Abstract:
A lithographic apparatus is disclosed that includes a projection system configured to project a patterned radiation beam onto a target portion of a substrate, a vacuum chamber through which the patterned beam of radiation is projected during use, and a purge system configured to provide a purge gas flow in the chamber.
Abstract:
A laser radiation source for a lithographic tool comprising a laser module to emit a first laser beam having a first wavelength and a second laser beam having a second wavelength, a beam separation device to separate the optical paths of the first and second laser beams and substantially recombine the optical paths, a beam delivery system to direct the first and second laser beams to a fuel target and an optical isolation apparatus to: adjust the polarization state of the first laser beam, adjust the polarization state of the second laser beam and to block radiation having the adjusted polarization states such that the reflection of the first laser beam and the reflection of the second laser beam are substantially blocked from propagating towards the laser module.
Abstract:
A source-collector device is constructed and arranged to generate a radiation beam, The device includes a target unit constructed and arranged to present a target surface of plasma-forming material; a laser unit constructed and arranged to generate a beam of radiation directed onto the target surface so as to form a plasma from said plasma-forming material; a contaminant trap constructed and arranged to reduce propagation of particulate contaminants generated by the plasma; a radiation collector comprising a plurality of grazing-incidence reflectors arranged to collect radiation emitted by the plasma and form a beam therefrom; and a filter constructed and arranged to attenuate at least one wavelength range of the beam.
Abstract:
A component of a lithographic apparatus, the component having a contaminant trap surface provided with recesses configured to trap contaminant particles and to reduce specular reflection of DUV radiation. The recesses can have at least one dimension less than or equal to about 2 μm, desirably less than 1 μm.
Abstract:
Degradation of the reflectivity of one or more reflective optical elements in a system (SO) for generating EUV radiation is reduced by the controlled introduction of a gas into a vacuum chamber (26) containing the optical element. The gas may be added to the flow of another gas such as hydrogen or alternated with the introduction of hydrogen radicals.
Abstract:
A lithographic apparatus for patterning a beam of radiation and projecting it onto a substrate, comprising at least two spectral purity filters configured to reduce the intensity of radiation in the beam of radiation in at least one undesirable range of radiation wavelength, wherein the two spectral purity filters are provided with different radiation filtering structures from each other.
Abstract:
A lithographic apparatus for patterning a beam of radiation and projecting it onto a substrate, comprising at least two spectral purity filters configured to reduce the intensity of radiation in the beam of radiation in at least one undesirable range of radiation wavelength, wherein the two spectral purity filters are provided with different radiation filtering structures from each other.
Abstract:
A source-collector device includes a target unit having a target surface of plasma-forming material and a laser unit to generate a beam of radiation directed onto the target surface to form a plasma from said plasma-forming material. A contaminant trap is provided to reduce propagation of particulate contaminants generated by the plasma. A radiation collector includes a one or more grazing-incidence reflectors arranged to collect radiation emitted by the plasma and form a beam therefrom, and a filter is configured to attenuate at least one wavelength range of the beam.
Abstract:
A radiation source is configured to produce extreme ultraviolet radiation. The radiation source includes a chamber in which, in use, a plasma is generated, and an evaporation surface configured to evaporate a material formed as a by-product from the plasma and that is emitted to the evaporation surface. A method for removing a by-product material in or from a plasma radiation source of a lithographic apparatus includes evaporating a material which, in use, is emitted to that surface from the plasma.
Abstract:
The invention is directed to a method for at least partially removing a contamination layer (15) from an optical surface (14a) of an EUV-reflective optical element (14) by bringing a cleaning gas into contact with the contamination layer. In the method, a jet (20) of cleaning gas is directed to the contamination layer (15) for removing material from the contamination layer (15). The contamination layer (15) is monitored for generating a signal indicative of the thickness of the contamination layer (15) and the jet (20) of cleaning gas is controlled by moving the jet (20) of cleaning gas relative to the optical surface (14a) using this signal as a feedback signal. A cleaning arrangement (19 to 24) for carrying out the method is also disclosed. The invention also relates to a method for generating a jet (20) of cleaning gas and to a corresponding cleaning gas generation arrangement.