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公开(公告)号:US10072815B2
公开(公告)日:2018-09-11
申请号:US15190211
申请日:2016-06-23
Applicant: Apple Inc.
Inventor: Neil MacKinnon , Weiping Li , Xiaofeng Fan
IPC: F21V3/04 , H01S5/00 , H01S5/42 , H01S5/183 , F21Y115/30
CPC classification number: F21V3/049 , F21Y2115/30 , H01S5/005 , H01S5/18386 , H01S5/18388 , H01S5/18391 , H01S5/423
Abstract: A radiation source includes a semiconductor substrate, an array of vertical-cavity surface-emitting lasers (VCSELs) formed on the substrate, which are configured to emit optical radiation, and a transparent crystalline layer formed over the array of VCSELs. The transparent crystalline layer has an outer surface configured to diffuse the radiation emitted by the VCSELs.
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公开(公告)号:US09819144B2
公开(公告)日:2017-11-14
申请号:US15019981
申请日:2016-02-10
Applicant: Apple Inc.
Inventor: Chin Han Lin , Kevin A. Sawyer , Neil MacKinnon , Venkataram R. Raju , Weiping Li , Xiaofeng Fan
CPC classification number: H01S5/02469 , H01S5/0042 , H01S5/0217 , H01S5/0224 , H01S5/423
Abstract: A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.
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公开(公告)号:US11683455B2
公开(公告)日:2023-06-20
申请号:US17163104
申请日:2021-01-29
Applicant: Apple Inc.
Inventor: Neil MacKinnon
IPC: H04N7/22 , H04B10/80 , H01S5/42 , H04N23/54 , H04N23/55 , H04N23/60 , H04N23/68 , H04N25/709 , H01S5/02 , H01S5/343 , H04N7/015 , H04B10/112 , H04B10/25
CPC classification number: H04N7/22 , H01S5/021 , H01S5/343 , H01S5/423 , H04B10/801 , H04N7/015 , H04N23/54 , H04N23/55 , H04N23/665 , H04N23/687 , H04N23/6811 , H04N25/709 , H04B10/1121 , H04B10/25 , H04B10/807
Abstract: A mobile device includes an image sensor separated from a processing component by an open space. The image sensor includes one or more light source modules and the processing component includes one or more light sensors aligned with the one or more light source modules. Image data from the image sensor may be transmitted to the processing component via light signals exchanged between the one or more light source modules and the one or more light sensors. In some embodiments, light signals transmitted between one or more light source modules of an image sensor and one or more light sensors of the processing component are used to determine positional and angular data about the image sensor.
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公开(公告)号:US10908383B1
公开(公告)日:2021-02-02
申请号:US16180048
申请日:2018-11-05
Applicant: APPLE INC.
Inventor: Neil MacKinnon
IPC: G02B7/09 , G02F1/29 , G02B27/00 , H04N13/254
Abstract: Optoelectronic apparatus includes a projector, which includes an array of first emitters, which emit respective first beams of optical radiation at a first wavelength, and a second emitter, which emits a second beam of optical radiation at a second wavelength. Projection optics receive the first and second beams of the optical radiation through an entrance face and project the beams through the exit face. An optical window transmits the radiation at the first wavelength and reflects the radiation at the second wavelength, and is positioned adjacent to the exit face of the projection optics so as to reflect the second beam back through the projection optics toward an optical sensor positioned in proximity to the first and second emitters. A controller drives an actuator to adjust a focal setting of the projection optics responsively to a distribution of the optical radiation received and sensed by the optical sensor.
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公开(公告)号:US20190372700A1
公开(公告)日:2019-12-05
申请号:US16544972
申请日:2019-08-20
Applicant: Apple Inc.
Inventor: Neil MacKinnon
Abstract: An optoelectronic apparatus includes an array of emitters configured to emit respective beams of optical radiation. Projection optics include first cylindrical lenses, which have respective, mutually-parallel first cylinder axes, and are aligned respectively with the emitters in the array so as to receive and project the respective beams, and a second cylindrical lens, which has a second cylinder axis perpendicular to the first cylinder axes and is positioned adjacent to the first cylindrical lenses so as to receive and project all of the beams from the first cylindrical lenses.
