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公开(公告)号：US20130244358A1
公开(公告)日：2013-09-19
申请号：US13787748
申请日：2013-03-06
发明人： LUNG-HSIN CHEN , WEN-LIANG TSENG
IPC分类号： H01L33/52
CPC分类号： H01L33/52 , H01L33/0095 , H01L2224/16 , H01L2933/0041
摘要： A method of manufacturing a light emitting diode (LED) comprising: providing a porous carrier, a base disposed on the carrier and a plurality of light emitting elements mounted on the base, wherein the carrier defines a plurality of micro through-holes extending through a first face to a second face of the carrier, and the base has electrical structures formed thereon electrically connecting to the light emitting elements, respectively; providing a mold to receive the carrier therein and distributing a phosphor glue on the base to cover the light emitting elements, and the mold defining an air outlet communicated with the through-holes of the carrier; vacuuming the mold via the air outlet to flatten an outer face of the phosphor glue; heating the phosphor glue and removing the mold; and removing the carrier.
摘要翻译： 一种制造发光二极管（LED）的方法，包括：提供多孔载体，设置在所述载体上的基体和安装在所述基底上的多个发光元件，其中所述载体限定多个延伸穿过所述基底的微通孔 第一面到载体的第二面，并且基部分别形成有电连接到发光元件的电结构; 提供用于在其中容纳载体的模具，并将磷光体胶分配在基底上以覆盖发光元件，并且模具限定与载体的通孔连通的空气出口; 通过出风口对模具进行抽真空，使磷光胶的外表面平坦化; 加热荧光胶并去除模具; 并移除载体。
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公开(公告)号：US20190033659A1
公开(公告)日：2019-01-31
申请号：US15800165
申请日：2017-11-01
IPC分类号： G02F1/1335
CPC分类号： G02F1/133603 , G02F1/133512 , G02F1/133514 , G02F1/133605 , G02F1/133606 , G02F1/133617 , G02F2001/133607 , G02F2001/133612 , G02F2001/133614 , G02F2201/52 , G02F2202/36
摘要： A liquid crystal display device comprises a backlight module and a liquid crystal display module in a light emitting path of the backlight module. The liquid crystal display module includes a first conductive substrate facing the backlight module, a second conductive substrate spaced apart from the first conductive substrate, and a liquid crystal layer sandwiched between the first conductive substrate and the second conductive substrate. The second conductive substrate includes a transparent substrate, a color filter layer formed on the transparent substrate, and a light converting layer formed on the color filter layer, and a transparent conductive layer formed on the light converting layer.
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公开(公告)号：US20190033658A1
公开(公告)日：2019-01-31
申请号：US15662087
申请日：2017-07-27
IPC分类号： G02F1/1335 , G02F1/1368
摘要： A liquid crystal display module comprises a thin film transistor array substrate, a liquid crystal layer, a color filter substrate and a plurality of light emitting diode chips. The thin film transistor array substrate has a first surface and a second surface. A circuit structure is formed on the first surface. A plurality of thin film transistors is formed on the second surface and electrically connecting to the circuit structure. The liquid crystal layer faces the second surface. The liquid crystal layer is formed between the thin film transistor array substrate and the color filter substrate. The light emitting diode chips are adhered on the first surface and electrically connecting to the circuit structure. Each light emitting diode chip has a light emitting surface. Light emitted from the light emitting surfaces is incident on the first surface of the thin film transistor array substrate.
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公开(公告)号：US20150036321A1
公开(公告)日：2015-02-05
申请号：US14445486
申请日：2014-07-29
CPC分类号： G02B19/0061 , F21V5/046 , F21V7/0091 , F21V9/30 , G02B19/0028
摘要： An optical lens includes a first optical surface located at a bottom thereof, a third optical surface located at a top thereof and arranged oppositely to the first optical surface, and a second optical surface extending between the first optical surface and the third optical surface. The third optical surface is recessed downwardly towards the first optical surface. The light from the LED light source enters into the optical lens through the first optical surface, most of the entering light is directly refracted out of the optical lens through the second optical surface, and a part of the entering light that strikes the third optical surface is first reflected by the third optical surface towards the second optical surface via total internal reflection and then refracted out of the optical lens through the second optical surface. A backlight module incorporating the optical lens is also provided.
