公开(公告)号：US20210223292A1

公开(公告)日：2021-07-22

申请号：US16884311

申请日：2020-05-27

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

IPC: G01R15/08 ,  H01L43/06 ,  H01L43/04

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

公开(公告)号：US10935612B2

公开(公告)日：2021-03-02

申请号：US15999448

申请日：2018-08-20

Applicant: Allegro MicroSystems, LLC ,  Commissariat à l'énergie atomique et aux énergies alternatives

Inventor： Noémie Belin ,  Shaun D. Milano ,  Wade Bussing ,  Claude Fermon

IPC: G01R15/20 ,  G01R19/00 ,  G01R33/025 ,  G01R33/09

Abstract: Systems and methods described herein provide a current sensor based on magnetic field detection having multiple sensor arrangements with multiple, different sensitivity ranges. The outputs of the multiple sensor arrangements can be combined to generate a single output signal. The current sensor can include two or more sensor arrangements, each having one or more magnetic field sensing elements, and configured to sense a magnetic field in different first measurement ranges corresponding to different ranges of currents through the conductor and further configured to generate different magnetic field signals indicative of the sensed magnetic field in the respective measurement range. The current sensor can include a circuit configured to generate an output signal indicative of a combination of the different magnetic field signals that corresponds to the current through the conductor.

公开(公告)号：US20190285667A1

公开(公告)日：2019-09-19

申请号：US16421982

申请日：2019-05-24

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R15/20 ,  G01R19/00

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

公开(公告)号：US10114044B2

公开(公告)日：2018-10-30

申请号：US15805616

申请日：2017-11-07

Applicant: Allegro MicroSystems, LLC

Inventor： Dominik Geisler ,  Shaun D. Milano

IPC: G01R33/36 ,  G01R15/20 ,  G01R31/36 ,  G01R33/07 ,  G01R15/18

Abstract: A current sensor includes a ferromagnetic core having a substantially central opening for receiving a current conductor and a gap. A detector of the current sensor includes at least one first magnetic field sensing element disposed in a first gap portion and configured to generate a respective first magnetic field signal in response to a first magnetic field having a first angle with respect to the at least one first magnetic field sensing element. The detector also includes at least one second magnetic field sensing element disposed in a second gap portion and configured to generate a respective second magnetic field signal in response to a second magnetic field having a second angle with respect to the at least one second magnetic field sensing element. The first and second magnetic fields are substantially equal in magnitude and the first and second angles are substantially opposite in polarity.

公开(公告)号：US10073136B2

公开(公告)日：2018-09-11

申请号：US14578789

申请日：2014-12-22

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Shaun D. Milano ,  Georges El Bacha ,  Michael C. Doogue ,  William P. Taylor

IPC: G01R33/06 ,  G01R31/28 ,  G01R33/00 ,  G01R31/3187 ,  G01R33/02 ,  G01R33/07 ,  G01R33/09 ,  G01R35/00

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element having differential first and second outputs and an input, the input to receive current and first and second switches coupled to a respective one of the differential first and second outputs. A first voltage source is coupled between the first and second switches, the first and second switches having a first state in which the first voltage source is coupled across the differential first and second outputs, and an IC output can output a voltage corresponding to the first voltage source when the first and second switches are in the first state for monitoring operation of a signal path from the magnetic sensing element to the IC output.

公开(公告)号：US20160172584A1

公开(公告)日：2016-06-16

申请号：US15049732

申请日：2016-02-22

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Shaun D. Milano ,  Michael C. Doogue ,  William P. Taylor

IPC: H01L43/04 ,  G01R33/09 ,  H01L43/06 ,  H01L23/31 ,  H01L43/14 ,  H01L23/00 ,  H01L23/495 ,  G01R33/07 ,  H01L43/08

CPC classification number: H01L43/04 ,  G01R33/0029 ,  G01R33/0052 ,  G01R33/0076 ,  G01R33/07 ,  G01R33/09 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/17 ,  H01L43/02 ,  H01L43/06 ,  H01L43/065 ,  H01L43/08 ,  H01L43/12 ,  H01L43/14 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods and apparatus to provide a magnetic field sensor device including a magnetic sensor element, a die having wafer bumps, wherein the magnetic sensor element is positioned in relation to the die, and conductive leadfingers having respective portions electrically connected to the wafer bumps. In embodiments, the device includes a region about the magnetic sensor element that does not contain electrically conductive material for preventing eddy current flow.

Abstract translation: 提供包括磁传感器元件的磁场传感器装置的方法和装置，具有晶片凸块的模具，其中磁传感器元件相对于管芯定位，以及具有电连接到晶片凸块的相应部分的导电引线。 在实施例中，该装置包括围绕磁传感器元件的不包含用于防止涡流流动的导电材料的区域。

公开(公告)号：US09299915B2

公开(公告)日：2016-03-29

申请号：US14090037

申请日：2013-11-26

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Shaun D. Milano ,  Michael C. Doogue ,  William P. Taylor

IPC: H01L23/00 ,  H01L43/02 ,  H01L23/495 ,  H01L23/31 ,  G01R33/00 ,  H01L43/12

CPC classification number: H01L43/04 ,  G01R33/0029 ,  G01R33/0052 ,  G01R33/0076 ,  G01R33/07 ,  G01R33/09 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/17 ,  H01L43/02 ,  H01L43/06 ,  H01L43/065 ,  H01L43/08 ,  H01L43/12 ,  H01L43/14 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods and apparatus to provide an integrated circuit package having a conductive leadframe, a non-conductive die paddle mechanically coupled to the leadframe, and a die disposed on the die paddle and electrically connected to the leadframe. With this arrangement, eddy currents are reduced near the magnetic field transducer to reduce interference with magnetic fields.

Abstract translation: 提供集成电路封装的方法和装置，其具有导电引线框架，机械耦合到引线框架的非导电管芯焊盘以及设置在管芯焊盘上并电连接到引线框架的管芯。 通过这种布置，磁场传感器附近的涡流减小，以减少对磁场的干扰。

公开(公告)号：US20150185279A1

公开(公告)日：2015-07-02

申请号：US14578813

申请日：2014-12-22

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Shaun D. Milano ,  Georges El Bacha ,  Michael C. Doogue ,  William P. Taylor

IPC: G01R31/28 ,  G01R33/00

CPC classification number: G01R31/2884 ,  G01R31/2829 ,  G01R31/3187 ,  G01R33/00 ,  G01R33/0023 ,  G01R33/02 ,  G01R33/07 ,  G01R33/09 ,  G01R33/091 ,  G01R35/00 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element and fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition. In illustrative embodiments, a fault pin indicates the fault condition.

Abstract translation: 提供具有耦合到感测元件的磁感测元件和故障检测模块的集成电路的方法和装置，所述故障检测模块包括用于检测故障状况的电路和用于检测故障状况的电路的自检操作。 在说明性实施例中，故障引脚指示故障状况。

公开(公告)号：US11519939B2

公开(公告)日：2022-12-06

申请号：US17472769

申请日：2021-09-13

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

IPC: H01L21/44 ,  G01R15/08 ,  H01L43/04 ,  H01L43/06

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

公开(公告)号：US20210405092A1

公开(公告)日：2021-12-30

申请号：US17472769

申请日：2021-09-13

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

IPC: G01R15/08 ,  H01L43/04 ,  H01L43/06

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.