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公开(公告)号：US20170092412A1
公开(公告)日：2017-03-30
申请号：US14866852
申请日：2015-09-26
申请人： Mathew J. Manusharow , Yonggang Li , William J. Lambert , Krishna Bharath , Adel A. Elsherbini , Feras Eid , Aleksandar Aleksov , Henning Braunisch
发明人： Mathew J. Manusharow , Yonggang Li , William J. Lambert , Krishna Bharath , Adel A. Elsherbini , Feras Eid , Aleksandar Aleksov , Henning Braunisch
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/24 , H01F41/041 , H01F41/042 , H01F2017/0073 , H01F2017/0086 , H01F2027/2809 , H01L21/486 , H01L23/49838 , H01L28/10 , H01L2224/16227
摘要： Embodiments of the invention include inductors integrated into a package substrate that have increased thicknesses due to the use of shaped vias, and methods of forming such packages. In an embodiment of the invention an inductor may be formed in a package substrate may include a first inductor line formed on the package substrate. In some embodiments, a shaped via may be formed over the first inductor line. Additional embodiments may include a dielectric layer that is formed over the package substrate, the first inductor line and around the shaped via. In one embodiment, a second inductor line may also be formed over the shaped via. Some embodiments of the invention may include an inductor that is a spiral inductor.
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12.发明授权公开(公告)号：US09129817B2
公开(公告)日：2015-09-08
申请号：US13801623
申请日：2013-03-13
CPC分类号： H01L27/06 , H01F17/0006 , H01F2017/0066 , H01L23/64 , H01L25/16 , H01L27/016 , H01L28/10 , H01L28/40 , H01L2924/0002 , H01L2924/00
摘要： Semiconductor packages including magnetic core inductor (MCI) structures for integrated voltage regulators are described. In an example, a semiconductor package includes a package substrate and a semiconductor die coupled to a first surface of the package substrate. The semiconductor die has a first plurality of metal-insulator-metal (MIM) capacitor layers thereon. The semiconductor package also includes a magnetic core inductor (MCI) die coupled to a second surface of the package substrate. The MCI die includes one or more slotted inductors and has a second plurality of MIM capacitor layers thereon.
摘要翻译： 描述了包括集成稳压器的磁芯电感（MCI）结构的半导体封装。 在一个示例中，半导体封装包括封装衬底和耦合到封装衬底的第一表面的半导体管芯。 半导体管芯在其上具有第一多个金属 - 绝缘体 - 金属（MIM）电容器层。 半导体封装还包括耦合到封装衬底的第二表面的磁芯电感器（MCI）裸芯片。 MCI管芯包括一个或多个开槽电感器，并且其上具有第二多个MIM电容器层。
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公开(公告)号：US20190003882A1
公开(公告)日：2019-01-03
申请号：US15635881
申请日：2017-06-28
CPC分类号： G02B6/1221 , G02B6/4253 , H04B10/801 , H04B10/807 , H05K1/0274
摘要： Various embodiments disclosed relate to a stretchable packaging system. The system includes a first electronic component. The first electronic component includes a first optical emitter. The system further includes a second electronic component. The second electronic component includes a first receiver. An optical interconnect including a first elastomer having a first refractive index connects the first optical emitter to the first receiver. An encapsulate layer including a second elastomer having a second refractive index at least partially encapsulates the first electronic component, the second electronic component, and the optical interconnect.
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公开(公告)号：US20180026393A1
公开(公告)日：2018-01-25
申请号：US15215531
申请日：2016-07-20
申请人： Feras Eid , Sasha N. Oster , Adel A. Elsherbini , Aleksandar Aleksov , Johanna M. Swan , Amit Sudhir Baxi , Vincent S. Mageshkumar
发明人： Feras Eid , Sasha N. Oster , Adel A. Elsherbini , Aleksandar Aleksov , Johanna M. Swan , Amit Sudhir Baxi , Vincent S. Mageshkumar
IPC分类号： H01R13/62 , H01R13/631 , H01R13/627
CPC分类号： H01R13/6205 , H01R11/30 , H01R13/627 , H01R13/631
摘要： Discussed generally herein are methods and devices including or providing a magnetic, detachable, conductive connector to provide an electrical and mechanical connection between parts. A device can include a first substrate, at least one electric component on or at least partially in a first surface of the first substrate, an adhesive on the first surface of the first substrate to temporarily attached the device to skin of a user, a contact pad electrically coupled to an electric component of the at least one electric component, the contact pad on or at least partially in a second surface of the substrate, the first surface opposite the second surface, and a conductive magnetic connector electrically and mechanically connected to the contact pad through a first conductive adhesive.
