Abstract:
Described embodiments provide a device configured to be coupled to a shared bus. The device includes a magnetic field sensing element to sense a magnetic field. Upon receiving a configuration command over the shared bus, the device determines whether a parameter of the sensed magnetic field meets a predetermined criteria. If the parameter of the sensed magnetic field meets the predetermined criteria, the device responds to the configuration command by applying one or more configuration settings. Otherwise, if the parameter of the sensed magnetic field does not meet the predetermined criteria, the device ignores the configuration command.
Abstract:
An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.
Abstract:
Methods and apparatus to provide a magnetic field sensor device including a magnetic sensor element, a die having wafer bumps, wherein the magnetic sensor element is positioned in relation to the die, and conductive leadfingers having respective portions electrically connected to the wafer bumps. In embodiments, the device includes a region about the magnetic sensor element that does not contain electrically conductive material for preventing eddy current flow.
Abstract:
Methods and apparatus to provide an integrated circuit package having a conductive leadframe, a non-conductive die paddle mechanically coupled to the leadframe, and a die disposed on the die paddle and electrically connected to the leadframe. With this arrangement, eddy currents are reduced near the magnetic field transducer to reduce interference with magnetic fields.
Abstract:
In one aspect, a system includes a master component having a communication node; and a plurality of slave components. Each slave component has a bidirectional node. The slave components are configured to each store data in response to a trigger signal received at the bidirectional node from the communication node.
Abstract:
Methods and apparatus to provide an integrated circuit having a magnetic sensing element and fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition. In illustrative embodiments, a fault pin indicates the fault condition.
Abstract:
An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.
Abstract:
Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.
Abstract:
Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.
Abstract:
A pressure sensor includes a chamber comprising a conductive portion and a deformable portion coupled to the conductive portion and susceptible to deformation in response to a pressure differential between an interior of the chamber and an exterior of the chamber; at least one coil responsive to an AC coil drive signal; at least one magnetic field sensing element disposed proximate to the at least one coil and to the conductive portion of the chamber and configured to generate a magnetic field signal in response to a reflected magnetic field generated by the at least one coil and reflected by the conductive portion; and a circuit coupled to the at least one magnetic field sensing element to generate an output signal of the pressure sensor indicative of the pressure differential between the interior of the chamber and the exterior of the chamber in response to the magnetic field signal.