摘要:
A compact, low height, low cost, and high reliability surface acoustic wave device, and its method of manufacture. The surface acoustic wave device consists of a substrate, a comb-electrode disposed on the main surface of the substrate, plural electrode pads disposed around the comb-electrode, protecting means covering the comb-electrode through a closed space produced by combining the comb-electrode and the electrode pads with the substrate by using substantially covalent bonding force acting between conductive bumps formed on the electrode bumps, a conductive adhesive layer disposed at least on the top of the conductive bumps, and a package adhered on the conductive bumps by means of the conductive adhesive, and insulation adhesive filled into the package contacting the conductive adhesive, the conductive bumps, and the protective means.
摘要:
A surface acoustic wave filter is provided which performs balanced signal/unbalanced signal conversion. The input and output impedances are different from each other. In a surface acoustic wave filter of the longitudinal mode type, a signal is applied to two terminals of an input interdigital transducer, or a signal is output from two terminals of an output interdigital transducer, thereby consituting a balanced type filter. The aperture length of the input interdigital transducer is different from that of the output interdigital transducer.
摘要:
36.degree. -rotated Y-cut X-propagation lithium niobate substrate (LiNbO.sub.3) was used as a piezoelectric substrate to compose a surface acoustic wave filter and is connected with a dielectric filter in series. The dielectric filter having a sign of the frequency temperature characteristic which is opposite to that of the surface acoustic wave filter was used. Accordingly, a high frequency filter, comprising a surface acoustic filter and a dielectric filter connected in series, which can secure sufficient attenuation without an increase in the insertion loss within the band can be provided.
摘要:
The present invention provides surface acoustic wave devices which do not require a balanced-to-unbalanced transformer circuit regardless of the type of the peripheral circuits of the balanced type surface acoustic wave filter, i.e. a balanced type device or an unbalanced type. A transmitting interdigital transducer and a receiving interdigital transducer are formed on a substrate comprising 41.degree. Y cut-X propagation lithium niobate. A balanced type surface acoustic wave filter is formed on a substrate comprising 36.degree. Y cut-X propagation lithium tantalate. The balanced type surface acoustic wave filter comprises two series-arm surface acoustic wave resonators and two crossed-arm surface acoustic wave resonators connected in a lattice. The substrate on which the transmitting interdigital transducer and the receiving interdigital transducer are formed and the substrate on which the balanced type surface acoustic wave filter is formed are located in a ceramic package. One of the input terminals of the transmitting interdigital transducer is grounded. The output terminals of the receiving interdigital transducer are connected to the input terminals of the balanced type surface acoustic wave filter.
摘要:
A surface acoustic wave filter having a configuration in which a plurality of series surface acoustic wave resonators and parallel surface acoustic wave resonators are connected is used as a receiving filter included in a receiving circuit of a communication apparatus capable of simultaneously transmitting and receiving signals. When the transmitting frequency is higher than the receiving frequency, one of the parallel surface acoustic wave resonator, connected between the signal line and the ground, is disposed most closely to the input terminal of the filter. When the transmitting frequency is lower than the receiving frequency, one of the series surface acoustic wave resonator, connected in series to the signal line, is disposed most closely to the input terminal of the filter. Accordingly, the singular point of the filter is prevented from coinciding with the transmitting frequency, so that the deterioration of the resonator is prevented.
摘要:
A resonator ladder type surface acoustic wave filter, has an input electrical terminal, an output electrical terminal, and a grounding terminal being formed on a piezoelectric substrate, a series arm surface acoustic wave resonator and a parallel arm surface acoustic wave resonator, each constructed from an interdigital transducer for exciting a surface acoustic wave, being formed between said input electrical terminal and said output electrical terminal, and when the center frequency of said resonator ladder type surface acoustic wave filter is denoted by fc, and capacitance determined by the number of electrode finger pairs and electrode finger overlap width in said interdigital transducer of said parallel arm surface acoustic wave resonator is denoted by Cp (fc: center frequency [GHz], Cp: capacitance of the interdigital transducer of the parallel arm surface acoustic wave resonator), capacitance C of multiples of said parallel arm surface acoustic wave resonator, connected to the same node between said input electrical terminal and said output electrical terminal, always satisfies the relationfc.multidot.Cp
摘要:
The present invention relates to an electronic part used for mobile communications apparatuses and the like, and more particularly to an electronic part, such as an acoustic surface-wave device, a piezoelectric ceramic device or the like, which requires an oscillation space near the surface of the functional device chip thereof, and a method of production thereof. With this method, a space retainer for forming a sealed space at the functional portion of the chip can be hermetically sealed and have high moisture resistance, and the process of forming the space retainer can be carried out easily.The electronic part of the present invention comprises a functional device chip, a space retainer for forming a sealed space at the functional portion of the chip, a circuit substrate to which the chip is secured, electrode interconnection portions for establishing electric connection between the chip and the circuit substrate, and a sealing resin for covering and sealing at least the space retainer, wherein the space retainer comprises a support layer made of a synthetic resin film, provided with an opening enclosing the functional portion and joined onto the main surface, and a cover formed and joined onto the support layer so as to cover the functional portion and form a sealed space between the cover and the functional portion.
摘要:
The present invention provides surface acoustic wave devices which do not require a balanced-to-unbalanced transformer circuit regardless of the type of the peripheral circuits of the balanced type surface acoustic wave filter, i.e. a balanced type device or an unbalanced type. A transmitting interdigital transducer and a receiving interdigital transducer are formed on a substrate comprising 41.degree. Y cut-X propagation lithium niobate. A balanced type surface acoustic wave filter is formed on a substrate comprising 36.degree. Y cut-X propagation lithium tantalate. The balanced type surface acoustic wave filter comprises two series-arm surface acoustic wave resonators and two crossed-arm surface acoustic wave resonators connected in a lattice. The substrate on which the transmitting interdigital transducer and the receiving interdigital transducer are formed and the substrate on which the balanced type surface acoustic wave filter is formed are located in a ceramic package. One of the input terminals of the transmitting interdigital transducer is grounded. The output terminals of the receiving interdigital transducer are connected to the input terminals of the balanced type surface acoustic wave filter.
摘要:
This invention provides a surface acoustic wave device mounted module which is miniature, light, and highly reliable. The surface acoustic wave device mounted module also has excellent frequency characteristics. The surface acoustic wave device mounted module includes a multilayer substrate which has at least one layer of a shield pattern, input-output electrodes, grounding electrodes, through holes used for connecting electrodes, and a surface acoustic wave element. The surface acoustic wave element has metallic bumps, which are transfer-coated with a conductive resin, on electrode pads and an insulating resin around the surface acoustic wave element. The electrode pads are input-output terminals and grounding terminals formed on the surface acoustic wave element. Continuities between the input-output terminals and the input-output electrodes, and between the grounding terminals and the grounding electrodes are established by the through holes. An electrode pattern is formed on the surface of the multilayer substrate facing and surrounding the surface acoustic wave element. A metallic lid is attached to the electrode pattern by a solder or a conductive resin so that the surface acoustic wave element is sealed in an airtight condition. The electrode pattern is connected to the grounding electrodes by the through holes.
摘要:
The filter circuit is a filter circuit having plural passbands including a first filter having a first passband, and a second filter having a second passband, with their inputs and outputs connected mutually so that these filters are connected in parallel. Inductor elements are connected in series to the terminal of the first filter to which the second filter is connected, and capacitor elements are connected in series to the terminal of the second filter to which the first filter is connected.