Optical arrangement, in particular projection exposure apparatus for EUV lithography, as well as reflective optical element with reduced contamination
    1.
    发明授权
    Optical arrangement, in particular projection exposure apparatus for EUV lithography, as well as reflective optical element with reduced contamination 有权
    光学布置,特别是用于EUV光刻的投影曝光装置,以及具有减少的污染的反射光学元件

    公开(公告)号:US08585224B2

    公开(公告)日:2013-11-19

    申请号:US13763709

    申请日:2013-02-10

    Abstract: An optical arrangement, e.g. a projection exposure apparatus (1) for EUV lithography, includes: a housing (2) enclosing an interior space (15); at least one, preferably reflective optical element (4-10, 12, 14.1-14.6) arranged in the housing (2); at least one vacuum generating unit (3) for the interior space (15) of the housing (2); and at least one vacuum housing (18, 18.1-18.10) arranged in the interior space (15) and enclosing at least the optical surface (17, 17.1, 17.2) of the optical element (4-10, 12, 14.1-14.5). A contamination reduction unit is associated with the vacuum housing (18.1-18.10) and reduces the partial pressure of contaminating substances, in particular of water and/or hydrocarbons, at least in close proximity to the optical surface (17, 17.1, 17.2) in relation to the partial pressure of the contaminating substances in the interior space (15).

    Abstract translation: 光学装置,例如 用于EUV光刻的投影曝光装置(1)包括:封闭内部空间(15)的壳体(2); 布置在壳体(2)中的至少一个优选反射光学元件(4-10,12,14.1-14.6); 至少一个用于所述壳体(2)的内部空间(15)的真空发生单元(3); 以及布置在所述内部空间(15)中并且至少包围所述光学元件(4-10,12,14.1-14.5)的光学表面(17,17.1,17.2)的至少一个真空壳体(18,18.1-18.10) 。 污染减少单元与真空壳体(18.1-18.10)相关联,并且至少紧邻光学表面(17,17.1,17.2)处的污染物质特别是水和/或烃的分压降低 与内部空间(15)中的污染物质的分压有关。

    Method for removing a contamination layer from an optical surface and arrangement therefor
    5.
    发明授权
    Method for removing a contamination layer from an optical surface and arrangement therefor 有权
    从光学表面去除污染层的方法及其装置

    公开(公告)号:US08980009B2

    公开(公告)日:2015-03-17

    申请号:US13788790

    申请日:2013-03-07

    CPC classification number: B08B5/02 B08B7/00 G03F7/70925

    Abstract: The invention is directed to a method for at least partially removing a contamination layer (15) from an optical surface (14a) of an EUV-reflective optical element (14) by bringing a cleaning gas into contact with the contamination layer. In the method, a jet (20) of cleaning gas is directed to the contamination layer (15) for removing material from the contamination layer (15). The contamination layer (15) is monitored for generating a signal indicative of the thickness of the contamination layer (15) and the jet (20) of cleaning gas is controlled by moving the jet (20) of cleaning gas relative to the optical surface (14a) using this signal as a feedback signal. A cleaning arrangement (19 to 24) for carrying out the method is also disclosed. The invention also relates to a method for generating a jet (20) of cleaning gas and to a corresponding cleaning gas generation arrangement.

    Abstract translation: 本发明涉及通过使清洁气体与污染层接触来至少部分地从EUV反射型光学元件(14)的光学表面(14a)去除污染物层(15)的方法。 在该方法中,将清洁气体的喷嘴(20)引导到污染层(15),以从污染层(15)去除材料。 监测污染层(15)以产生指示污染层(15)的厚度的信号,并且通过相对于光学表面移动清洁气体的喷嘴(20)来控制清洁气体的喷射(20) 14a)使用该信号作为反馈信号。 还公开了一种用于执行该方法的清洁装置(19至24)。 本发明还涉及一种用于产生清洁气体的喷嘴(20)和相应的清洁气体产生装置的方法。

    A LITHOGRAPHIC APPARATUS
    9.
    发明申请

    公开(公告)号:US20220342315A1

    公开(公告)日:2022-10-27

    申请号:US17621472

    申请日:2020-06-05

    Abstract: A lithographic apparatus comprising: a clamping surface for supporting a substrate, wherein a property of the clamping surface is defined by at least one clamping surface parameter, and wherein the property of the clamping surface has been selected to exhibit low wear; a clamping apparatus for actuating a clamping operation between the clamping surface and the substrate, wherein the clamping operation is defined at least in part by at least one interface characteristic between the clamping surface and the substrate; and a processing station, operable to apply an adjustment to a first property of the substrate to optimize at least one interface characteristic of a particular clamping operation in dependence on the clamping surface parameter and at least one substrate surface parameter which defines a second property of the substrate.

Patent Agency Ranking