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公开(公告)号：US20230045587A1
公开(公告)日：2023-02-09
申请号：US17396596
申请日：2021-08-06
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jenchun CHEN , Chang-Fu LU
Abstract: An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier and an antenna element. The carrier includes a plurality of pads and has a surface exposing the pads. The antenna element is disposed above the pads. A lateral surface of one of the pads is farther from a central axis of the antenna element substantially perpendicular to the surface than from a lateral surface of the antenna element.
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公开(公告)号：US20230023398A1
公开(公告)日：2023-01-26
申请号：US17383270
申请日：2021-07-22
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jenchun CHEN , Shyue-Long LOUH
Abstract: An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier, an antenna portion, a first portion and a second portion. The antenna portion is located on the carrier. The first portion is located on the carrier. The second portion is located on the carrier and is configured for blocking a material from entering the antenna area, wherein the material covers a lateral surface of the carrier.
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公开(公告)号：US20180138148A1
公开(公告)日：2018-05-17
申请号：US15352527
申请日：2016-11-15
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jenchun CHEN
IPC: H01L25/065 , H01L23/552 , H01L23/31 , H01L25/10 , H01L21/56
CPC classification number: H01L25/0655 , H01L21/56 , H01L23/3121 , H01L23/3135 , H01L23/552 , H01L25/105
Abstract: A semiconductor device package comprises a substrate, a first component, a second component, a package body and a conductive material. The substrate has a surface. The first component is on the surface of the substrate. The second component is on the surface of the substrate. The package body comprises a first portion, a second portion and a third portion. The first portion encapsulates the first component and has a side surface. The second portion encapsulates the second component and has a side surface. The third portion connects the first portion and the second portion and has a top surface. The side surface of the first portion, the side surface of the second portion and the top surface of the third portion define a space separating the side surface of the first portion from the side surface of the second portion. The conductive material is disposed in the space.
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公开(公告)号：US20250048541A1
公开(公告)日：2025-02-06
申请号：US18923638
申请日：2024-10-22
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Wei-Jhen CIOU , Jenchun CHEN , Chang-Fu LU , Pai-Sheng SHIH
Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.
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公开(公告)号：US20240170829A1
公开(公告)日：2024-05-23
申请号：US18427788
申请日：2024-01-30
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jenchun CHEN , Ya-Wen LIAO
CPC classification number: H01Q1/2283 , H01L23/66 , H01Q1/40 , H01Q1/422 , H01Q9/0414 , H01Q21/065 , H01Q21/08 , H01L2223/6677 , H01L2223/6688
Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.
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Patent Agency Ranking
公开(公告)号：US20240120640A1
公开(公告)日：2024-04-11
申请号：US18544377
申请日：2023-12-18
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jenchun CHEN , Ya-Wen LIAO
CPC classification number: H01Q1/2283 , H01L23/66 , H01Q1/38 , H01L2223/6677
Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.
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公开(公告)号：US20220181182A1
公开(公告)日：2022-06-09
申请号：US17111328
申请日：2020-12-03
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jenchun CHEN , Kuo Kai HUANG
IPC: H01L21/683 , H01L21/673
Abstract: The present disclosure relates to an electronic component. The electronic component includes a first surface, a first functional region, and a non-functional region. The first functional region is disposed on the first surface of the electronic component. The non-functional region is recessed from the first surface of the electronic component.
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公开(公告)号：US20220068665A1
公开(公告)日：2022-03-03
申请号：US17002433
申请日：2020-08-25
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jenchun CHEN , An-Ping CHIEN
Abstract: The present disclosure relates to a method of manufacturing a semiconductor device package. The method includes: (a) disposing a support structure on a first substrate; (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure; (c) heating the semiconductor device package; and (d) removing the support structure.
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公开(公告)号：US20210233868A1
公开(公告)日：2021-07-29
申请号：US16774135
申请日：2020-01-28
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jenchun CHEN
Abstract: A semiconductor device package and method of manufacturing the same are provided. The semiconductor device package includes a substrate, a semiconductor die and a first encapsulant. The substrate includes a first surface, a second surface opposite to the first surface, and a first edge and a second edge connecting the first surface to the second surface. The first edge is shorter than the second edge. The semiconductor die is disposed on the first surface of the substrate. The first encapsulant is disposed on the first surface of the substrate and encapsulates the semiconductor die. The first encapsulant includes at least one first lock portion extending from the first surface to the second surface and penetrating through the substrate via the first edge.
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公开(公告)号：US20230268295A1
公开(公告)日：2023-08-24
申请号：US17676086
申请日：2022-02-18
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jenchun CHEN , Shyue-Long LOUH
IPC: H01L23/66 , H01Q1/22 , H01L23/552 , H01L23/498
CPC classification number: H01L23/66 , H01Q1/2283 , H01L23/552 , H01L23/49816 , H01Q1/38
Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a carrier having a first side and a second side adjacent to the first side. The semiconductor device also includes a first antenna adjacent to the first side and configured to operate at a first frequency and a second antenna adjacent to the second side and configured to operate at a second frequency different from the first frequency. An method of manufacturing a semiconductor device is also provided.
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