公开(公告)号：US20110103422A1

公开(公告)日：2011-05-05

申请号：US12835538

申请日：2010-07-13

申请人： Hideto FURUYAMA

发明人： Hideto FURUYAMA

IPC分类号： H01S3/03

CPC分类号： G02B6/12004 ,  H01S5/0028 ,  H01S5/0608 ,  H01S5/10 ,  H01S5/101 ,  H01S5/1025 ,  H01S5/1046 ,  H01S5/1203 ,  H01S5/20 ,  H01S5/4031 ,  H01S5/4056

摘要： A laser-induced optical wiring apparatus includes a substrate, first and second light-reflecting members provided on the substrate separately from each other, an optical waveguide provided on the substrate for optically coupling the first and second light-reflecting members to form an optical resonator, a first optical gain member provided across the optical waveguide and forming a laser oscillator along with the first and second light-reflecting members, and a second optical gain member provided across the optical waveguide separately from the first optical gain member, and forming another laser oscillator along with the first and second light-reflecting members.

摘要翻译： 激光诱导光线路装置包括：基板，分别设置在基板上的第一和第二光反射部件，设置在基板上的光波导，用于光耦合第一和第二光反射部件，以形成光谐振器 设置在所述光波导上并与所述第一和第二光反射部件一起形成激光振荡器的第一光学增益部件和与所述第一光学增益部件分开设置在所述光波导上的第二光学增益部件，以及形成另一激光器 振荡器以及第一和第二光反射部件。

公开(公告)号：US20100247030A1

公开(公告)日：2010-09-30

申请号：US12700116

申请日：2010-02-04

申请人： Hideto FURUYAMA

发明人： Hideto FURUYAMA

IPC分类号： G02B6/12 ,  G02B6/36 ,  H01L33/00

CPC分类号： G02B6/43 ,  G02B6/4214 ,  G02B6/4222 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1305 ,  H05K1/0274 ,  H05K1/117 ,  H05K2201/0112 ,  H01L2924/00 ,  H01L2224/0401

摘要： An optoelectronic wiring board includes an optical wiring, an electrical wiring, an optical input/output portion, a dummy optical input portion, and a dummy optical waveguide. The optical wiring includes an optical waveguide. The electrical wiring includes an electrically conductive material. The optical input/output portion transmits and detects optical signal with and from the optical waveguide, an optical semiconductor device or an external light guide being disposed on the optoelectronic wiring board. The dummy optical input portion provided adjacent to the optical input/output portion. The dummy optical waveguide is connected to the dummy optical input portion and has an optical end portion which is provided at an end opposite to the dummy optical input portion and absorbs or scatters light which is incident on the dummy optical input portion.

摘要翻译： 光电布线板包括光配线，电线，光输入/输出部，虚拟光输入部和虚拟光波导。 光学布线包括光波导。 电线包括导电材料。 光输入/输出部分发射和检测来自光波导的光信号，光学半导体器件或外部光导设置在光电布线板上。 设置在光输入/输出部分附近的虚设光输入部。 虚拟光波导连接到虚拟光输入部分，并且具有设置在与虚拟光输入部相对的端部处的光学端部，并且吸收或散射入射在虚拟光输入部分上的光。

公开(公告)号：US20100176410A1

公开(公告)日：2010-07-15

申请号：US12631956

申请日：2009-12-07

申请人： Hideto FURUYAMA

发明人： Hideto FURUYAMA

IPC分类号： H01L33/46 ,  H01L33/44

CPC分类号： H01L33/46 ,  H01L33/44 ,  H01L33/507 ,  H01L33/60 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/14 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A wiring electrode is provided on a mount substrate. A light emitting element is provided on the wiring electrode to connect electrically with the wiring electrode and is configured to emit a blue to ultraviolet light. A reflective film is provided above the light emitting element to cover the light emitting element so that a space is interposed between the reflective film and the light emitting element. The reflective film is capable of transmitting the blue to ultraviolet light. A fluorescent material layer is provided above the light emitting element to cover the light emitting element so that the reflective film is located between the fluorescent material layer and the light emitting element. A light from the fluorescent material layer is reflected by the reflective film.