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15.发明申请公开(公告)号：US20140264732A1
公开(公告)日：2014-09-18
申请号：US13801623
申请日：2013-03-13
IPC分类号： H01L27/06
CPC分类号： H01L27/06 , H01F17/0006 , H01F2017/0066 , H01L23/64 , H01L25/16 , H01L27/016 , H01L28/10 , H01L28/40 , H01L2924/0002 , H01L2924/00
摘要： Semiconductor packages including magnetic core inductor (MCI) structures for integrated voltage regulators are described. In an example, a semiconductor package includes a package substrate and a semiconductor die coupled to a first surface of the package substrate. The semiconductor die has a first plurality of metal-insulator-metal (MIM) capacitor layers thereon. The semiconductor package also includes a magnetic core inductor (MCI) die coupled to a second surface of the package substrate. The MCI die includes one or more slotted inductors and has a second plurality of MIM capacitor layers thereon.
摘要翻译： 描述了包括集成稳压器的磁芯电感（MCI）结构的半导体封装。 在一个示例中，半导体封装包括封装衬底和耦合到封装衬底的第一表面的半导体管芯。 半导体管芯在其上具有第一多个金属 - 绝缘体 - 金属（MIM）电容器层。 半导体封装还包括耦合到封装衬底的第二表面的磁芯电感器（MCI）裸芯片。 MCI管芯包括一个或多个开槽电感器，并且其上具有第二多个MIM电容器层。
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公开(公告)号：US20180308792A1
公开(公告)日：2018-10-25
申请号：US15762548
申请日：2015-09-25
IPC分类号： H01L23/498 , H01L21/48 , B23K26/06 , H01L21/768 , B23K26/36
摘要： Discussed generally herein are methods and devices for flexible fabrics or that otherwise include thin traces. A device can include a flexible polyimide material, and a first plurality of traces on the flexible polyimide material, wherein the first plurality of traces are patterned on the flexible polyimide material using laser spallation.
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公开(公告)号：US20180097268A1
公开(公告)日：2018-04-05
申请号：US15282050
申请日：2016-09-30
申请人： Sasha Oster , Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Teles Kamgaing , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
发明人： Sasha Oster , Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Teles Kamgaing , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
CPC分类号： H01P3/122 , H01P3/14 , H01P3/16 , H01P11/006
摘要： A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.
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18.发明申请SEMICONDUCTOR PACKAGE WITH AIR CORE INDUCTOR (ACI) AND MAGNETIC CORE INDUCTOR (MCI) 审中-公开具有空心电感器（ACI）和磁芯电感器（MCI）的半导体封装公开(公告)号：US20140217547A1
公开(公告)日：2014-08-07
申请号：US13997042
申请日：2012-03-29
IPC分类号： H01L49/02
CPC分类号： H01L28/10 , H01F2017/0086 , H01L23/645 , H01L25/16 , H01L2224/16225 , H05K1/165 , H05K1/18 , H05K2201/1003
摘要： Semiconductor die packaged with air core inductors (ACIs) and magnetic core inductors (MCIs), or with multiple MCIs, are described. In a first example, a semiconductor package includes a semiconductor die, one or more air core inductors (ACIs) coupled to the semiconductor die, and one or more magnetic core inductors (MCIs) coupled to the semiconductor die. In a second example, a semiconductor package includes a semiconductor die, a first magnetic core inductor (MCI) coupled to the semiconductor die and having a first saturation current, and a second MCI coupled to the semiconductor die and having a second, different, saturation current.
摘要翻译： 描述了与空心电感器（ACI）和磁芯电感器（MCI）或多个MCI封装的半导体管芯。 在第一示例中，半导体封装包括半导体管芯，耦合到半导体管芯的一个或多个空心电感器（ACI）以及耦合到半导体管芯的一个或多个磁芯电感器（MCI）。 在第二示例中，半导体封装包括半导体管芯，耦合到半导体管芯并具有第一饱和电流的第一磁芯电感器（MCI）和耦合到半导体管芯并具有第二不同饱和度的第二MCI 当前。
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