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公开(公告)号：US10709018B2
公开(公告)日：2020-07-07
申请号：US16426443
申请日：2019-05-30
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar Pennathur , Mandar Painaik , Lan Hoang , Meng Chi Lee
Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
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公开(公告)号：US20160270213A1
公开(公告)日：2016-09-15
申请号：US15041033
申请日：2016-02-11
Applicant: APPLE INC.
Inventor： Amir Salehi , Vu T. Vo , Wyeman Chen , Chang Liu , Dennis R. Pyper , Steven Patrick Cardinali , Lan Hoang , Siddharth Nangia , Meng Chi Lee , Takayoshi Katahira
CPC classification number: H05K3/284 , B33Y80/00 , H05K1/0224 , H05K2201/0141 , H05K2201/0715 , H05K2201/10242 , H05K2201/10318 , H05K2201/10969 , H05K2201/2036
Abstract: Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.
Abstract translation: 易于制造的结构，用于将封装或封装在系统级封装模块中，使得模块易于组装，具有薄型，并且具有空间效率。 一个示例可以提供用于SIP模块的容易制造的盖。 这些模块可以通过将盖附接到基板的顶侧来容易地组装。 这些SIP模块可以具有低轮廓，例如当使用凹部的顶部的底部表面中的一个或多个凹部来减小其高度时，其中一个或多个凹部布置成接受一个或多个部件。 这些SIP模块可以通过将盖的边缘放置在基板的边缘附近并且使用侧板或通孔穿过基板来连接盖的镀层来实现空间效率。
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Patent Agency Ranking
公开(公告)号：US20220346228A1
公开(公告)日：2022-10-27
申请号：US17860839
申请日：2022-07-08
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US20210185831A1
公开(公告)日：2021-06-17
申请号：US17160909
申请日：2021-01-28
Applicant: Apple Inc.
Inventor： Maryam Rahimi , Meng Chi Lee , Wyeman Chen , Leilei Zhang , Jason P. Marsh , Lan Hoang , Yashar Abdollahian
Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.
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公开(公告)号：US20210185808A1
公开(公告)日：2021-06-17
申请号：US17184927
申请日：2021-02-25
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US20200084886A1
公开(公告)日：2020-03-12
申请号：US16685846
申请日：2019-11-15
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US10356903B1
公开(公告)日：2019-07-16
申请号：US15939097
申请日：2018-03-28
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar Pennathur , Mandar Painaik , Lan Hoang , Meng Chi Lee
Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
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