摘要翻译： 布线电极设置在安装基板上。 发光元件设置在布线电极上，与布线电极电连接并且被配置为发射蓝色至紫外光。 在发光元件上方设置反射膜以覆盖发光元件，使得在反射膜和发光元件之间插入空间。 反射膜能够将蓝色透射到紫外光。 在发光元件上方设置荧光材料层以覆盖发光元件，使得反射膜位于荧光材料层和发光元件之间。 来自荧光材料层的光被反射膜反射。

公开(公告)号：US20090010593A1

公开(公告)日：2009-01-08

申请号：US12146771

申请日：2008-06-26

申请人： Hideto FURUYAMA

发明人： Hideto FURUYAMA

IPC分类号： G02B6/12

CPC分类号： G02B6/1226 ,  B82Y20/00 ,  G02B6/43 ,  H01L31/02325 ,  H01L31/101

摘要： A light receiving device includes a first receiving structure and a second receiving structure. The first receiving structure has a first concentric coupling periodic structure provided in a first surface of a conductive thin film formed on a substrate, a first opening located at a center of the first concentric coupling periodic structure, and a first light receiving section located at an opening end of the first opening. The second receiving structure has a second concentric coupling periodic structure provided in the first surface of the conductive thin film, a second opening located at a center of the second concentric coupling periodic structure, and a second light receiving section located at an opening end of the second opening. The second light receiving section is electrically isolated from the first light receiving section.

摘要翻译： 光接收装置包括第一接收结构和第二接收结构。 第一接收结构具有设置在形成于基板上的导电薄膜的第一表面中的第一同心耦合周期性结构，位于第一同心耦合周期性结构的中心的第一开口和位于第一同心耦合周期结构中心的第一光接收部分 第一个开口的开口端。 所述第二接收结构具有设置在所述导电薄膜的第一表面中的第二同心耦合周期性结构，位于所述第二同心耦合周期性结构的中心的第二开口，以及位于所述第二同心耦合周期结构的开口端的第二光接收部 第二次开幕 第二光接收部分与第一光接收部分电隔离。

公开(公告)号：US20090008734A1

公开(公告)日：2009-01-08

申请号：US12164502

申请日：2008-06-30

申请人： Hideto FURUYAMA

发明人： Hideto FURUYAMA

IPC分类号： H01L31/00

CPC分类号： H01L31/0203

摘要： A semiconductor light receiving device includes: a light receiving section made of a semiconductor provided on a substrate; a mask layer provided above the light receiving section and having an opening configured to limit an irradiation area of the light receiving section; and a light scattering section provided in at least part of a light incident path in the opening and including a transparent material and light scattering particles dispersed in the transparent material. Light incident on the light receiving section passes through the light scattering section before being incident on the light receiving section.

摘要翻译： 半导体光接收装置包括：由设置在基板上的半导体构成的受光部; 掩模层，设置在所述光接收部的上方，具有限制所述受光部的照射区域的开口部; 以及光散射部，其设置在所述开口部的光入射路径的至少一部分中，并且包括透明材料和分散在所述透明材料中的光散射粒子。 入射到光接收部分的光在入射到光接收部分之前穿过光散射部分。

公开(公告)号：US20080181561A1

公开(公告)日：2008-07-31

申请号：US11942238

申请日：2007-11-19

申请人： Hideto FURUYAMA

发明人： Hideto FURUYAMA

IPC分类号： G02B6/42

CPC分类号： G02B6/43 ,  G02B6/4214 ,  G02B6/4221 ,  H05K1/0269 ,  H05K1/0274 ,  H05K2203/163

摘要： An optoelectronic interconnection board on which an optical semiconductor device can be mounted, an optoelectronic interconnection apparatus using the optoelectronic interconnection board, and a manufacturing method thereof are disclosed. According to one aspect of the present invention, there is provided an optoelectronic interconnection board including optical interconnection lines having optical waveguides and electric interconnection lines formed of an electroconductive material, includes a main optical waveguide through which an optical signal is transmitted when an optical functional device is disposed on the optoelectronic interconnection board, a main optical input/output portion which transmits/receives the optical signal to/from the main optical waveguide, a monitoring optical input/output portion which is provided to align with the main optical input/output portion and transmits/receives light to/from the monitoring optical waveguide.

摘要翻译： 公开了一种其上可以安装光学半导体器件的光电互连板，使用该光电互连板的光电互连设备及其制造方法。 根据本发明的一个方面，提供了一种光电互连板，包括具有光波导的光互连线和由导电材料形成的电互连线，包括主光波导，当光功能器件 设置在光电互连板上，主光输入/输出部分，用于向/从主光波导发送/接收光信号;监视光输入/输出部分，设置成与主光输入/输出部分对准 并且向监控光波导发送/接收光。

公开(公告)号：US20110297991A1

公开(公告)日：2011-12-08

申请号：US13211854

申请日：2011-08-17

申请人： Hideto FURUYAMA

发明人： Hideto FURUYAMA

IPC分类号： H01L33/46

CPC分类号： H01L33/46 ,  H01L33/44 ,  H01L33/507 ,  H01L33/60 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/14 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A wiring electrode is provided on a mount substrate. A light emitting element is provided on the wiring electrode to connect electrically with the wiring electrode and is configured to emit a blue to ultraviolet light. A reflective film is provided above the light emitting element to cover the light emitting element so that a space is interposed between the reflective film and the light emitting element. The reflective film is capable of transmitting the blue to ultraviolet light. A fluorescent material layer is provided above the light emitting element to cover the light emitting element so that the reflective film is located between the fluorescent material layer and the light emitting element. A light from the fluorescent material layer is reflected by the reflective film.

