公开(公告)号：US09966260B1

公开(公告)日：2018-05-08

申请号：US15232738

申请日：2016-08-09

Applicant: Apple Inc.

Inventor： Clayton Ka Tsun Chan ,  Ion Bita ,  Ranjith Samuel E. John ,  Alfred F. Renaldo ,  Jie Fu ,  Sudirukkuge T. Jinasundera ,  An-Chun Tien

IPC: B32B38/10 ,  H01L21/033 ,  H01L29/861 ,  H01L29/66 ,  H01L21/683 ,  H01L21/268 ,  B29C71/04 ,  B29D11/00

CPC classification number: H01L21/0331 ,  B23K26/0006 ,  B23K26/122 ,  B23K26/18 ,  B23K26/50 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/54 ,  B29C71/04 ,  B29D11/0073 ,  B29D11/0074 ,  H01L21/268 ,  H01L21/6835 ,  H01L21/7813 ,  H01L29/66136 ,  H01L29/861 ,  H01L33/00 ,  H01L2221/6835 ,  H01L2221/68381

Abstract: Laser lift-off methods are described in which optical flatness is provided on the back side of a temporary substrate using either an optical layer or optical liquid. A laser is directed through the optical layer or optical liquid and a back side of the temporary substrate to decompose a portion of a process layer supported on a front side of the temporary substrate, followed by separation of the process layer and the temporary substrate.

公开(公告)号：US09832868B1

公开(公告)日：2017-11-28

申请号：US15071041

申请日：2016-03-15

Applicant: Apple Inc.

Inventor： Derek W. Wright ,  James E. Pedder ,  Soyoung Kim ,  Stephen R. McClure ,  Elmar Gehlen ,  Sudirukkuge T. Jinasundera ,  Tingjun Xu ,  Michael Vosgueritchian ,  Xiaonan Wen ,  Wei Lin ,  Prithu Sharma

IPC: H05K1/09 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  G06F3/041 ,  C25D7/12

CPC classification number: H05K1/0306 ,  C23C18/1653 ,  C25D7/00 ,  C25D7/123 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/09 ,  H05K1/115 ,  H05K1/147 ,  H05K3/002 ,  H05K3/0044 ,  H05K3/4038 ,  H05K3/4061 ,  H05K2201/0108 ,  H05K2201/10128 ,  H05K2203/107

Abstract: An electronic device may have layers of glass for forming components such as a display. A display cover glass layer may overlap an array of pixels. A touch sensor may be formed under the display cover glass layer. Conductive structures such as transparent conductive electrodes or other conductive layers of material may be formed on the outer surface of the display cover glass layer. The electrodes on the outer surface of the display cover glass layer may be coupled to metal contacts and other circuitry on the inner surface of the display cover glass layer using conductive vias. Vias may be provided with barrier layers, opaque coatings, tapers, and other structures and may be formed using techniques that enhance compatibility with chemical strengthening processes.