Abstract:
A nanocomposite is provided including spherical pyrogenic silica nanoparticles dispersed in a curable resin or a curing agent. The nanocomposite contains less than 2% by weight solvent and less than 0.5% by weight dispersant based on the nanoparticle weight. A composite is also provided including from about 4 to 70 weight percent of spherical pyrogenic silica nanoparticles dispersed in a cured resin, and a filler embedded in the cured resin. Optionally, the composite further contains a curing agent. Further, a method of preparing a nanoparticle-containing curable resin system is provided including mixing from 10 to 70 weight percent of aggregated spherical pyrogenic silica nanoparticles with a curable resin to form a mixture. The mixture contains less than 2% by weight solvent and less than 0.5% by weight dispersant based on the nanoparticle weight. The method also includes milling the mixture in an immersion mill containing milling media to form a milled resin system including silica nanoparticles dispersed in the curable resin.
Abstract:
Aspects of the present disclosure relate to a method for managing inventory items in a first inventory management system. The method can include determining, with a computing device and an optical scanning device, whether the inventory item corresponds to a first item data set based on at least one attribute for the first item data set. The method can include adding, in response to the inventory item corresponding to the first item data set, the first item data set to a plurality of item data sets in a facility inventory profile for the first inventory management system. The method can also include determining, based on a correlation between the facility inventory profile and a plurality of facility inventory profiles, a second attribute for the inventory item different from the at least one attribute. The method can include performing at least one action based on the determination of the second attribute.
Abstract:
Dispersions of nanoparticles in a resin component are described. The nanoparticles have a multimodal particle size distribution including at least a first mode and a second mode. The number average particle diameter of the particles in the first mode is greater than the number average particle size distribution in the second mode. The use of multimodal nanoparticle size distributions and the relative number of particles in the first and second mode to reduce or eliminate particle stacking behavior is also described.
Abstract:
A nanocomposite is provided including layered nanoparticles and a dispersant dispersed in a curable resin, where the nanocomposite contains less than 2% by weight solvent. A composite is also provided including from about 1 to 70 weight percent of layered nanoparticles, and a dispersant, dispersed in a cured resin, and a filler embedded in the cured resin. Further, a method of preparing a nanoparticle-containing curable resin system is provided including mixing from 1 to 70 weight percent of aggregated layered nanoparticles with a curable resin and a dispersant to form a mixture. The mixture contains less than 2% by weight solvent. The method also includes milling the mixture in an immersion mill containing milling media to form a milled resin system including layered nanoparticles dispersed in the curable resin.
Abstract:
Dispersions of nanoparticles in a resin component are described. The nanoparticles have a multimodal particle size distribution including at least a first mode and a second mode. The number average particle diameter of the particles in the first mode is greater than the number average particle size distribution in the second mode. The use of multimodal nanoparticle size distributions and the relative number of particles in the first and second mode to reduce or eliminate particle stacking behavior is also described.
Abstract:
Provided are adhesive articles and related methods of making and use. The adhesive article includes one or more patterned adhesive layers comprising compositionally and spatially distinct adhesives that are laterally disposed relative to each other. The first and second adhesives are optionally capable of being functionally cured to provide a structural adhesive bond with a substrate. These adhesives can provide high fracture toughness and high modulus characteristics not otherwise possible in a homogeneous adhesive composition. These adhesives can provide some degree of crack arrestment and significantly reduce the need for mechanical fasteners in industrial bonding applications.
Abstract:
A nanocomposite is provided including layered nanoparticles and a dispersant dispersed in a curable resin, where the nanocomposite contains less than 2% by weight solvent. A composite is also provided including from about 1 to 70 weight percent of layered nanoparticles, and a dispersant, dispersed in a cured resin, and a filler embedded in the cured resin. Further, a method of preparing a nanoparticle-containing curable resin system is provided including mixing from 1 to 70 weight percent of aggregated layered nanoparticles with a curable resin and a dispersant to form a mixture. The mixture contains less than 2% by weight solvent. The method also includes milling the mixture in an immersion mill containing milling media to form a milled resin system including layered nanoparticles dispersed in the curable resin.
Abstract:
A nanocomposite is provided including spherical pyrogenic silica nanoparticles dispersed in a curable resin or a curing agent. The nanocomposite contains less than 2% by weight solvent and less than 0.5% by weight dispersant based on the nanoparticle weight. A composite is also provided including from about 4 to 70 weight percent of spherical pyrogenic silica nanoparticles dispersed in a cured resin, and a filler embedded in the cured resin. Optionally, the composite further contains a curing agent. Further, a method of preparing a nanoparticle-containing curable resin system is provided including mixing from 10 to 70 weight percent of aggregated spherical pyrogenic silica nanoparticles with a curable resin to form a mixture. The mixture contains less than 2% by weight solvent and less than 0.5% by weight dispersant based on the nanoparticle weight. The method also includes milling the mixture in an immersion mill containing milling media to form a milled resin system including silica nanoparticles dispersed in the curable resin.
Abstract:
A nanocomposite is provided including spherical pyrogenic silica nanoparticles dispersed in a curable resin or a curing agent. The nanocomposite contains less than 2% by weight solvent and less than 0.5% by weight dispersant based on the nanoparticle weight. A composite is also provided including from about 4 to 70 weight percent of spherical pyrogenic silica nanoparticles dispersed in a cured resin, and a filler embedded in the cured resin. Optionally, the composite further contains a curing agent. Further, a method of preparing a nanoparticle-containing curable resin system is provided including mixing from 10 to 70 weight percent of aggregated spherical pyrogenic silica nanoparticles with a curable resin to form a mixture. The mixture contains less than 2% by weight solvent and less than 0.5% by weight dispersant based on the nanoparticle weight. The method also includes milling the mixture in an immersion mill containing milling media to form a milled resin system including silica nanoparticles dispersed in the curable resin.
Abstract:
A nanocomposite is provided including nonspherical silica nanoparticles dispersed in a curable resin or a curing agent, where the nanocomposite contains less than 2% by weight solvent. A composite is also provided including from about 4 to 70 weight percent of nonspherical silica nanoparticles dispersed in a cured resin, and a filler embedded in the cured resin. Further, a method of preparing a nanoparticle-containing curable resin system is provided including mixing from 10 to 70 weight percent of aggregated silica nanoparticles with a curable resin and optionally a dispersant, a catalyst, a diluent, a surface treatment agent, and/or a curing agent, to form a mixture. The mixture contains less than 2% by weight solvent. The method also includes milling the mixture in an immersion mill containing milling media to form a milled resin system including nonspherical silica nanoparticles dispersed in the curable resin.