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公开(公告)号：US20240096715A1
公开(公告)日：2024-03-21
申请号：US18520369
申请日：2023-11-27
Applicant: APPLIED MATERIALS, INC.
Inventor： Keith Berding , Blake Erickson , Soumendra Barman , Zhaozhao Zhu
IPC: H01L21/66 , H01J37/32 , H01L21/3213
CPC classification number: H01L22/26 , H01J37/32963 , H01L21/32136 , H01L21/32139 , H01J2237/334
Abstract: An article includes a device, a first layer deposited on a surface of the device, and a second layer deposited on the first layer. The first layer includes a first sense material deposited on a first portion of the surface and a second sense material deposited on a second portion of the surface. The second layer includes a first etch material deposited on the first sense material and a second etch material deposited on the second sense material. Responsive to the second layer being etched during an etch process performed at a processing chamber of an electronics processing system, at least one of the first sense material or the second sense material can be detected at the surface of the device.
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公开(公告)号：US20230258500A1
公开(公告)日：2023-08-17
申请号：US18138914
申请日：2023-04-25
Applicant: Applied Materials, Inc.
Inventor： Blake Erickson , Keith Berding , Michael Kutney , Zhaozhao Zhu , Tsung Feng Wu , Michael D. Willwerth , Jeffrey Ludwig
CPC classification number: G01J3/32 , G01J3/0291 , G01N21/255 , G01N21/68 , G01N21/9501
Abstract: An apparatus includes a base component and a plurality of collimators housed within the base component. Each collimator of the plurality of collimators corresponds to a respective location of a plurality of locations of a wafer in an etch chamber. The plurality of locations includes a center location of the wafer, a plurality of inner ring locations along an inner ring of the wafer associated with a first set of radially symmetric optical emission spectroscopy (OES) signal sampling paths, and a plurality of outer ring locations along an outer ring of the wafer associated with a second set of radially symmetric OES signal sampling paths.
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公开(公告)号：US11668602B2
公开(公告)日：2023-06-06
申请号：US17234940
申请日：2021-04-20
Applicant: Applied Materials, Inc.
Inventor： Blake Erickson , Keith Berding , Michael Kutney , Zhaozhao Zhu , Tsung Feng Wu , Michael D. Willwerth , Jeffrey Ludwig
CPC classification number: G01J3/32 , G01J3/0291 , G01N21/255 , G01N21/68 , G01N21/9501
Abstract: An apparatus includes a base component and collimators housed within the base component. The collimators correspond to collection cylinders for sampling optical emission spectroscopy (OES) signals with respect to locations of a wafer in an etch chamber. The apparatus further includes a guide, operatively coupled to the plurality of collimators, to guide the sampling of the OES signals along paths for sampling the OES signals.
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公开(公告)号：USD977504S1
公开(公告)日：2023-02-07
申请号：US29743600
申请日：2020-07-22
Applicant: APPLIED MATERIALS, INC.
Designer： Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
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公开(公告)号：US20220349833A1
公开(公告)日：2022-11-03
申请号：US17242569
申请日：2021-04-28
Applicant: Applied Materials, Inc.
Inventor： Blake Erickson , Keith Berding , Michael Kutney , Soumendra Barman , Zhaozhao Zhu , Michelle SanPedro , Suresh Polali Narayana Rao
Abstract: A system includes a memory and at least one processing device operatively coupled to the memory to facilitate an etch recipe development process by performing a number of operations. The operations include receiving a request to initiate an iteration of an etch process using an etch recipe to etch a plurality of materials each located at a respective one of a plurality of reflectometry measurement points, obtaining material thickness data for each of the plurality of materials resulting from the iteration of the etch process, and determining one or more etch parameters based on the material thickness data.
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Patent Agency Ranking
公开(公告)号：US20220086364A1
公开(公告)日：2022-03-17
申请号：US17021992
申请日：2020-09-15
Applicant: Applied Materials, Inc.
