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    PRINTED CIRCUIT BOARD FEATURES OF A PORTABLE COMPUTER
    11.
    发明申请
    PRINTED CIRCUIT BOARD FEATURES OF A PORTABLE COMPUTER 有权
    便携式电脑的打印电路板功能

    公开(公告)号：US20140111926A1

    公开(公告)日：2014-04-24

    申请号：US13855681

    申请日：2013-04-02

    Applicant: APPLE INC.

    Inventor： Gavin J. Reid ,  Joss N. Giddings ,  William F. Leggett ,  Thomas R. Tate ,  Gary S. Thomason

    IPC: H05K1/02 ,  H05K3/00 ,  H05K3/30 ,  G06F1/16

    CPC classification number: G06F1/1662 ,  G06F1/16 ,  G06F1/1616 ,  G06F1/1656 ,  G06F1/203 ,  H01R13/50 ,  H01R13/6582 ,  H05K1/02 ,  H05K3/00 ,  H05K3/30 ,  Y10T29/49124 ,  Y10T29/4913

    Abstract: Methods, tools and fixtures for assembling a printed circuit board (PCB), such as a main logic board (MLB), in a portable computer device are described. A connector assembly having an electrically conductive gasket mounted on an edge of the MLB is described. In addition, a keyboard assembly including a notched portion of the MLB for accommodating more than one type of keyboard is described. In addition, a PCB assembly having a bracket to support a weak region of the PCB during assembly is described. In addition, a method for shielding an antenna cable situated on an MLB is described.

    Abstract translation: 描述了用于在便携式计算机设备中组装诸如主逻辑板（MLB）的印刷电路板（PCB）的方法，工具和固定装置。 描述了具有安装在MLB的边缘上的导电垫片的连接器组件。 此外，描述了包括用于容纳多于一种类型的键盘的MLB的切口部分的键盘组件。 此外，描述了一种具有用于在组装期间支撑PCB的弱区域的托架的PCB组件。 另外，描述了一种屏蔽位于MLB上的天线电缆的方法。

    Device housing having improved tolerances
    15.
    发明授权
    Device housing having improved tolerances 有权
    装置外壳具有改进的公差

    公开(公告)号：US09583285B1

    公开(公告)日：2017-02-28

    申请号：US14550250

    申请日：2014-11-21

    Applicant: Apple Inc.

    Inventor： Bartley K. Andre ,  Mikael Silvanto ,  Houtan Farahani ,  Gavin J. Reid ,  Jason Keats

    IPC: H01H1/64 ,  H01H9/02

    CPC classification number: H01H9/02 ,  H01H13/04 ,  H01H13/50 ,  H01H2223/036 ,  H01H2229/064 ,  H01H2231/022

    Abstract: Input elements, handles, enclosures and alignment of such elements and handles within an electronic device. The elements, such as buttons or input devices, and handles discussed herein may be configured, assembled and/or installed within and/or on an electronic device to ensure proper alignment and positioning within the housing of the electronic device. By properly aligning and positioning the elements and handles within or on the housing of the electronic device, the elements and handles may provide accurate input to the electronic device and may be visually appealing to a user. Additionally, a two-piece enclosure including a hook and cutout portion may secure and/or protect the internal components of the electronic device, while also providing a visually “seamless” connection between the two-pieces for forming the enclosure of the electronic device.

    Abstract translation: 电子设备内的输入元件，手柄，外壳和这些元件和把手的对齐。 可以在电子设备内部和/或电子设备上配置，组装和/或安装诸如按钮或输入设备的元件，以及在此处讨论的手柄，以确保在电子设备的壳体内的适当对准和定位。 通过在电子设备的壳体内或壳体上正确对准和定位元件和手柄，元件和手柄可以向电子设备提供准确的输入，并且可以视觉上吸引用户。 此外，包括钩和切口部分的两件式外壳可以固定和/或保护电子设备的内部部件，同时还提供用于形成电子设备的外壳的两件之间的视觉上“无缝”连接。

    Thermal module accounting for increased board/die size in a portable computer
    16.
    发明授权
    Thermal module accounting for increased board/die size in a portable computer 有权
    散热模块考虑了便携式计算机中板/芯片尺寸的增加

    公开(公告)号：US09379037B2

    公开(公告)日：2016-06-28

    申请号：US14214315

    申请日：2014-03-14

    Applicant: Apple Inc.

    Inventor： Brett W. Degner ,  Gavin J. Reid ,  Brandon S. Smith ,  Raymond S. Shan

    IPC: H05K7/20 ,  H01L23/40 ,  H05K1/02 ,  H05K1/18 ,  F28D15/02 ,  F28D15/04

    CPC classification number: H01L23/4006 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/04 ,  H01L23/427 ,  H01L2023/4081 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/181 ,  H05K7/20336 ,  H01L2924/00

    Abstract: This application relates to a low profile, small footprint cooling stack that does not extend substantially beyond a footprint of an integrated circuit to which it is affixed. The cooling stack utilizes a number of beam springs that supply a seating force to the integrated circuit by way of a metal slug. In some embodiments, a bottom surface of the metal slug can be contoured in accordance with a top surface of the integrated circuit and/or socket. In other embodiments a gap between peripheral portion of a bottom surface of the metal slug and an associated printed circuit board can be filled by a layer of foam to reduce auditory signals generated by the integrated circuit.

    Abstract translation: 本申请涉及一种低外形，占地面积小的冷却堆，其基本上不超过其所固定的集成电路的占地面积。 冷却堆栈利用多个梁弹簧，其通过金属块向集成电路提供就座力。 在一些实施例中，金属块的底表面可以根据集成电路和/或插座的顶表面进行成形。 在其他实施例中，金属块的底表面的周边部分与相关联的印刷电路板之间的间隙可由一层泡沫填充以减少集成电路产生的听觉信号。

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