公开(公告)号：US20220084972A1

公开(公告)日：2022-03-17

申请号：US17534358

申请日：2021-11-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

IPC: H01L23/00

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US20210167016A1

公开(公告)日：2021-06-03

申请号：US16702213

申请日：2019-12-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Jr-Wei LIN

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/367 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00

Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.

公开(公告)号：US20210134751A1

公开(公告)日：2021-05-06

申请号：US16673699

申请日：2019-11-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

IPC: H01L23/00

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US20240302614A1

公开(公告)日：2024-09-12

申请号：US18664224

申请日：2024-05-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: G02B6/43 ,  G02B6/42

CPC classification number: G02B6/43 ,  G02B6/4227 ,  G02B6/4239

Abstract: An optoelectronic package and a method of manufacturing an optoelectronic package are provided. The optoelectronic package includes a carrier. The carrier includes a first region and a second region. The first region is configured to supply power to a processing unit disposed on the carrier. The second region is for accommodating at least one optoelectronic device electrically coupled to the processing unit.

公开(公告)号：US20240264369A1

公开(公告)日：2024-08-08

申请号：US18105704

申请日：2023-02-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Wen Chieh YANG

IPC: G02B6/12 ,  H01L25/18

CPC classification number: G02B6/12004 ,  H01L25/18 ,  H01L24/02 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/20 ,  H01L24/32 ,  H01L2224/02372 ,  H01L2224/02381 ,  H01L2224/06181 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/214 ,  H01L2224/32225

Abstract: An optoelectronic package includes a first photonic component, an optical connection element and an optical component. The optical connection element is disposed at least partially over the first photonic component. The optical component is disposed at least partially over the first photonic component. The optical connection element and the optical component are spaced apart from each other.

公开(公告)号：US20240250080A1

公开(公告)日：2024-07-25

申请号：US18603181

申请日：2024-03-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L25/167 ,  H01L23/5386 ,  H01L24/16 ,  H01L2224/16227

Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.

公开(公告)号：US20240219628A1

公开(公告)日：2024-07-04

申请号：US18092145

申请日：2022-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Sin-Yuan MU ,  Chia-Sheng CHENG

IPC: G02B6/12

CPC classification number: G02B6/12004

Abstract: An optical device is provided. The optical device includes a first photonic component; a first electronic component at least partially over the first photonic component; and an optical connection element at least partially over the first photonic component, the optical connection element being separated from the first electronic component.

公开(公告)号：US20240006396A1

公开(公告)日：2024-01-04

申请号：US17856893

申请日：2022-07-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/538 ,  H01L23/34 ,  H01L23/498 ,  H01L23/00 ,  G02B6/42

CPC classification number: H01L25/167 ,  H01L23/3107 ,  H01L23/5386 ,  H01L23/34 ,  H01L23/49811 ,  H01L24/73 ,  H01L24/16 ,  G02B6/4249 ,  G02B6/4268 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L23/5385

Abstract: An optical device is provided. The optical device includes a processing component, a first electronic component, a second electronic component, a first pillar, and an encapsulant. The first electronic component is disposed over and electrically connected to the processing component. The second electronic component is disposed over the processing component and electrically connected to the first electronic component. The first pillar is disposed between the first electronic component and the second electronic component and electrically connected to the processing component. The encapsulant is disposed over the processing component. The encapsulant encapsulates the first electronic component, the second electronic component, and the first pillar.

公开(公告)号：US20230122292A1

公开(公告)日：2023-04-20

申请号：US17506465

申请日：2021-10-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Jung Jui KANG

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/538

Abstract: An optoelectronic package includes an input/output (I/O) component, a photonic component, and an electronic component configured to modulate optical signals in the photonic component. The I/O component is electrically connected to the photonic component via the electronic component.

公开(公告)号：US20230121954A1

公开(公告)日：2023-04-20

申请号：US17503229

申请日：2021-10-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: H01S5/024 ,  H01S5/026

Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a heat source, a thermal conductive element, and a first optoelectronic component and a second optoelectronic component. The thermal conductive element is disposed over the heat source. The thermal conductive element defines a thermal conduction path P2 by which heat is transferred from the heat source to the thermal conductive element. The first optoelectronic component and the second optoelectronic component are arranged along an axis different from a thermal conduction path P2.