wen Chiu

IPC: C08L35/02 ,  C08J5/18 ,  G02B1/04 ,  G02B5/00

Abstract: A black resin composition, a cured film, and a black filter are provided. The black resin composition includes: a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), a photoinitiator (E), a UV absorber (F), and a surfactant (G). The resin (D) includes a first resin having a weight-average molecular weight of 2,000 to 20,000. The first resin includes a structural unit having a fluorene ring and two or more ethylenically-polymerizable groups. The UV absorber (F) includes a benzylidene-based derivative.

公开(公告)号：US20210371747A1

公开(公告)日：2021-12-02

申请号：US17241086

申请日：2021-04-27

Applicant: eChem Solutions Corp.

Inventor： Yu-Ning Chen ,  Ming-Che Chung

IPC: C09K13/02 ,  C08J7/12

Abstract: An etchant composition, a tackifier, an alkaline solution, a method of removing polyimide and an etching process are provided. The etchant composition includes a tackifier (A) and an alkaline solution (B). The tackifier (A) includes a resin containing a hydroxyl group (a), a surfactant (b) and a first solvent (c1). The alkaline solution (B) includes an alkaline compound (d) and a second solvent (c2).

公开(公告)号：US20200319554A1

公开(公告)日：2020-10-08

申请号：US16909936

申请日：2020-06-23

Applicant: ECHEM SOLUTIONS CORP.

Inventor： Ting-Wei Chang ,  Ming-Che CHUNG

IPC: G03F7/039 ,  G03F7/004

Abstract: The present invention provides a method for forming a patterned polyimide layer with the use of a positive photoresist composition. The composition comprises a cresol-type novolac resin, a diazonaphthoquinone-based sensitizer and an organic solvent; based on the cresol-type novolac resin with a total amount of 100 parts by weight, the amount of the diazonaphthoquinone-based sensitizer ranges from 40 parts to 60 parts by weight, the amount of the free cresol in the cresol-type novolac resin is lower than 2 parts by weight, and the alkaline dissolution rate (ADR) of the cresol-type novolac resin in an aqueous solution of 3.5 wt % to 7 wt % tetramethylammonium hydroxide is lower than 285 Å/s. The positive photoresist composition has excellent chemical resistance to the polyimide stripper, and can specifically improve the protective ability of the photoresist layer to the low-dielectric polyimide layer, thereby optimizing the manufacturing process and quality of the patterned polyimide layer.