Inventor： Upendra Ummethala , Philip Kraus , Keith Berding , Blake Erickson , Patrick Tae , Devendra Channappa Holeyannavar , Shivaraj Manjunath Nara , Anandakumar Parameshwarappa , Sivasankar Nagarajan , Dhirendra Kumar
Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.
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公开(公告)号：US20220028716A1
公开(公告)日：2022-01-27
申请号：US17379677
申请日：2021-07-19
Applicant: APPLIED MATERIALS, INC.
Inventor： Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
Abstract: A method for a substrate measurement subsystem is provided. An indication is received that a substrate being processed at a manufacturing system has been loaded into a substrate measurement subsystem. First positional data of the substrate within the substrate measurement subsystem is determined. One or more portions of the substrate to be measured by one or more sensing components of the substrate measurement subsystem are determined based on the first positional data of the substrate and a process recipe for the substrate. Measurements of each of the determined portions of the substrate are obtained by one or more sensing components of the substrate measurement subsystem. The obtained measurements of each of the determined portions of the substrate are transmitted to a system controller.
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公开(公告)号：US12283503B2
公开(公告)日：2025-04-22
申请号：US17379677
申请日：2021-07-19
Applicant: APPLIED MATERIALS, INC.
Inventor： Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
Abstract: A method for a substrate measurement subsystem is provided. An indication is received that a substrate being processed at a manufacturing system has been loaded into a substrate measurement subsystem. First positional data of the substrate within the substrate measurement subsystem is determined. One or more portions of the substrate to be measured by one or more sensing components of the substrate measurement subsystem are determined based on the first positional data of the substrate and a process recipe for the substrate. Measurements of each of the determined portions of the substrate are obtained by one or more sensing components of the substrate measurement subsystem. The obtained measurements of each of the determined portions of the substrate are transmitted to a system controller.
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公开(公告)号：US11927543B2
公开(公告)日：2024-03-12
申请号：US18101869
申请日：2023-01-26
Applicant: Applied Materials, Inc.
Inventor： Blake Erickson , Keith Berding , Michael Kutney , Soumendra Barman , Zhaozhao Zhu , Michelle SanPedro , Suresh Polali Narayana Rao
CPC classification number: G01N21/9501 , G01B11/0616 , G01N21/211
Abstract: A system includes a memory, and at least one processing device, operatively coupled to the memory, to facilitate an etch recipe development process by performing operations including obtaining, from an optical detector, first material thickness data for a first material and second material thickness data for a second material resulting from an iteration of an etch process using an etch recipe. The first material is located at a first reflectometry measurement point and the second material is located at a second reflectometry measurement point different from the first reflectometry measurement point. The operations further include determining one or more etch parameters based on at least the first material thickness data and the second material thickness data.
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公开(公告)号：US11830779B2
公开(公告)日：2023-11-28
申请号：US17398822
申请日：2021-08-10
Applicant: APPLIED MATERIALS, INC.
Inventor： Keith Berding , Blake Erickson , Soumendra Barman , Zhaozhao Zhu
IPC: H01L21/66 , H01L21/3213 , H01J37/32
CPC classification number: H01L22/26 , H01J37/32963 , H01L21/32136 , H01L21/32139 , H01J2237/334
Abstract: An article, apparatus, and method for detecting an etch material selectivity is provided. A device including a first layer and a second layer is placed in a processing chamber. The first layer includes a first sense material deposited on a first portion of the device and a second sense material deposited on a second portion of the device. The second layer deposited on the first layer includes an etch material. During an etch process based on an initial set of etch parameter settings, a first amount of time to etch the second layer at the first portion of the device and a second amount of time to etch the second layer at the second portion of the device are measured. A first etch rate and a second etch rate of the processing chamber is determined based on the measured first amount of time, the measured second amount of time, and a thickness of the second layer. A first selectivity of the first etch material and a second selectivity of the second etch material is determined based on the first etch rate and the second etch rate. An optimized set of etch parameter settings for subsequent etch processes is determined based on the determined selectivities.
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