公开(公告)号：US11821115B2

公开(公告)日：2023-11-21

申请号：US16985042

申请日：2020-08-04

Applicant: Apple Inc.

Inventor： Benjamin J. Grena ,  Didio V. Gomes ,  Joshua A. Hoover ,  Seul Bi Kim ,  David M. Kindlon ,  Kevin T. Pham ,  Daniel A. Podhajny ,  Robert J. Rose ,  Andrew L. Rosenberg ,  Miikka O. Tikander

IPC: D03D7/00 ,  D03D1/00 ,  B32B5/02 ,  B32B3/08 ,  D03D11/00 ,  D03D17/00 ,  H01B7/06 ,  D03D15/56

CPC classification number: D03D1/0088 ,  B32B3/08 ,  B32B5/02 ,  B32B5/024 ,  D03D7/00 ,  D03D11/00 ,  D03D15/56 ,  D03D17/00 ,  H01B7/06 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2262/02 ,  B32B2262/0276 ,  B32B2262/103 ,  B32B2307/202 ,  B32B2457/00 ,  D10B2331/04 ,  D10B2331/06 ,  D10B2331/12

Abstract: A stretchable fabric signal path may include a conductive strand located between first and second outer fabric layers. The outer fabric layers may be formed from intertwined strands of elastic material. The conductive strand may have a wavy shape to accommodate stretching of the stretchable fabric signal path. First and second inner fabric layers may be located between the outer stretchable fabric layers. The inner fabric layers may be formed from intertwined strands of non-elastic material. The inner fabric layers may have strands that are intertwined with the outer fabric layers to serve as anchor points for maintaining the shape of the conductive strand as the stretchable fabric signal path expands and contracts. The outer fabric layers and inner fabric layers may be woven. The conductive strand may convey electrical signals such as audio signals, power signals, data signals, or other suitable signals.

公开(公告)号：US20220095030A1

公开(公告)日：2022-03-24

申请号：US17405914

申请日：2021-08-18

Applicant: Apple Inc.

Inventor： Jacob A. Pfitsch ,  Onur I. Ilkorur ,  Esge B. Andersen ,  Miikka O. Tikander

IPC: H04R1/10 ,  H04R1/28

Abstract: A headphone comprising: two headphone earcups each comprising: an earcup housing defining an active chamber that acoustically couples a sound output side of a speaker to an ear of a user, and an inactive chamber that surrounds the active chamber; and a passive valve assembly configured to open in response to a positive pressure and a negative pressure within the active chamber to fluidly couple the active chamber to the inactive chamber and equalize a pressure between the active chamber and the inactive chamber.

公开(公告)号：US11277679B1

公开(公告)日：2022-03-15

申请号：US17023246

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Jarrett B. Lagler ,  Michael B. Minerbi ,  Miikka O. Tikander ,  Lee M. Panecki ,  Trang Fisher ,  Esge Andersen ,  Eugene Whang ,  Ben Shaffer ,  Edward Siahaan ,  Daniel R. Bloom ,  Kitty Yung ,  Tyler A. Green ,  Krithika Elangovan ,  Sarah Gysbers ,  Michael Burello ,  Matthew Zaverl ,  Christopher A. Sandieson ,  Casey L. Baran

IPC: H04R1/10

Abstract: A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.

公开(公告)号：US11259107B2

公开(公告)日：2022-02-22

申请号：US16878561

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Mike B. Minerbi ,  Edward Siahaan ,  Benjamin A. Shaffer ,  Eugene A. Whang ,  Miikka O. Tikander ,  Derek W. Wright ,  Jared M. Kole ,  Esge B. Andersen ,  Daniel R. Bloom ,  Edwin J. Corona Aparicio ,  Timon A. Wright

IPC: H04R5/04 ,  H04R1/10 ,  H04R5/033 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US10959024B2

公开(公告)日：2021-03-23

申请号：US16144813

申请日：2018-09-27

Applicant: Apple Inc.

Inventor： Onur I Ilkorur ,  Miikka O. Tikander ,  Christopher Wilk ,  Bonnie W. Tom

IPC: H04R9/02 ,  H04R9/06 ,  H04R7/16

Abstract: A planar magnetic driver including a radiating surface having a trace-free central region is described. The driver has a magnet defining an acoustic opening on a central axis. A diaphragm of the planar magnetic driver is held by mounts having a mounting profile around the central axis, and the diaphragm includes a radiating surface facing the acoustic opening. An innermost conductive trace on the diaphragm extends around a central region of the radiating surface within a magnetic flux of the magnet such that no conductive traces are on the central region. A radial distance between the innermost conductive trace and the mounting profile is less than another radial distance between the innermost conductive trace and the central axis. Accordingly, an excursion range of the diaphragm along the central axis is greater than a gap distance between the conductive trace and the magnet. Other aspects are also described and claimed.

公开(公告)号：US10771876B1

公开(公告)日：2020-09-08

申请号：US16126290

申请日：2018-09-10

Applicant: Apple Inc.

Inventor： Miikka O. Tikander ,  Yacine Azmi ,  Derek W. Wright

IPC: H04R25/00 ,  H04R1/10 ,  H04R1/28

Abstract: Headphones are disclosed that include a first earcup assembly and a second earcup assembly. The headphones include a headband extending between the first and second earcup assemblies. The headband includes opposing ends attached to the first and second earcup assemblies, respectively. The first earcup assembly includes a first cushion coupled to an earcup. The first cushion includes a first portion that is acoustically open. The first cushion also includes a second portion acoustically sealed from the first portion.

公开(公告)号：US20180091883A1

公开(公告)日：2018-03-29

申请号：US15275084

申请日：2016-09-23

Applicant: Apple Inc.

Inventor： Michael B. Howes ,  Miikka O. Tikander

IPC: H04R1/10 ,  G10K11/178 ,  H04R3/00

CPC classification number: H04R1/1008 ,  G10K11/178 ,  G10K11/1787 ,  G10K2210/1081 ,  G10K2210/1082 ,  H04R1/1075 ,  H04R1/1083 ,  H04R3/005 ,  H04R2410/05 ,  H04R2460/11

Abstract: A headphone including a circumaural or supra-aural ear cup having an ear cup housing wall which forms an interior chamber within the ear cup. A transducer is positioned within the interior chamber for producing an acoustic output to a user and an active noise control assembly positioned within the interior chamber. The active noise control assembly including a reference microphone, the reference microphone is acoustically coupled to a plurality of reference input ports spaced around the ear cup housing wall such that a sound input from each of the different spacial locations around the ear cup housing wall is received by the reference microphone and acoustically summed to provide a reference audio signal indicative of the sound input at the different spacial locations. The headphone further including a processing circuit operable to generate an anti-noise signal from the reference audio signal.