摘要翻译： 光学透镜包括位于其底部的第一光学表面，位于其顶部并与第一光学表面相对布置的第三光学表面，以及在第一光学表面和第三光学表面之间延伸的第二光学表面。 第三光学表面向下朝向第一光学表面凹陷。 来自LED光源的光通过第一光学表面进入光学透镜，大部分入射光通过第二光学表面直接从光学透镜折射出来，并且进入第三光学表面的入射光的一部分 首先由第三光学表面通过全内反射朝向第二光学表面反射，然后通过第二光学表面折射出光学透镜。 还提供了包括光学透镜的背光模块。
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公开(公告)号：US20150003080A1
公开(公告)日：2015-01-01
申请号：US14310486
申请日：2014-06-20
IPC分类号： F21K99/00
CPC分类号： F21V5/04 , F21Y2115/10 , G02B19/0028 , G02B19/0061
摘要： An LED module includes a PCB with a first electrode and a second electrode formed thereon, an LED mounted on the PCB, a lens mounted on the PCB and covering the LED. The LED includes a base, an LED die mounted on the base, and a packaging layer arranged on the base and covering the LED die therein. The base is flat. The lens includes a bottom surface, a first light output surface extending from the bottom surface, a second light output surface extending upwardly from a central of the first light output surface and away from the bottom surface, and a reflecting surface recessing downwardly from a top end of the second light output surface and oriented towards the bottom surface. A chamber is defined in the bottom surface to receive the LED therein.
摘要翻译： LED模块包括具有形成在其上的第一电极和第二电极的PCB，安装在PCB上的LED，安装在PCB上并覆盖LED的透镜。 LED包括基座，安装在基座上的LED管芯，以及布置在基座上并在其中覆盖LED管芯的封装层。 基地平坦。 透镜包括底面，从底面延伸的第一光输出表面，从第一光输出表面的中心向上延伸并远离底表面的第二光输出表面，以及从顶部向下凹陷的反射表面 第二光输出表面的端部并且朝向底表面定向。 在底表面中限定一个室，以便在其中接收LED。
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16.发明申请公开(公告)号：US20140175482A1
公开(公告)日：2014-06-26
申请号：US13963324
申请日：2013-08-09
发明人： YAU-TZU JANG , PIN-CHUAN CHEN , LUNG-HSIN CHEN , HSING-FEN LO , WEN-LIANG TSENG , YU-LIANG HUANG
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L2224/48091 , H01L2924/00014
摘要： An exemplary LED package includes a base, electrodes formed on the base, an LED chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the LED chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup. The reflecting cup is annular. The inner surface includes a reflecting portion slantwise extending from the top surface, and a transition portion extending downwardly from the reflecting portion. The transition portion defines a through hole therein. The reflecting portion defines a reflecting hole therein. An angle α is defined between the reflecting portion and an imaginary surface parallel to the bottom surface. An angle β is defined between the reflecting portion and the bottom surface. The angle β is larger than the angle α.
摘要翻译： 示例性的LED封装包括基底，形成在基底上的电极，电连接电极的LED芯片和安装在基座上并围绕LED芯片的反射杯。 反射杯包括底表面和从底表面向上凹陷的内表面，并且朝向反射杯的顶端倾斜定向。 反射杯是环形的。 内表面包括从顶表面倾斜延伸的反射部分和从反射部分向下延伸的过渡部分。 过渡部分在其中限定一个通孔。 反射部分在其中限定反射孔。 在反射部分和平行于底面的假想表面之间限定角度α。 角＆bgr 被限定在反射部和底面之间。 角度＆bgr 大于角度α。
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公开(公告)号：US20140119009A1
公开(公告)日：2014-05-01
申请号：US14014367
申请日：2013-08-30
发明人： LUNG-HSIN CHEN , WEN-LIANG TSENG
IPC分类号： F21K99/00
CPC分类号： F21V17/168 , F21K9/23 , F21Y2107/00 , F21Y2115/10
摘要： A light emitting diode (LED) bulb includes a connecting body, a lamp cap located at a first end of the connecting body, a mounting base located at a second end of the connecting body opposite to the first end, a plurality of LED modules mounted on the mounting base and a sheath assembled to the second end of the connecting body. The sheath includes a first portion and a second portion detachably engaged with the first portion to cooperatively define an enclosed space enclosing the mounting base and the LED modules therein.