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公开(公告)号:US10295145B2
公开(公告)日:2019-05-21
申请号:US16055104
申请日:2018-08-05
Applicant: APPLE INC.
Inventor: Neil MacKinnon , Weiping Li , Xiaofeng Fan
Abstract: A radiation source includes a semiconductor substrate, an array of vertical-cavity surface-emitting lasers (VCSELs) formed on the substrate, which are configured to emit optical radiation, and a transparent crystalline layer formed over the array of VCSELs. The transparent crystalline layer has an outer surface configured to diffuse the radiation emitted by the VCSELs.
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公开(公告)号:US20160336717A1
公开(公告)日:2016-11-17
申请号:US15019981
申请日:2016-02-10
Applicant: Apple Inc.
Inventor: Chin Han Lin , Kevin A. Sawyer , Neil MacKinnon , Venkataram R. Raju , Weiping Li , Xiaofeng Fan
CPC classification number: H01S5/02469 , H01S5/0042 , H01S5/0217 , H01S5/0224 , H01S5/423
Abstract: A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.
Abstract translation: 制造光电器件的方法包括在半导体衬底上制造多个垂直发射极。 发射器的各个顶表面被结合到散热器,之后半导体衬底在发射器的相应底表面之下移除。 阳极和阴极触点均附接到底表面,以便驱动发射器从底表面发光。 在另一个实施例中,将半导体衬底的上表面接合到具有与发射器的各个顶表面对准的通孔的载体衬底上,然后在发射器的相应底表面之下移除半导体衬底,并且分别 发射器的底表面结合到散热器。
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公开(公告)号:US11762066B2
公开(公告)日:2023-09-19
申请号:US17954397
申请日:2022-09-28
Applicant: Apple Inc.
Inventor: David S. Gere , Brad V. Johnson , Neil MacKinnon , Scott T. Smith , Seyedeh Nasim Habibi
CPC classification number: G01S7/4817 , G01S7/4815 , G01S17/08 , G01S17/89 , G02B26/0816 , G02B26/0875 , G02B26/101 , G02B26/123 , G02B26/124 , G02B26/125 , G02B27/0922 , G02B27/0944
Abstract: Optical apparatus includes a projector, which is configured to direct a pattern of one or more stripes, extending along a longitudinal dimension across a target. A receiver includes an array of optical sensors, and objective optics, which are configured to image the target onto the array, and which have a non-circular aperture, which is elongated in a direction dependent upon the longitudinal dimension of the stripes.
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公开(公告)号:US11493606B1
公开(公告)日:2022-11-08
申请号:US16537581
申请日:2019-08-11
Applicant: Apple Inc.
Inventor: David S. Gere , Brad V. Johnson , Neil MacKinnon , Scott T. Smith , Seyedeh Nasim Habibi
Abstract: Optical apparatus includes a plurality of emitters arranged in a row and configured to emit respective beams of optical radiation. Projection optics, which are configured to project the beams toward a target, include first cylindrical lenses, which have respective, mutually-parallel first cylinder axes and are aligned respectively with the emitters in the row so as to receive and focus the respective beams in a first dimension, and a second cylindrical lens, which has a second cylinder axis perpendicular to the first cylinder axes and is positioned to receive and focus all of the beams in a second dimension, perpendicular to the first dimension. A scan driver is configured to shift the second cylindrical lens in a direction perpendicular to the second cylinder axis so as to scan the beams across the target.
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公开(公告)号:US10686548B2
公开(公告)日:2020-06-16
申请号:US16544972
申请日:2019-08-20
Applicant: Apple Inc.
Inventor: Neil MacKinnon
Abstract: An optoelectronic apparatus includes an array of emitters configured to emit respective beams of optical radiation. Projection optics include first cylindrical lenses, which have respective, mutually-parallel first cylinder axes, and are aligned respectively with the emitters in the array so as to receive and project the respective beams, and a second cylindrical lens, which has a second cylinder axis perpendicular to the first cylinder axes and is positioned adjacent to the first cylindrical lenses so as to receive and project all of the beams from the first cylindrical lenses.
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