摘要翻译： 布线电极设置在安装基板上。 发光元件设置在布线电极上，与布线电极电连接并且被配置为发射蓝色至紫外光。 在发光元件上方设置反射膜以覆盖发光元件，使得在反射膜和发光元件之间插入空间。 反射膜能够将蓝色透射到紫外光。 在发光元件上方设置荧光材料层以覆盖发光元件，使得反射膜位于荧光材料层和发光元件之间。 来自荧光材料层的光被反射膜反射。

公开(公告)号：US20100098129A1

公开(公告)日：2010-04-22

申请号：US12642428

申请日：2009-12-18

申请人： Hideto FURUYAMA

发明人： Hideto FURUYAMA

IPC分类号： H01S3/083

CPC分类号： H01S5/1071 ,  H01S5/0625 ,  H01S5/1032 ,  H01S5/2224 ,  H01S5/227

摘要： A laser-induced optical wiring apparatus is provided wherein optical wiring is realized by digital operations of a laser oscillator. The apparatus includes optical ring resonator formed of a loop-shaped optical waveguide on substrate. At least two optical gain sections are provided on the optical ring resonator. When each optical gain section is activated, a laser oscillator including the optical ring resonator and optical gain sections is enabled to oscillate. In this state, the gain of at least one of the optical gain sections is changed in accordance with an input signal, thereby changing the optical route gain of the optical ring resonator to change the oscillation state of the laser oscillator. A change in the laser oscillation state is detected by the optical gain section other than the at least one optical gain section, whereby an output signal is acquired.

摘要翻译： 提供一种激光诱导光线路装置，其中通过激光振荡器的数字操作实现光布线。 该装置包括由基板上的环形光波导形成的光环谐振器。 在光环谐振器上设置至少两个光增益部分。 当每个光学增益部分被激活时，包括光环谐振器和光学增益部分的激光振荡器能够振荡。 在这种状态下，根据输入信号改变至少一个光增益部分的增益，由此改变光环谐振器的光路增益以改变激光振荡器的振荡状态。 通过除了至少一个光学增益部分之外的光学增益部分检测激光振荡状态的变化，由此获取输出信号。

公开(公告)号：US20080303046A1

公开(公告)日：2008-12-11

申请号：US12133604

申请日：2008-06-05

申请人： Hideto FURUYAMA

发明人： Hideto FURUYAMA

IPC分类号： H01L33/00

CPC分类号： H01L33/24 ,  H01L27/15 ,  H01L33/34

摘要： A semiconductor light emitting device includes a silicon substrate, a p-type semiconductor layer provided on the silicon substrate, a n-type semiconductor layer provided on the silicon substrate, the n-type semiconductor layer adjoining the p-type semiconductor layer, and a light emitting section formed at a p-n homojunction between the p-type semiconductor layer and the n-type semiconductor layer. The p-n homojunction is substantially perpendicular to a major surface of the silicon substrate. The p-n homojunction is corrugated with a period matched with an integer multiple of an emission wavelength at the light emitting section.

摘要翻译： 半导体发光器件包括硅衬底，设置在硅衬底上的p型半导体层，设置在硅衬底上的n型半导体层，与p型半导体层相邻的n型半导体层，以及 在p型半导体层和n型半导体层之间的pn同相结合形成的发光部。 p-n同相基本上垂直于硅衬底的主表面。 p-n同质结是在发光部分具有发射波长的整数倍的周期匹配的波纹状的。

公开(公告)号：US20080192433A1

公开(公告)日：2008-08-14

申请号：US11779964

申请日：2007-07-19

申请人： Hideto FURUYAMA ,  Hiroshi Hamasaki

发明人： Hideto FURUYAMA ,  Hiroshi Hamasaki

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/367 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1305 ,  H01L2924/15311 ,  H01L2924/00

摘要： An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.

摘要翻译： 接口模块安装的LSI封装具有内置基板，其具有信号处理LSI，用于信号传输的接口模块，机械地连接到插入器并且电连接到信号处理LSI，以及与两个信号接触的散热器 处理LSI和接口模块，并辐射信号处理LSI和接口模块的热量。 LSI封装具有间隙，其作为用于信号处理LSI的散热部分和用于接口模块的散热部分之间的热电阻部分。