摘要翻译： 发光二极管（LED）灯泡包括连接体，位于连接体第一端的灯帽，位于连接体的与第一端相对的第二端的安装基座，安装有多个LED模块 在安装基座和组装到连接体的第二端的护套上。 护套包括第一部分和第二部分，其可拆卸地与第一部分接合，以协同地限定封闭安装基座和LED模块的封闭空间。
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公开(公告)号：US20140071675A1
公开(公告)日：2014-03-13
申请号：US13953902
申请日：2013-07-30
CPC分类号： F21V5/04 , F21K9/232 , F21K9/60 , F21V3/02 , F21V29/70 , F21V29/773 , F21V29/89 , F21Y2113/13 , F21Y2115/10 , G02B19/0061 , G02B19/0071
摘要： An LED bulb includes a connecting member having an Edison male screw base and an LED module engaging with the connecting member. The LED module includes a circuit board, a first LED and a plurality of second LEDs mounted on the circuit board. The first LED is arranged on a center of the circuit board. The second LEDs are located surround the first LED. The LED bulb furthermore includes a plurality of lens. Each lens covers a corresponding second LED. Each lens includes a light-guiding portion which includes a light input surface and a light output surface. Light emitted from each of the second LEDs travels into the lens via the light input surface, and is refracted out to lateral directions of the LED bulb by the light output surface of the light-guiding portion to obtain a wider illumination range.
摘要翻译： LED灯泡包括具有Edison外螺纹基座和与连接构件接合的LED模块的连接构件。 LED模块包括电路板，第一LED和安装在电路板上的多个第二LED。 第一个LED布置在电路板的中心。 第二个LED位于第一个LED的周围。 LED灯泡还包括多个透镜。 每个镜头都覆盖相应的第二个LED。 每个透镜包括导光部分，其包括光输入表面和光输出表面。 从每个第二LED发射的光经由光输入表面进入透镜，并且通过导光部分的光输出表面折射到LED灯泡的横向以获得更宽的照明范围。
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19.发明申请METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE HAVING LED DIE FIXED BY ANISOTROPIC CONDUCTIVE PASTE 失效用于制造具有由各向异性导电固定的LED模具的发光二极管封装的方法公开(公告)号：US20130288406A1
公开(公告)日：2013-10-31
申请号：US13786354
申请日：2013-03-05
发明人： LUNG-HSIN CHEN , WEN-LIANG TSENG
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L24/29 , H01L24/83 , H01L24/97 , H01L33/0095 , H01L2224/16 , H01L2224/83192 , H01L2924/01322 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , H01L2933/0066 , H01L2924/00
摘要： A method for packaging an LED, includes steps: providing a substrate and forming a plurality of pairs of electrodes on the substrate; positioning anisotropic conductive pastes on the substrate and attaching each anisotropic conductive paste to each pair of the electrodes; positioning an LED die on each anisotropic conductive paste and electrically connecting each LED die to each corresponding pair of the electrodes with the anisotropic conductive paste by hot compressing; forming an encapsulation on the substrate to cover the LED dies; and cutting the substrate to obtain individual LED packages.
摘要翻译： 一种用于封装LED的方法，包括以下步骤：提供衬底并在衬底上形成多对电极; 将各向异性导电膏定位在基板上，并将每个各向异性导电膏粘附到每对电极上; 在每个各向异性导电膏上定位一个LED管芯，并通过热压将每个相应的一对电极与各向异性导电膏电连接; 在衬底上形成封装以覆盖LED管芯; 并切割基板以获得单独的LED封装。
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公开(公告)号：US20130242554A1
公开(公告)日：2013-09-19
申请号：US13891139
申请日：2013-05-09
发明人： CHI-WEI LIAO , WEN-LIANG TSENG , MIN-TSUN HSIEH , CHIH-YUNG LIN , CHING-LIEN YEH
IPC分类号： F21V15/00
摘要： A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a housing enclosing the at lest one light module and the at least one lens therein, and a foldable cover located in front of the at least one lens and connected to the housing. A cleaning device is located on an outer surface of the foldable cover to clean snow and dust accumulated on the outer surface of the foldable cover.
摘要翻译： 交通信号灯组件包括至少一个灯模块，位于至少一个灯模块前面的至少一个透镜，封闭最少的一个光模块和至少一个透镜的壳体，以及位于前面的可折叠盖 的至少一个透镜并且连接到壳体。 清洁装置位于可折叠盖的外表面上，以清洁累积在可折叠盖的外表面上的积雪和积雪。
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